GB1134565A - An electric circuit assembly - Google Patents
An electric circuit assemblyInfo
- Publication number
- GB1134565A GB1134565A GB472766A GB472766A GB1134565A GB 1134565 A GB1134565 A GB 1134565A GB 472766 A GB472766 A GB 472766A GB 472766 A GB472766 A GB 472766A GB 1134565 A GB1134565 A GB 1134565A
- Authority
- GB
- United Kingdom
- Prior art keywords
- posts
- support
- leads
- apertures
- electrically conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/26—Pin or blade contacts for sliding co-operation on one side only
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
1,134,565. Two-part-couplings. AMP Inc. 19 Jan., 1967 [3 Feb., 1966; 14 Sept., 1966], Nos. 4727/66 and 40988/66. Heading H2E. [Also in Division H1] As shown, Fig. 4, leads from an electrical component (for instance a modular pack 1, 2 containing resistors, capacitors, transistors) pass through tapered apertures 6 in an insulating support 4 and are wedged therein by electrically conductive connecting posts 14 (Fig. 3) which may be carried by an insulating member 11 releasably secured to the support. The leads end portions 9 are bent under the support 4 to secure the component thereto, and are urged against the support by the member 11. The portions of the posts which are in the apertures may. be longitudinally slotted to render them laterally resilient, also the apertures have longitudinally extending arcuate section ribs 7 to resiliently urge the posts against the leads. Further leads may be connected to the posts by electrically conductive clips (not shown), or by wrapping them around the posts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB472766A GB1134565A (en) | 1966-02-03 | 1966-02-03 | An electric circuit assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB472766A GB1134565A (en) | 1966-02-03 | 1966-02-03 | An electric circuit assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1134565A true GB1134565A (en) | 1968-11-27 |
Family
ID=9782650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB472766A Expired GB1134565A (en) | 1966-02-03 | 1966-02-03 | An electric circuit assembly |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1134565A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0070120A1 (en) * | 1981-07-02 | 1983-01-19 | Thomas & Betts Corporation | Dual-in-line package assembly |
EP0235925A2 (en) * | 1986-03-03 | 1987-09-09 | General Motors Corporation | Surface-mountable package for encapsulated tap-automated-bonded integrated circuit modules |
-
1966
- 1966-02-03 GB GB472766A patent/GB1134565A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0070120A1 (en) * | 1981-07-02 | 1983-01-19 | Thomas & Betts Corporation | Dual-in-line package assembly |
EP0235925A2 (en) * | 1986-03-03 | 1987-09-09 | General Motors Corporation | Surface-mountable package for encapsulated tap-automated-bonded integrated circuit modules |
EP0235925A3 (en) * | 1986-03-03 | 1989-03-08 | General Motors Corporation | Surface-mountable package for encapsulated tap-automated-bonded integrated circuit modules |
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