GB1050774A - - Google Patents

Info

Publication number
GB1050774A
GB1050774A GB168165A GB168165A GB1050774A GB 1050774 A GB1050774 A GB 1050774A GB 168165 A GB168165 A GB 168165A GB 168165 A GB168165 A GB 168165A GB 1050774 A GB1050774 A GB 1050774A
Authority
GB
United Kingdom
Prior art keywords
contact
copper
ring
wafer
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB168165A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1050774A publication Critical patent/GB1050774A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
GB168165A 1964-05-19 1965-04-21 Expired GB1050774A (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US36848664A 1964-05-19 1964-05-19

Publications (1)

Publication Number Publication Date
GB1050774A true GB1050774A (cg-RX-API-DMAC7.html) 1966-12-07

Family

ID=23451426

Family Applications (1)

Application Number Title Priority Date Filing Date
GB168165A Expired GB1050774A (cg-RX-API-DMAC7.html) 1964-05-19 1965-04-21

Country Status (2)

Country Link
FR (1) FR1433931A (cg-RX-API-DMAC7.html)
GB (1) GB1050774A (cg-RX-API-DMAC7.html)

Also Published As

Publication number Publication date
FR1433931A (fr) 1966-04-01

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