GB1052646A - - Google Patents

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Publication number
GB1052646A
GB1052646A GB1052646DA GB1052646A GB 1052646 A GB1052646 A GB 1052646A GB 1052646D A GB1052646D A GB 1052646DA GB 1052646 A GB1052646 A GB 1052646A
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GB
United Kingdom
Prior art keywords
ions
sulphates
march
salts
hypophosphite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Publication of GB1052646A publication Critical patent/GB1052646A/en
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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48Coating with alloys
    • C23C18/50Coating with alloys with alloys based on iron, cobalt or nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

1,052,646. Coating with metals. INTERNATIONAL BUSINESS MACHINES CORPORATION. March 22, 1965 [March 23, 1964], No.12001/65. Heading C7F. An aqueous solution for electrolessly depositing a Ni-Fe-P alloy, having a pH greater than 8, comprises Ni, Fe, hypophosphite and hydroxyl ions and Na K tartrate or other complexing agent. The solution may also contain divalent Co, Mo and Cr ions; surfactants e.g. Na lauryl sulphate; exatants, e.g. succinic acid, adipic anions or alkali fluorides; stabilizers e.g. thiourea, Na ethylxanthate or PbSO 4 and pH regulators e.g. boric acid or disodium phosphate. Ni and Fe salts may be sulphates, chlorides, acetates, sulphates and ferrous ammonium sulphate. Hypophosphite ions may be from hypophosphorous acid or its Na and K salts. Hydroxyl ions may be from Na, K, Li or NH4 hydroxide. Complexing agents may contain primary, secondary or tertiary amino, imino, carboxy or hydroxy groups and are preferably Rochelle or Seignette salt, NH 4 Cl and related polyamines and N-carboxymethyl derivatives. The substrate may be mechanically cleaned and degreased and if copper cleaned with HCl and activated in Pd Cl 2 before immersing in a constant temperature bath covered with xylene to prevent oxidation. Plating may take place in a magnetic field provided by a Helmhotz coil. Substrates include Cu, Ni, Co, Fe, Al, Zn, Pt, Pd, Mn, Cr, Mo, W, Ti, Sb, Ag, brass and carbon. The coated substrate may be a thin film storage device as described in Specification 1,052,647.
GB1052646D Active GB1052646A (en)

Publications (1)

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GB1052646A true GB1052646A (en)

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ID=1757124

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GB (1) GB1052646A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995002257A1 (en) * 1993-07-08 1995-01-19 Picopak Oy Method and apparatus for chemically generating terminal bumps on semiconductor wafers
WO2003077258A2 (en) * 2002-03-08 2003-09-18 Freescale Semiconductor, Inc. Magnetic flux concentrating cladding material on conductive lines of mram

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995002257A1 (en) * 1993-07-08 1995-01-19 Picopak Oy Method and apparatus for chemically generating terminal bumps on semiconductor wafers
US5804456A (en) * 1993-07-08 1998-09-08 Picopak Oy Method and apparatus for chemically generating terminal bumps on semiconductor wafers
WO2003077258A2 (en) * 2002-03-08 2003-09-18 Freescale Semiconductor, Inc. Magnetic flux concentrating cladding material on conductive lines of mram
WO2003077258A3 (en) * 2002-03-08 2003-12-31 Motorola Inc Magnetic flux concentrating cladding material on conductive lines of mram
CN100530419C (en) * 2002-03-08 2009-08-19 摩托罗拉公司 Cladding material on conductive lines of MRAM

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