GB1039508A - Liquid-cooled semiconductor assembly - Google Patents

Liquid-cooled semiconductor assembly

Info

Publication number
GB1039508A
GB1039508A GB2562665A GB2562665A GB1039508A GB 1039508 A GB1039508 A GB 1039508A GB 2562665 A GB2562665 A GB 2562665A GB 2562665 A GB2562665 A GB 2562665A GB 1039508 A GB1039508 A GB 1039508A
Authority
GB
United Kingdom
Prior art keywords
container
cooling
semi
liquid
radiators
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2562665A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
BBC Brown Boveri France SA
Original Assignee
Brown Boveri und Cie AG Switzerland
BBC Brown Boveri France SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brown Boveri und Cie AG Switzerland, BBC Brown Boveri France SA filed Critical Brown Boveri und Cie AG Switzerland
Publication of GB1039508A publication Critical patent/GB1039508A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

1,039,508. Cooling systems for semi-conductor devices. BROWN, BOVERI & CO. Ltd. June 17, 1965 [June 19, 1964], No. 25626/65. Heading H1K. A plurality of semi-conductor elements having cooling means are mounted in an electrically insulating plate which forms at least one side of a conductive container in which container a cooling liquid flows around the cooling means. In Fig. 2, a conductive container 1 has a face-plate 2 of non-conductive material which has set therein semi-conductor devices 4 each of which has a series of fins projecting into the container 1, the fins being covered with an insulating coating. The container is filled with a cooling fluid which can flow into radiators 5 and be air-cooled therein. The radiators may be replaced by a forced circulation cooling system.
GB2562665A 1964-06-19 1965-06-17 Liquid-cooled semiconductor assembly Expired GB1039508A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH806464A CH414871A (en) 1964-06-19 1964-06-19 Cooling arrangement with liquid cooling of semiconductor elements

Publications (1)

Publication Number Publication Date
GB1039508A true GB1039508A (en) 1966-08-17

Family

ID=4334568

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2562665A Expired GB1039508A (en) 1964-06-19 1965-06-17 Liquid-cooled semiconductor assembly

Country Status (3)

Country Link
CH (1) CH414871A (en)
DE (2) DE1286218B (en)
GB (1) GB1039508A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2500215A1 (en) * 1981-02-13 1982-08-20 Thomson Csf Heat sink for encapsulated power semiconductor device - has finned high thermal conductivity base plate with cover, channels and deflector for coolant circulation
DE3937130A1 (en) * 1989-11-08 1990-05-31 Asea Brown Boveri Box-type cooler - for power semiconductor modules insulated by layer of specified plastic material
DE102019213956A1 (en) * 2019-09-12 2020-12-24 Vitesco Technologies GmbH (Power) electronics arrangement with efficient cooling

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2927250A (en) * 1960-03-01 Cooling arrangement for semi-conductor rectifiers
DE974229C (en) * 1952-07-18 1960-10-27 Licentia Gmbh Dry rectifier encapsulated with cast resin, especially selenium rectifier
DE1138480B (en) * 1955-08-09 1962-10-25 Siemens Ag Method for producing a dry rectifier arrangement and dry rectifier arrangement produced according to this method
DE1062822B (en) * 1957-04-20 1959-08-06 Licentia Gmbh Dry rectifier unit for dry rectifier high load capacity
DE1893188U (en) * 1964-01-15 1964-05-21 Bbc Brown Boveri & Cie DEVICE FOR THE FORCED COOLING OF SEMI-CONDUCTOR COMPONENTS.

Also Published As

Publication number Publication date
CH414871A (en) 1966-06-15
DE1286218B (en) 1969-01-02
DE6606206U (en) 1970-09-10

Similar Documents

Publication Publication Date Title
GB1403269A (en) Component cooling systems
NL157456B (en) SEMI-CONDUCTOR DEVICE IN AN INSULATING PLASTIC COVER.
GB1116397A (en) Rectifier assemblies comprising semi-conductor elements
GB1120926A (en) Heat sink for semi-conductor elements
GB1218852A (en) High voltage thyristor equipment
GB1393666A (en) Heat dissipation for power integrated circuit devices
GB1172332A (en) Improvements in or relating to Heat Dissipating Devices for Semiconductors and the like
GB1353529A (en) Semiconductor rectifier assemblies
CH446536A (en) Semiconductor component arrangement with pressure contacts between the semiconductor element, housing and cooling plates
GB1133817A (en) Improvements in or relating to fuse cartridges
GB1039508A (en) Liquid-cooled semiconductor assembly
NL6511150A (en)
GB1065977A (en) Cooling arrangement for electronic devices
GB1018623A (en) Improvements in or relating to electronic assemblies
GB1086003A (en) Mounting arrangements for electronic devices
GB1258639A (en)
GB1033813A (en) Electrical semiconductor device
US2915685A (en) Dry rectifier assembly and housing therefor
GB1108679A (en) Magnetohydrodynamic (mhd) device
GB1415414A (en) Expandible pressure mounted semiconductor assembly
GB1109597A (en) Semi-conductor assemblies
US2992406A (en) Pump
GB1001110A (en) High voltage rectifier systems
GB1296578A (en)
GB1172471A (en) Semiconductor Rectifier and Semiconductor Rectifier unit based thereon