DE1540090A1 - Elektronisches Stellglied - Google Patents

Elektronisches Stellglied

Info

Publication number
DE1540090A1
DE1540090A1 DE19651540090 DE1540090A DE1540090A1 DE 1540090 A1 DE1540090 A1 DE 1540090A1 DE 19651540090 DE19651540090 DE 19651540090 DE 1540090 A DE1540090 A DE 1540090A DE 1540090 A1 DE1540090 A1 DE 1540090A1
Authority
DE
Germany
Prior art keywords
heat sink
actuator according
semiconductor elements
resistors
following
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19651540090
Other languages
German (de)
English (en)
Inventor
Feldmann Dr-Ing Hans-Helmut
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of DE1540090A1 publication Critical patent/DE1540090A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/082—Cooling, heating or ventilating arrangements using forced fluid flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/22—Elongated resistive element being bent or curved, e.g. sinusoidal, helical
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Electromagnetism (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Control Of Electrical Variables (AREA)
DE19651540090 1965-08-21 1965-08-21 Elektronisches Stellglied Pending DE1540090A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEL0051443 1965-08-21

Publications (1)

Publication Number Publication Date
DE1540090A1 true DE1540090A1 (de) 1970-05-21

Family

ID=7274058

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19651540090 Pending DE1540090A1 (de) 1965-08-21 1965-08-21 Elektronisches Stellglied

Country Status (5)

Country Link
CH (1) CH449751A (fr)
DE (1) DE1540090A1 (fr)
GB (1) GB1161789A (fr)
NL (1) NL6611713A (fr)
SE (1) SE328341B (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0278240A2 (fr) * 1987-02-07 1988-08-17 Behr GmbH & Co. Radiateur, en particulier pour le refroidissement de composants électroniques
DE4105786A1 (de) * 1991-02-23 1992-08-27 Abb Patent Gmbh Anordnung mit fluessigkeitsgekuehltem, elektrischem leistungswiderstand und verfahren zu ihrer herstellung

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2525392A1 (fr) * 1982-04-19 1983-10-21 Inst Elektrodinamiki Akademii Transistor de puissance du type comportant un nombre n de structures fonctionnelles branchees en parallele
CA2698428C (fr) * 2007-08-16 2017-05-30 Radian Research, Inc. Appareil et procede pour tester un transformateur d'instruments
DE102011003572A1 (de) * 2011-02-03 2012-08-09 Robert Bosch Gmbh Pulswechselrichter mit gekühltem Shunt-Widerstand und elektrisches Antriebssystem mit Pulswechselrichter mit gekühltem Shunt-Widerstand

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0278240A2 (fr) * 1987-02-07 1988-08-17 Behr GmbH & Co. Radiateur, en particulier pour le refroidissement de composants électroniques
EP0278240A3 (fr) * 1987-02-07 1990-01-31 Behr GmbH & Co. Radiateur, en particulier pour le refroidissement de composants électroniques
DE4105786A1 (de) * 1991-02-23 1992-08-27 Abb Patent Gmbh Anordnung mit fluessigkeitsgekuehltem, elektrischem leistungswiderstand und verfahren zu ihrer herstellung

Also Published As

Publication number Publication date
GB1161789A (en) 1969-08-20
CH449751A (de) 1968-01-15
NL6611713A (fr) 1967-02-22
SE328341B (fr) 1970-09-14

Similar Documents

Publication Publication Date Title
DE69428070T2 (de) Verfahren zur Herstellung einer sehr dicken Dickschicht zur Kontrolle der thermischen und stromführenden Eigenschaften von Hybridschaltungen
DE102009029476B4 (de) Elektronische Vorrichtung zum Schalten von Strömen und Herstellungsverfahren für dieselbe
DE102015110653A1 (de) Doppelseitiges Kühl-Chipgehäuse und Verfahren zum Herstellen desselben
DE112007001364T5 (de) Wärmewiderstand sowie Halbleitereinrichtung und elektrische Einrichtung mit einem derartigen Wärmewiderstand
DE102015102083B4 (de) Komplexe Schutzvorrichtung
DE202018103875U1 (de) Transformator mit Kühlung
DE2555441A1 (de) Widerstands-vergleichsstellen-kompensator
DE112018002547B4 (de) Schaltungsvorrichtung
DE1540090A1 (de) Elektronisches Stellglied
DE112009004661T5 (de) Stromversorgungsvorrichtung
DE2263420A1 (de) Vorrichtung zur aufrechterhaltung einer konstanten umgebungstemperatur in einer anlage
DE10022341A1 (de) Elektronisches Leistungsmodul
EP3117458B1 (fr) Agencement de composants électriques
DE19848823A1 (de) NTC-Thermistor
DE112019002877T5 (de) Hochfrequenz- und Hochleistungsdünnschichtkomponente
DE102014103513B4 (de) Schaltungsanordnung und verfahren zum betreiben eines analog-digital-wandlers
EP0086483B1 (fr) Arrangement de redresseur de puissance
EP4163942B1 (fr) Module
DE2855265A1 (de) Thyristor
DE102019210192A1 (de) Kühlung von elektrischen Bauelementen
DE102019206811A1 (de) Leistungshalbleiterbauelement mit darin angeordneten Leistungstransistoren
EP0639840B1 (fr) Assemblage à pression pour convertisseur
DE1930068U (de) Baueinheit fuer ein elektronisches stellglied.
DE102017105351A1 (de) Leistungshalbleitermodul mit Leistungshalbleiterbauelementen und einem Kondensator
DE202014002028U1 (de) Elektrische Bauteilanordnung