GB1157746A - A Power Rectifying Device for Very High Tensions - Google Patents
A Power Rectifying Device for Very High TensionsInfo
- Publication number
- GB1157746A GB1157746A GB3156/67A GB315667A GB1157746A GB 1157746 A GB1157746 A GB 1157746A GB 3156/67 A GB3156/67 A GB 3156/67A GB 315667 A GB315667 A GB 315667A GB 1157746 A GB1157746 A GB 1157746A
- Authority
- GB
- United Kingdom
- Prior art keywords
- exchangers
- cylinder
- jan
- semi
- heat exchangers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 239000012809 cooling fluid Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR47870A FR1473250A (fr) | 1966-01-31 | 1966-01-31 | Dispositif redresseur de puissance pour très haute tension |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1157746A true GB1157746A (en) | 1969-07-09 |
Family
ID=8600187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3156/67A Expired GB1157746A (en) | 1966-01-31 | 1967-01-20 | A Power Rectifying Device for Very High Tensions |
Country Status (8)
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2210201A (en) * | 1987-12-17 | 1989-06-01 | Magneti Marelli Spa | Heat dissipator for a rectifier bridge |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3593186A (en) * | 1969-02-18 | 1971-07-13 | Raytheon Co | Thermal dissipation in semiconductor device arrays |
| JPS513047B1 (US20100056889A1-20100304-C00004.png) * | 1969-11-05 | 1976-01-30 | ||
| JPS5122610B1 (US20100056889A1-20100304-C00004.png) * | 1970-08-12 | 1976-07-10 | ||
| US4160992A (en) * | 1977-09-14 | 1979-07-10 | Raytheon Company | Plural semiconductor devices mounted between plural heat sinks |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE543787A (US20100056889A1-20100304-C00004.png) * | 1954-12-21 | |||
| US3234451A (en) * | 1962-01-05 | 1966-02-08 | Int Rectifier Corp | High power rectifier structure |
| US3293508A (en) * | 1964-04-21 | 1966-12-20 | Int Rectifier Corp | Compression connected semiconductor device |
| US3319136A (en) * | 1964-09-08 | 1967-05-09 | Dunlee Corp | Rectifier |
| US3373335A (en) * | 1964-12-22 | 1968-03-12 | Electronic Devices Inc | Stacked assembly of rectifier units incorporating shunt capacitors |
| US3333163A (en) * | 1965-02-15 | 1967-07-25 | Int Rectifier Corp | Rectifier assembly with interconnecting bus-bar supports |
-
1966
- 1966-01-31 FR FR47870A patent/FR1473250A/fr not_active Expired
-
1967
- 1967-01-12 DE DE19671589564 patent/DE1589564A1/de active Pending
- 1967-01-20 GB GB3156/67A patent/GB1157746A/en not_active Expired
- 1967-01-23 BE BE693046D patent/BE693046A/xx unknown
- 1967-01-26 NL NL6701244A patent/NL6701244A/xx unknown
- 1967-01-26 LU LU52890D patent/LU52890A1/xx unknown
- 1967-01-30 CH CH143167A patent/CH456757A/fr unknown
- 1967-01-31 US US612930A patent/US3469171A/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2210201A (en) * | 1987-12-17 | 1989-06-01 | Magneti Marelli Spa | Heat dissipator for a rectifier bridge |
| GB2210201B (en) * | 1987-12-17 | 1991-12-11 | Magneti Marelli Spa | A dissipator for the rectifier bridge of an electrical generator particularly for motor vehicles |
Also Published As
| Publication number | Publication date |
|---|---|
| FR1473250A (fr) | 1967-03-17 |
| CH456757A (fr) | 1968-07-31 |
| US3469171A (en) | 1969-09-23 |
| BE693046A (US20100056889A1-20100304-C00004.png) | 1967-07-24 |
| LU52890A1 (US20100056889A1-20100304-C00004.png) | 1968-08-28 |
| DE1589564A1 (de) | 1970-05-14 |
| NL6701244A (US20100056889A1-20100304-C00004.png) | 1967-08-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |