GB1100718A - Method of producing an electrical connection to a surface of an electronic device - Google Patents

Method of producing an electrical connection to a surface of an electronic device

Info

Publication number
GB1100718A
GB1100718A GB5010/66A GB501066A GB1100718A GB 1100718 A GB1100718 A GB 1100718A GB 5010/66 A GB5010/66 A GB 5010/66A GB 501066 A GB501066 A GB 501066A GB 1100718 A GB1100718 A GB 1100718A
Authority
GB
United Kingdom
Prior art keywords
layer
wafer
electrode
bumps
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5010/66A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of GB1100718A publication Critical patent/GB1100718A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/244—Dispositions, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
GB5010/66A 1965-03-01 1966-02-04 Method of producing an electrical connection to a surface of an electronic device Expired GB1100718A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US43591865A 1965-03-01 1965-03-01
US511780A US3408271A (en) 1965-03-01 1965-12-06 Electrolytic plating of metal bump contacts to semiconductor devices upon nonconductive substrates

Publications (1)

Publication Number Publication Date
GB1100718A true GB1100718A (en) 1968-01-24

Family

ID=27030742

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5010/66A Expired GB1100718A (en) 1965-03-01 1966-02-04 Method of producing an electrical connection to a surface of an electronic device

Country Status (5)

Country Link
US (1) US3408271A (enExample)
DE (1) DE1564066B2 (enExample)
GB (1) GB1100718A (enExample)
NL (1) NL6602549A (enExample)
SE (1) SE316238B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1175667A (en) * 1966-04-07 1969-12-23 Associated Semiconductor Mft Improvements in the Electrodeposition of Metals using a Composite Mask
US3484341A (en) * 1966-09-07 1969-12-16 Itt Electroplated contacts for semiconductor devices
NL6701136A (enExample) * 1967-01-25 1968-07-26
US3623961A (en) * 1968-01-12 1971-11-30 Philips Corp Method of providing an electric connection to a surface of an electronic device and device obtained by said method
US3625837A (en) * 1969-09-18 1971-12-07 Singer Co Electroplating solder-bump connectors on microcircuits
GB1337283A (en) * 1969-12-26 1973-11-14 Hitachi Ltd Method of manufacturing a semiconductor device
US4113578A (en) * 1973-05-31 1978-09-12 Honeywell Inc. Microcircuit device metallization
US4011143A (en) * 1973-06-25 1977-03-08 Honeywell Inc. Material deposition masking for microcircuit structures
US3987226A (en) * 1974-11-27 1976-10-19 The Bendix Corporation Face plate for an acoustical optical image tube
JPH03142934A (ja) * 1989-10-30 1991-06-18 Mitsubishi Electric Corp 半導体集積回路装置の配線接続構造

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2834723A (en) * 1953-12-31 1958-05-13 Northern Engraving & Mfg Co Method of electroplating printed circuits
US2861029A (en) * 1955-12-14 1958-11-18 Western Electric Co Methods of making printed wiring circuits
US3253320A (en) * 1959-02-25 1966-05-31 Transitron Electronic Corp Method of making semi-conductor devices with plated area
US3208921A (en) * 1962-01-02 1965-09-28 Sperry Rand Corp Method for making printed circuit boards
BE627303A (enExample) * 1962-01-19 1900-01-01

Also Published As

Publication number Publication date
US3408271A (en) 1968-10-29
NL6602549A (enExample) 1966-09-02
SE316238B (enExample) 1969-10-20
DE1564066A1 (de) 1970-01-15
DE1564066B2 (de) 1974-07-04

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