GB1104100A - Making electrical cables and the like - Google Patents
Making electrical cables and the likeInfo
- Publication number
- GB1104100A GB1104100A GB1112365A GB1112365A GB1104100A GB 1104100 A GB1104100 A GB 1104100A GB 1112365 A GB1112365 A GB 1112365A GB 1112365 A GB1112365 A GB 1112365A GB 1104100 A GB1104100 A GB 1104100A
- Authority
- GB
- United Kingdom
- Prior art keywords
- foil
- resin
- tank
- coated
- resin solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/06—Insulating conductors or cables
- H01B13/16—Insulating conductors or cables by passing through or dipping in a liquid bath; by spraying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0838—Parallel wires, sandwiched between two insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Insulating Materials (AREA)
- Insulated Conductors (AREA)
Abstract
1,104,100. Flat cables; printed circuits. ROGERS CORPORATION. 16 March, 1963 [16 March, 1964], No. 11123/65. Headings H1A and H1R. A flat flexible multiple conductor cable is produced continuously by etching metal foil supported on an insulating resin film to form a plurality of parallel conductors and superimposing on the exposed conductors another insulating film. As shown in Fig. 1, copper foil 15 is kiss-coated on one side by contact with drum 17 which is partially submerged in resin solution in tank 10 and the coated foil heated in tower 19 to evaporate solvent and to cure the resin. Parallel strips of etch resist are deposited at 20 by e.g. silk screening or photoprinting and the unmasked metal removed in etching bath 20 containing, e.g. hot ferric chloride. The resist is removed by trichloroethylene in tank 13 and the foil, water-washed in tank 14, is passed through resin solution in tank 11, solvent is removed and the resin cured in heated tower 23. Alternatively, as illustrated by Fig. 3 (not shown), the foil is coated on both sides with resin solution and the cured resin stripped from one side which has been initially treated with a release agent. After etching, a preformed film, which may be that removed previously, is coated on one side with an adhesive such as a phenolic nitrile and contacted with the exposed conductor surfaces between heated pressure rolls. The flexible resinous material is preferably an aromatic polyimide, particularly a polyamide-imide as described in Specification 935,388, in which case the resin solution may be a polyamic acid precurser. Films of polyester, polyethylene, polyvinylidene fluoride, polyvinylidene chloride, PVC, polycarbonate, P.T.F.E. and P.C.T.F.E. may be used. Other suitable etchants are ammonium persulphate and nitric acid or, in the case of an aluminium foil, 50% H 2 SO 4 or concentrated HCl.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US35215464A | 1964-03-16 | 1964-03-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1104100A true GB1104100A (en) | 1968-02-21 |
Family
ID=23384007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1112365A Expired GB1104100A (en) | 1964-03-16 | 1965-03-16 | Making electrical cables and the like |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE1590975A1 (en) |
FR (1) | FR1443941A (en) |
GB (1) | GB1104100A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999029149A1 (en) * | 1997-11-28 | 1999-06-10 | Resco S.R.L. | Method and machine for producing flexible and semirigid printed-circuit boards |
GB2488150A (en) * | 2011-02-17 | 2012-08-22 | Andrew Ian Briggs | EMI screen with isolated conductive elements on or in a lossy dielectric substrate |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH541216A (en) * | 1972-06-16 | 1973-08-31 | Alusuisse | Process for the production of insulated electrical conductors, in particular strip-shaped multiple conductors |
WO2011141764A1 (en) * | 2010-05-12 | 2011-11-17 | Fci | Method of manufacture of flexible printed circuits |
-
1965
- 1965-03-15 FR FR9263A patent/FR1443941A/en not_active Expired
- 1965-03-16 DE DE1965W0038773 patent/DE1590975A1/en active Pending
- 1965-03-16 GB GB1112365A patent/GB1104100A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999029149A1 (en) * | 1997-11-28 | 1999-06-10 | Resco S.R.L. | Method and machine for producing flexible and semirigid printed-circuit boards |
GB2488150A (en) * | 2011-02-17 | 2012-08-22 | Andrew Ian Briggs | EMI screen with isolated conductive elements on or in a lossy dielectric substrate |
GB2488150B (en) * | 2011-02-17 | 2014-01-08 | Andrew Ian Briggs | Method and design for screening or reducing electromagnetic emmisions from electrical or electromagnetic devices |
Also Published As
Publication number | Publication date |
---|---|
DE1590975A1 (en) | 1970-06-04 |
FR1443941A (en) | 1966-07-01 |
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