GB1050441A - - Google Patents
Info
- Publication number
- GB1050441A GB1050441A GB1050441DA GB1050441A GB 1050441 A GB1050441 A GB 1050441A GB 1050441D A GB1050441D A GB 1050441DA GB 1050441 A GB1050441 A GB 1050441A
- Authority
- GB
- United Kingdom
- Prior art keywords
- acid
- hydrochloride
- fluoride
- weight
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
1,050,441. Soldering. M. OHARA. May 15, 1963, No. 19282/63. Heading B3R. [Also in Division C7] A fluxed solder is formed by extruding a powder mixture of a minimum of 75% by weight of two or more of the metals Sn, Pb, Bi, Cd, In, Cu, Hg, Zn, Ni or Ag and a maximum of 25% by weight of a flux. The extrusion conditions are: 6000-10,000 Kg./cm.<SP>2</SP> at 18-40‹C., or 8000-15,000 Kg./cm.<SP>2</SP> at 90- 160‹ C. or 2500-6000 Kg./cm.<SP>2</SP> at 3-18‹C. The fluxes may be chlorides of NH 4 , Zn, Sn; bromides of NH 4 ; the fluoride or acid fluoride of NH 4 ; stearic acid, lactic acid, glutamic acid, salicylic acid phenyl bromide, dimethylamine hydrochloride, aniline hydrochloride, cetyl pyridium hydrochloride, rosin, dioctyl phthalate, dioctyl adipate. Many examples of different soldering alloys are given and the solder may be in the form of wire, rod, sheet, flat, bar, angle or tape.
Publications (1)
Publication Number | Publication Date |
---|---|
GB1050441A true GB1050441A (en) | 1900-01-01 |
Family
ID=1755788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1050441D Expired GB1050441A (en) |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1050441A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0202008A1 (en) * | 1985-04-09 | 1986-11-20 | Cramco Solder Alloys Limited | Shape retaining bodies of solder containing flux and their method of manufacture and use |
US6881278B2 (en) | 1998-06-10 | 2005-04-19 | Showa Denko K.K. | Flux for solder paste |
-
0
- GB GB1050441D patent/GB1050441A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0202008A1 (en) * | 1985-04-09 | 1986-11-20 | Cramco Solder Alloys Limited | Shape retaining bodies of solder containing flux and their method of manufacture and use |
US6881278B2 (en) | 1998-06-10 | 2005-04-19 | Showa Denko K.K. | Flux for solder paste |
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