GB1050774A - - Google Patents
Info
- Publication number
- GB1050774A GB1050774A GB168165A GB168165A GB1050774A GB 1050774 A GB1050774 A GB 1050774A GB 168165 A GB168165 A GB 168165A GB 168165 A GB168165 A GB 168165A GB 1050774 A GB1050774 A GB 1050774A
- Authority
- GB
- United Kingdom
- Prior art keywords
- contact
- copper
- ring
- wafer
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US36848664A | 1964-05-19 | 1964-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1050774A true GB1050774A (cg-RX-API-DMAC7.html) | 1966-12-07 |
Family
ID=23451426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB168165A Expired GB1050774A (cg-RX-API-DMAC7.html) | 1964-05-19 | 1965-04-21 |
Country Status (2)
| Country | Link |
|---|---|
| FR (1) | FR1433931A (cg-RX-API-DMAC7.html) |
| GB (1) | GB1050774A (cg-RX-API-DMAC7.html) |
-
1965
- 1965-04-21 GB GB168165A patent/GB1050774A/en not_active Expired
- 1965-05-18 FR FR17453A patent/FR1433931A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR1433931A (fr) | 1966-04-01 |
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