CH414871A - Cooling arrangement with liquid cooling of semiconductor elements - Google Patents

Cooling arrangement with liquid cooling of semiconductor elements

Info

Publication number
CH414871A
CH414871A CH806464A CH806464A CH414871A CH 414871 A CH414871 A CH 414871A CH 806464 A CH806464 A CH 806464A CH 806464 A CH806464 A CH 806464A CH 414871 A CH414871 A CH 414871A
Authority
CH
Switzerland
Prior art keywords
cooling
semiconductor elements
arrangement
liquid
liquid cooling
Prior art date
Application number
CH806464A
Other languages
German (de)
Inventor
Spatny Walter
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH806464A priority Critical patent/CH414871A/en
Priority to DE19646606206 priority patent/DE6606206U/en
Priority to DE1964A0046727 priority patent/DE1286218B/en
Priority to GB2562665A priority patent/GB1039508A/en
Priority to FR21176A priority patent/FR1437208A/en
Publication of CH414871A publication Critical patent/CH414871A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CH806464A 1964-06-19 1964-06-19 Cooling arrangement with liquid cooling of semiconductor elements CH414871A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CH806464A CH414871A (en) 1964-06-19 1964-06-19 Cooling arrangement with liquid cooling of semiconductor elements
DE19646606206 DE6606206U (en) 1964-06-19 1964-07-30 SEMI-WORKER ARRANGEMENT WITH LIQUID COOLING.
DE1964A0046727 DE1286218B (en) 1964-06-19 1964-07-30 Method for fastening semiconductor components in an electrically insulating plate
GB2562665A GB1039508A (en) 1964-06-19 1965-06-17 Liquid-cooled semiconductor assembly
FR21176A FR1437208A (en) 1964-06-19 1965-06-17 Semiconductor device with liquid cooling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH806464A CH414871A (en) 1964-06-19 1964-06-19 Cooling arrangement with liquid cooling of semiconductor elements

Publications (1)

Publication Number Publication Date
CH414871A true CH414871A (en) 1966-06-15

Family

ID=4334568

Family Applications (1)

Application Number Title Priority Date Filing Date
CH806464A CH414871A (en) 1964-06-19 1964-06-19 Cooling arrangement with liquid cooling of semiconductor elements

Country Status (3)

Country Link
CH (1) CH414871A (en)
DE (2) DE1286218B (en)
GB (1) GB1039508A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2500215A1 (en) * 1981-02-13 1982-08-20 Thomson Csf Heat sink for encapsulated power semiconductor device - has finned high thermal conductivity base plate with cover, channels and deflector for coolant circulation

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3937130A1 (en) * 1989-11-08 1990-05-31 Asea Brown Boveri Box-type cooler - for power semiconductor modules insulated by layer of specified plastic material
DE102019213956A1 (en) * 2019-09-12 2020-12-24 Vitesco Technologies GmbH (Power) electronics arrangement with efficient cooling

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2927250A (en) * 1960-03-01 Cooling arrangement for semi-conductor rectifiers
DE974229C (en) * 1952-07-18 1960-10-27 Licentia Gmbh Dry rectifier encapsulated with cast resin, especially selenium rectifier
DE1138480B (en) * 1955-08-09 1962-10-25 Siemens Ag Method for producing a dry rectifier arrangement and dry rectifier arrangement produced according to this method
DE1062822B (en) * 1957-04-20 1959-08-06 Licentia Gmbh Dry rectifier unit for dry rectifier high load capacity
DE1893188U (en) * 1964-01-15 1964-05-21 Bbc Brown Boveri & Cie DEVICE FOR THE FORCED COOLING OF SEMI-CONDUCTOR COMPONENTS.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2500215A1 (en) * 1981-02-13 1982-08-20 Thomson Csf Heat sink for encapsulated power semiconductor device - has finned high thermal conductivity base plate with cover, channels and deflector for coolant circulation

Also Published As

Publication number Publication date
GB1039508A (en) 1966-08-17
DE1286218B (en) 1969-01-02
DE6606206U (en) 1970-09-10

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