GB1159456A - Improvements in and relating to Methods and Apparatus for Testing Bonded Joints - Google Patents

Improvements in and relating to Methods and Apparatus for Testing Bonded Joints

Info

Publication number
GB1159456A
GB1159456A GB50092/66A GB5009266A GB1159456A GB 1159456 A GB1159456 A GB 1159456A GB 50092/66 A GB50092/66 A GB 50092/66A GB 5009266 A GB5009266 A GB 5009266A GB 1159456 A GB1159456 A GB 1159456A
Authority
GB
United Kingdom
Prior art keywords
modules
firing
module
sticks
blast
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB50092/66A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US507848A external-priority patent/US3413839A/en
Priority claimed from US544993A external-priority patent/US3371780A/en
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1159456A publication Critical patent/GB1159456A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/20—Investigating the presence of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/52—Testing for short-circuits, leakage current or ground faults
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/54—Testing for continuity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Relating To Insulation (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
GB50092/66A 1965-11-15 1968-11-09 Improvements in and relating to Methods and Apparatus for Testing Bonded Joints Expired GB1159456A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US50783365A 1965-11-15 1965-11-15
US507848A US3413839A (en) 1965-11-15 1965-11-15 Method of and apparatus for mechanically testing the quality of bonded joints
US544993A US3371780A (en) 1966-04-25 1966-04-25 Apparatus for mechanically and electrically testing the quality of bonded joints

Publications (1)

Publication Number Publication Date
GB1159456A true GB1159456A (en) 1969-07-23

Family

ID=27414359

Family Applications (1)

Application Number Title Priority Date Filing Date
GB50092/66A Expired GB1159456A (en) 1965-11-15 1968-11-09 Improvements in and relating to Methods and Apparatus for Testing Bonded Joints

Country Status (5)

Country Link
BE (1) BE689412A (enrdf_load_stackoverflow)
CH (1) CH470671A (enrdf_load_stackoverflow)
FR (1) FR1498864A (enrdf_load_stackoverflow)
GB (1) GB1159456A (enrdf_load_stackoverflow)
SE (1) SE331716B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118707160A (zh) * 2024-08-30 2024-09-27 南通众博信智能科技有限公司 一种pcb线路板的测试固定夹具

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3852665A (en) * 1972-02-17 1974-12-03 Bunker Ramo Apparatus for testing potentiometers
FR2471601A1 (fr) * 1979-12-14 1981-06-19 Commissariat Energie Atomique Procede et dispositif de controle non destructif des soudures par points
US5349869A (en) * 1993-04-05 1994-09-27 General Electric Company Welded nickel alloy double-cantilever beam crack growth sensor and method for its fabrication
CN111398790B (zh) * 2020-04-29 2024-09-13 苏州创瑞机电科技有限公司 光学芯片模组测试装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118707160A (zh) * 2024-08-30 2024-09-27 南通众博信智能科技有限公司 一种pcb线路板的测试固定夹具

Also Published As

Publication number Publication date
FR1498864A (fr) 1967-10-20
BE689412A (enrdf_load_stackoverflow) 1967-04-14
CH470671A (de) 1969-05-14
DE1640492B1 (de) 1971-02-04
SE331716B (enrdf_load_stackoverflow) 1971-01-11

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee