GB1071130A - Improvements in or relating to the mounting of semi-conductor components - Google Patents

Improvements in or relating to the mounting of semi-conductor components

Info

Publication number
GB1071130A
GB1071130A GB35120/65A GB3512065A GB1071130A GB 1071130 A GB1071130 A GB 1071130A GB 35120/65 A GB35120/65 A GB 35120/65A GB 3512065 A GB3512065 A GB 3512065A GB 1071130 A GB1071130 A GB 1071130A
Authority
GB
United Kingdom
Prior art keywords
semi
metal
heat sink
adhesive
aug
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB35120/65A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB1071130A publication Critical patent/GB1071130A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ignition Installations For Internal Combustion Engines (AREA)
GB35120/65A 1964-08-27 1965-08-17 Improvements in or relating to the mounting of semi-conductor components Expired GB1071130A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1964B0078288 DE1281582C2 (de) 1964-08-27 1964-08-27 Anordnung eines in einer elektrisch leitfaehigen kapsel untergebrachten halbleiterbauelementes an einem zu seiner halterung und waermeableitung dienenden bauteil

Publications (1)

Publication Number Publication Date
GB1071130A true GB1071130A (en) 1967-06-07

Family

ID=6979811

Family Applications (1)

Application Number Title Priority Date Filing Date
GB35120/65A Expired GB1071130A (en) 1964-08-27 1965-08-17 Improvements in or relating to the mounting of semi-conductor components

Country Status (6)

Country Link
US (1) US3325582A (cg-RX-API-DMAC7.html)
AT (1) AT259627B (cg-RX-API-DMAC7.html)
CH (1) CH423998A (cg-RX-API-DMAC7.html)
DE (1) DE1281582C2 (cg-RX-API-DMAC7.html)
GB (1) GB1071130A (cg-RX-API-DMAC7.html)
NL (1) NL6511150A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2196472A (en) * 1986-05-02 1988-04-27 Trw Transport Elect Ltd Improvements relating to adhesive mountings

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3737728A (en) * 1971-12-17 1973-06-05 Data General Corp Mounting structure for heat-generating devices
DE2951296A1 (de) * 1979-12-20 1981-06-25 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Isolierkoerper
US4295151A (en) * 1980-01-14 1981-10-13 Rca Corporation Method of bonding two parts together and article produced thereby
US4363076A (en) * 1980-12-29 1982-12-07 Honeywell Information Systems Inc. Integrated circuit package
US4437235A (en) 1980-12-29 1984-03-20 Honeywell Information Systems Inc. Integrated circuit package
US4381602A (en) * 1980-12-29 1983-05-03 Honeywell Information Systems Inc. Method of mounting an I.C. chip on a substrate
US4421161A (en) * 1982-05-06 1983-12-20 Burroughs Corporation Heat exchanger for integrated circuit packages
US4602125A (en) * 1985-05-10 1986-07-22 The Bergquist Company Mounting pad with tubular projections for solid-state devices
US6090484A (en) * 1995-05-19 2000-07-18 The Bergquist Company Thermally conductive filled polymer composites for mounting electronic devices and method of application
US5679457A (en) * 1995-05-19 1997-10-21 The Bergquist Company Thermally conductive interface for electronic devices
US20030161105A1 (en) * 2001-10-04 2003-08-28 Vijay Kataria Thermal dissipation assembly for electronic components
US6804118B2 (en) * 2002-03-15 2004-10-12 Delphi Technologies, Inc. Thermal dissipation assembly for electronic components
DE102004037610B3 (de) * 2004-08-03 2006-03-16 Infineon Technologies Ag Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung
DE102013218826A1 (de) * 2013-09-19 2015-03-19 Siemens Aktiengesellschaft Kühlkörper

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL110715C (cg-RX-API-DMAC7.html) * 1954-12-16 1900-01-01
DE1041601B (de) * 1957-07-12 1958-10-23 Standard Elektrik Lorenz Ag Selengleichrichterelement mit Druckauffangschicht und Verfahren zu dessen Herstellung
FR1206000A (fr) * 1958-04-29 1960-02-05 Silec Liaisons Elec Ailette de refroidissement
CH380712A (de) * 1959-08-13 1964-08-15 Lonza Ag Verfahren zur Herstellung von Acetessigsäureestern

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2196472A (en) * 1986-05-02 1988-04-27 Trw Transport Elect Ltd Improvements relating to adhesive mountings

Also Published As

Publication number Publication date
AT259627B (de) 1968-01-25
DE1281582C2 (de) 1975-02-20
US3325582A (en) 1967-06-13
DE1281582B (de) 1968-10-31
NL6511150A (cg-RX-API-DMAC7.html) 1966-02-28
CH423998A (de) 1966-11-15

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