JPH11172352A - Zn alloy for high temperature soldering - Google Patents

Zn alloy for high temperature soldering

Info

Publication number
JPH11172352A
JPH11172352A JP33442797A JP33442797A JPH11172352A JP H11172352 A JPH11172352 A JP H11172352A JP 33442797 A JP33442797 A JP 33442797A JP 33442797 A JP33442797 A JP 33442797A JP H11172352 A JPH11172352 A JP H11172352A
Authority
JP
Japan
Prior art keywords
alloy
weight
melting point
solder alloy
eutectic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP33442797A
Other languages
Japanese (ja)
Other versions
JP3878305B2 (en
Inventor
Juichi Shimizu
寿一 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP33442797A priority Critical patent/JP3878305B2/en
Publication of JPH11172352A publication Critical patent/JPH11172352A/en
Application granted granted Critical
Publication of JP3878305B2 publication Critical patent/JP3878305B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To properly lower the melting point of a Zn-Al-Mg ternary eutectic alloy and to obtain an alloy capable of substituting for a Pb solder alloy and having no possibility of causing environmental pollution by specifying a composition consisting of Al, Mg, Ga, and Zn with inevitable impurities. SOLUTION: This alloy is a Zn alloy for high temp. soldering, having a composition consisting of, by weight, 1-7%, preferably 3-4%, Al, 0.5-6%, preferably 2.5-3%, Mg, 0.1-20%, preferably 2-13%, Ga, and the balance Zn with inevitable impurities. This Zn alloy is used after being hot-formed at about 200 deg.C or after being pulverized and formed into a paste because of its hardness as high as about 100 Vickers hardness and inferior workability. By the addition of proper amounts of Ga, this Zn alloy can reduce the melting point of a Zn-Al- Mg ternary eutectic alloy, in the vicinity of 340 deg.C eutectic temp., to about 265 to 320 deg.C equal to that of a Pb Sn alloy and can be used for high temp. soldering.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、電子部品や機械部
品の組立などにおける高温はんだ付用に好適なＺｎ合金
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a Zn alloy suitable for high-temperature soldering in assembling electronic parts and mechanical parts.

【０００２】[0002]

【従来の技術】パワートランジスタ素子のダイボンディ
ングを始めとする各種電子部品の組立工程におけるはん
だ付では高温はんだ付が行われ、比較的高温の３００℃
前後の融点を有するはんだ合金（以下、単に「はんだ合
金」という）が用いられている。このはんだ合金には、
Ｐｂ−５重量％Ｓｎ合金に代表されるＰｂ合金（Ｐｂ系
はんだ合金）が従来より用いられている。2. Description of the Related Art In the process of assembling various electronic parts including die bonding of power transistor elements, high-temperature soldering is performed at a relatively high temperature of 300 ° C.
A solder alloy having a melting point before and after is used (hereinafter, simply referred to as “solder alloy”). This solder alloy includes:
A Pb alloy (Pb-based solder alloy) represented by a Pb-5% by weight Sn alloy has been conventionally used.

【０００３】近年、環境汚染に対する配慮からＰｂの使
用を制限する動きが強くなってきている。こうした動き
に対応して電子組立の分野においても、Ｐｂを含まない
はんだ合金が求められている。In recent years, there has been a strong movement to limit the use of Pb in consideration of environmental pollution. In response to these movements, a solder alloy containing no Pb has been required in the field of electronic assembly.

【０００４】しかしながら、従来のＰｂ系はんだ合金を
代替できるはんだ合金はまだ提案されていない。[0004] However, a solder alloy that can replace the conventional Pb-based solder alloy has not yet been proposed.

【０００５】[0005]

【発明が解決しようとする課題】本発明の目的は、上記
事情に鑑み、上記Ｐｂ系はんだ合金を代替できるはんだ
合金を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a solder alloy which can replace the above-mentioned Pb-based solder alloy in view of the above circumstances.

【０００６】[0006]

【課題を解決するための手段】本発明者は、上記課題を
解決すべく、下記（１）、（２）の点にまず着目し、Ｚ
ｎ−Ａｌ−Ｍｇ系３元共晶合金は、Ｐｂ−５重量％Ｓｎ
合金と比べると融点がまだ高いが、Ｚｎ−Ａｌ−Ｍｇ系
３元共晶合金を基本とする合金は、上記Ｐｂ系はんだ合
金を代替できるはんだ合金になり得ると考えた。Means for Solving the Problems In order to solve the above-mentioned problems, the present inventor first pays attention to the following points (1) and (2).
n-Al-Mg ternary eutectic alloy is Pb-5% by weight Sn
Although the melting point is still higher than that of the alloy, it was considered that an alloy based on a Zn-Al-Mg ternary eutectic alloy could be a solder alloy that could replace the Pb-based solder alloy.

【０００７】（１）Ｐｂ−５重量％Ｓｎ合金は、固相線
温度と液相線温度がそれぞれ３０５℃、３１５℃であ
る。(1) The Pb-5 wt% Sn alloy has a solidus temperature and a liquidus temperature of 305 ° C. and 315 ° C., respectively.

【０００８】（２）Ｚｎ−Ａｌ−Ｍｇ系３元共晶合金
は、共晶温度が３４０℃付近にあるといわれている。(2) It is said that the eutectic temperature of a Zn-Al-Mg ternary eutectic alloy is around 340 ° C.

【０００９】そして、さらに研究を鋭意行った結果、Ｚ
ｎ−Ａｌ−Ｍｇ系３元共晶の融点を適当にさらに下げる
ためには、該共晶にＧａを添加することが有効であるこ
とを見出だし、本発明に到達した。Further, as a result of further research, Z
In order to appropriately lower the melting point of the n-Al-Mg ternary eutectic, it has been found that it is effective to add Ga to the eutectic, and the present invention has been achieved.

