GB1058296A - Composite insulator-semiconductor wafer and method of making same - Google Patents

Composite insulator-semiconductor wafer and method of making same

Info

Publication number
GB1058296A
GB1058296A GB23265/64A GB2326564A GB1058296A GB 1058296 A GB1058296 A GB 1058296A GB 23265/64 A GB23265/64 A GB 23265/64A GB 2326564 A GB2326564 A GB 2326564A GB 1058296 A GB1058296 A GB 1058296A
Authority
GB
United Kingdom
Prior art keywords
mesas
semi
wafer
conductor
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB23265/64A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Radio Corporation of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US291338A external-priority patent/US3300832A/en
Application filed by RCA Corp, Radio Corporation of America filed Critical RCA Corp
Publication of GB1058296A publication Critical patent/GB1058296A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W10/014
    • H10W10/021
    • H10W10/17
    • H10W10/20
    • H10W90/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/085Isolated-integrated

Landscapes

  • Element Separation (AREA)
  • Semiconductor Integrated Circuits (AREA)
GB23265/64A 1963-06-28 1964-06-04 Composite insulator-semiconductor wafer and method of making same Expired GB1058296A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US291338A US3300832A (en) 1963-06-28 1963-06-28 Method of making composite insulatorsemiconductor wafer
US571276A US3370204A (en) 1963-06-28 1966-08-09 Composite insulator-semiconductor wafer

Publications (1)

Publication Number Publication Date
GB1058296A true GB1058296A (en) 1967-02-08

Family

ID=26966711

Family Applications (1)

Application Number Title Priority Date Filing Date
GB23265/64A Expired GB1058296A (en) 1963-06-28 1964-06-04 Composite insulator-semiconductor wafer and method of making same

Country Status (6)

Country Link
US (1) US3370204A (enExample)
CA (1) CA947881A (enExample)
DE (1) DE1238517B (enExample)
GB (1) GB1058296A (enExample)
NL (1) NL143367B (enExample)
SE (1) SE324840B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138205A (en) * 1983-04-13 1984-10-17 Philips Electronic Associated Methods of manufacturing a microwave circuit

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3489952A (en) * 1967-05-15 1970-01-13 Singer Co Encapsulated microelectronic devices
US3521128A (en) * 1967-08-02 1970-07-21 Rca Corp Microminiature electrical component having integral indexing means
US3753056A (en) * 1971-03-22 1973-08-14 Texas Instruments Inc Microwave semiconductor device
US4095330A (en) * 1976-08-30 1978-06-20 Raytheon Company Composite semiconductor integrated circuit and method of manufacture
EP0011418A1 (en) * 1978-11-20 1980-05-28 THE GENERAL ELECTRIC COMPANY, p.l.c. Manufacture of electroluminescent display devices
US4335501A (en) * 1979-10-31 1982-06-22 The General Electric Company Limited Manufacture of monolithic LED arrays for electroluminescent display devices
DE69528515T2 (de) * 1994-07-26 2003-04-24 Koninklijke Philips Electronics N.V., Eindhoven Herstellungsmethode eines oberflächen-montierbaren bauteils und dieser selbst

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT225236B (de) * 1959-05-06 1963-01-10 Texas Instruments Inc Verfahren zur Herstellung von abgeschlossenen Schaltungseinheiten sehr geringer Abmessungen
NL250171A (enExample) * 1959-06-23
US3173101A (en) * 1961-02-15 1965-03-09 Westinghouse Electric Corp Monolithic two stage unipolar-bipolar semiconductor amplifier device
US3235428A (en) * 1963-04-10 1966-02-15 Bell Telephone Labor Inc Method of making integrated semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138205A (en) * 1983-04-13 1984-10-17 Philips Electronic Associated Methods of manufacturing a microwave circuit

Also Published As

Publication number Publication date
NL143367B (nl) 1974-09-16
US3370204A (en) 1968-02-20
DE1238517B (de) 1967-04-13
SE324840B (enExample) 1970-06-15
NL6407299A (enExample) 1964-12-29
CA947881A (en) 1974-05-21

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