GB1091206A - Improvements in the bonding of polyester fibrous material to rubber - Google Patents

Abstract

A composition suitable for use in the bonding of polyester fibres to rubber comprises an aqueous dispersion of a solution in an organic solvent of a partial reaction product of a polyamide and an epoxy resin. The reactive polyamide is any polyamide having reactive amine groups spaced along the polyamide chain which result in an amine value of 80-350, the amine value being defined as the number of milligrams of sodium hydroxide equivalent to the base content of 1 gram of polyamide as determined by titration with hydrochloric acid. The epoxy resins used are glycidyl ethers of di- or polyhydroxy compounds, e.g. bis - phenols, Novolac resins and glycerol. The organic solvent may be an alcohol, ketone, aldehyde, ethylene glycol monoethyl ether, epichlorhydrin or an unsaturated olefinic epoxide. The composition may be prepared without the use of an emulsifying or dispersing agent although one may be added. The composition may also contain an aldehyde, e.g. furfural and formalin, and a polyvinyl chloride emulsion.ALSO:The adhesion of fibrous materials, e.g. filaments and fibres, made from polyesters derived from aromatic dicarboxylic acids, e.g. terephthalic acid and bis 4:4-carboxy phenoxythane, and a glycol, e.g. of the formula OH(CH2)nOH in which n is a whole number of 2-10, or 1,4-di(hydroxy methyl) cyclohexane, to rubber is improved by applying to them a first dip comprising an aqueous dispersion of a solution in an organic solvent of a reactive polyamide and an epoxy resin, and then a second dip comprising a resorcinol-formaldehyde-terpolymer of butadiene, styrene and vinyl pyridine latex aqueous dispersion. The reactive polyamide used is any polyamide having reactive amine groups spaced along the polyamide chain which result in an amine value of 80-350, the amine value being defined as the number of milligrams of sodium hydroxide equivalent to the base content of 1 gram of polyamide as determined by titration with hydrochloric acid. The epoxy resins used are glycidyl ethers of di or polyhydroxy compounds, e.g. bis-phenols, Novolac resins and glycerol. The organic solvent may be an alcohol, ketone, aldehyde, ethylene glycol monoethyl ether, epichlorhydrin or an unsaturated olefinic epoxide. The first dip may be prepared without the use of an emulsifying or dispersing agent although one may be added. After the first dip the fibrous materials may be dried and cured at 180 DEG -260 DEG C for 10-100 seconds. The second dip may be prepared by the addition of a terpolymer of butadiene, styrene and vinyl pyridine to a resorcinolformaldehyde condensate, dissolved in water. The first dip may also contain an aldehyde, e.g. furfural and formalin, and a polyvinyl chloride emulsion.