GB1062046A - Improvements in or relating to components for electrical circuits and to circuits formed with said components - Google Patents

Abstract

1,062,046. Capacitors; circuit assemblies. TELEFUNKEN PATENTVERWERTUNGS G.m.b.H. Nov. 29, 1963 [Nov. 29, 1962], No. 47176/63. Headings H1M and H1R. A circuit assembly comprises a stack of plates 1, Fig. 2, e.g. of ceramic, Al oxide or Si oxide, glass or PTFE, each carrying or including an electrical component 3, e.g. a resistor, a coil or a capacitor, and having on or adjacent its periphery a plurality of positions 2 for contacts lying on the circum- .ference of a circle, contacts being disposed in two of said positions and connected to said component; alternatively, the plate 1 may be of ferroelectric, ferromagnetic, piezoelectric, conductive, semi-conductive or resistive material and may comprise a component in itself or with co-operating parts. Preferably, all the plates 1 in a stack have the same number of contact positions and equal angular spacing between the two contacts; the plates may be circular or of regular polygonal planform, the positions for. contacts being holes near the periphery or, preferably, peripheral recesses. The components 3 may be formed by vacuum deposition, either through a mask or with subsequent etching, and the contacts may be formed by metallizing the holes or recesses. Components 3 may be protected by a layer of paint, silicone varnish &c. and identified by projections 7, or notches &c. on plates 1; coloured code-marks indicative of component values may be added to the edges or faces of the plates. In the stack, Fig. 3 (not shown), plates are so relatively angularly disposed that desired connections between components can be effected by soldering together corresponding contacts on adjacent plates with or without interconnecting wires; additional dummy contacts may be provided and interconnected to increase the mechanical strength of the stack. To interconnect two angularly displaced contacts on different plates, a special plate of mica, thin glass, or plastic, having interconnected contacts at the relevant angular positions, is added to the stack; alternatively, the relevant positions are interconnected by wire at a socket-type holder, Fig. 6 (not shown), which is mounted on a printed-circuit board (12) which also carries variable components such as a rheostat (P2). The stack may be mounted on a base having external contacts in the form of soldering tabs, snap-in fasteners, or preferably plug-pins which co-operate with the holder on the printed circuit board (12). To assist heat dispersal, all plates should have good thermal conductivity, and special plates should have larger diameters than normal plates. Heat-conducting layers may be sandwiched between the components in a stack. The construction of a specific circuit assembly is described in the Specification.