FR1437208A - Semiconductor device with liquid cooling - Google Patents

Semiconductor device with liquid cooling

Info

Publication number
FR1437208A
FR1437208A FR21176A FR21176A FR1437208A FR 1437208 A FR1437208 A FR 1437208A FR 21176 A FR21176 A FR 21176A FR 21176 A FR21176 A FR 21176A FR 1437208 A FR1437208 A FR 1437208A
Authority
FR
France
Prior art keywords
semiconductor device
liquid cooling
cooling
liquid
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR21176A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
BBC Brown Boveri France SA
Original Assignee
BBC Brown Boveri AG Switzerland
BBC Brown Boveri France SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH806464A external-priority patent/CH414871A/en
Application filed by BBC Brown Boveri AG Switzerland, BBC Brown Boveri France SA filed Critical BBC Brown Boveri AG Switzerland
Priority to FR21176A priority Critical patent/FR1437208A/en
Application granted granted Critical
Publication of FR1437208A publication Critical patent/FR1437208A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
FR21176A 1964-06-19 1965-06-17 Semiconductor device with liquid cooling Expired FR1437208A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR21176A FR1437208A (en) 1964-06-19 1965-06-17 Semiconductor device with liquid cooling

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH806464A CH414871A (en) 1964-06-19 1964-06-19 Cooling arrangement with liquid cooling of semiconductor elements
FR21176A FR1437208A (en) 1964-06-19 1965-06-17 Semiconductor device with liquid cooling

Publications (1)

Publication Number Publication Date
FR1437208A true FR1437208A (en) 1966-04-29

Family

ID=25702735

Family Applications (1)

Application Number Title Priority Date Filing Date
FR21176A Expired FR1437208A (en) 1964-06-19 1965-06-17 Semiconductor device with liquid cooling

Country Status (1)

Country Link
FR (1) FR1437208A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2500215A1 (en) * 1981-02-13 1982-08-20 Thomson Csf Heat sink for encapsulated power semiconductor device - has finned high thermal conductivity base plate with cover, channels and deflector for coolant circulation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2500215A1 (en) * 1981-02-13 1982-08-20 Thomson Csf Heat sink for encapsulated power semiconductor device - has finned high thermal conductivity base plate with cover, channels and deflector for coolant circulation

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