【００１０】すなわち、本発明は、Ａｌを１〜７重量
％、Ｍｇを０．５〜６重量％、およびＧａを０．１〜２
０重量％含み、残部がＺｎおよび不可避不純物からなる
はんだ合金（Ｚｎ系はんだ合金）である。That is, according to the present invention, 1 to 7% by weight of Al, 0.5 to 6% by weight of Mg, and 0.1 to 2% of Ga are used.
It is a solder alloy (Zn-based solder alloy) containing 0% by weight, with the balance being Zn and unavoidable impurities.

【００１１】[0011]

【発明の実施の形態】本発明のＺｎ系はんだ合金におい
て、Ａｌ含有量を１〜７重量％、Ｍｇ含有量を０．５〜
６重量％としたのは、これらの組成範囲を外れると、合
金の融点が高くなりすぎるためである。上記組成範囲内
では、Ａｌ含有量を３〜４重量％、Ｍｇ含有量を２．５
〜３重量％とするのがさらに好ましい。それは、Ｚｎ−
Ａｌ−Ｍｇ系３元共晶組成あるいはそれに近い組成とな
るからである。BEST MODE FOR CARRYING OUT THE INVENTION In the Zn-based solder alloy of the present invention, the Al content is 1 to 7% by weight, and the Mg content is 0.5 to 5%.
The reason for setting the content to 6% by weight is that if the composition is out of these ranges, the melting point of the alloy becomes too high. Within the above composition range, the Al content is 3 to 4% by weight, and the Mg content is 2.5%.
More preferably, the content is set to 3% by weight. It is Zn-
This is because an Al-Mg ternary eutectic composition or a composition close thereto is obtained.

【００１２】Ｇａは、Ｚｎ−Ａｌ−Ｍｇ系３元合金の融
点を下げる元素である。Ｇａ含有量は、０．１重量％未
満では上記融点低下効果が小さすぎるので、０．１重量
％以上、さらに好ましくは２重量％以上である。一方、
２０重量％を超えると融点が低くなりすぎてはんだ合金
として不適当になるので、２０重量％以下、さらに好ま
しくは１３重量％以下である。Ga is an element that lowers the melting point of the Zn—Al—Mg ternary alloy. If the Ga content is less than 0.1% by weight, the above-mentioned effect of lowering the melting point is too small, so it is 0.1% by weight or more, more preferably 2% by weight or more. on the other hand,
If it exceeds 20% by weight, the melting point will be too low and it will be unsuitable as a solder alloy, so it is at most 20% by weight, more preferably at most 13% by weight.

【００１３】Ｚｎ−Ａｌ−Ｍｇ共晶合金の融点を下げる
には、例えばＳｎも有効である。しかし、Ｓｎを添加す
ると、Ｚｎとの共晶反応により２００℃付近で液相が出
現するので、高温はんだ付用としては低すぎてしまう。
これに対してＧａを０．１〜２０重量％添加すると、融
点が適度に低下し、より好適な組成範囲では２６５〜３
２０℃程度に固相線温度を下げることができる。このよ
うに過度に融点が低下しないのは、ＧａがＭｇと反応し
て化合物を生成し、Ｚｎ−Ａｌ−Ｍｇ系３元共晶中にそ
の化合物が取り込まれるためであると考えられる。[0013] For example, Sn is also effective in lowering the melting point of the Zn-Al-Mg eutectic alloy. However, when Sn is added, a liquid phase appears at around 200 ° C. due to the eutectic reaction with Zn, so that it is too low for high-temperature soldering.
On the other hand, when Ga is added in an amount of 0.1 to 20% by weight, the melting point is appropriately lowered, and in a more preferable composition range, 265 to 3
The solidus temperature can be reduced to about 20 ° C. It is considered that the reason why the melting point does not excessively decrease is that Ga reacts with Mg to form a compound and the compound is taken into the Zn-Al-Mg ternary eutectic.

【００１４】本発明のＺｎ系はんだ合金は、ビッカース
硬度１００ぐらいの高い硬度を有するために、加工性は
劣る。従って、２００℃程度で熱間成形してはんだ合金
材とするか、粉末にした後でペースト状のはんだ合金材
とするのがよい。Since the Zn-based solder alloy of the present invention has a high hardness of about 100 Vickers hardness, the workability is inferior. Therefore, it is preferable to form the solder alloy material by hot forming at about 200 ° C. or to form a paste-like solder alloy material after powdering.

【００１５】[0015]

【実施例】［実施例１〜１１、比較例１］Ｚｎ地金、Ａ
ｌ地金、Ｍｇ地金および金属Ｇａ（以上の原料は、いず
れも純度９９．９重量％）を用い、大気溶解炉によりＺ
ｎ合金を溶製した。溶製したＺｎ合金を化学分析し、そ
の結果を表１に示す。EXAMPLES [Examples 1 to 11, Comparative Example 1] Zn base metal, A
l Using an ingot, Mg ingot, and metallic Ga (all of the above raw materials have a purity of 99.9% by weight),
The n alloy was melted. The melted Zn alloy was chemically analyzed, and the results are shown in Table 1.

【００１６】上記溶製したＺｎ合金について、融点を測
定し、濡れ性を評価した。融点の測定は、マック・サイ
エンス（ＭＡＣ ＳＣＩＥＮＣＥ）社製熱分析装置（Ｄ
ＳＣ３１００型）を用い、昇温・降温速度を１０℃／分
として行った。また、濡れ性の評価は、次の（１）、
（２）、（３）のようにして行った。The melting point of the melted Zn alloy was measured to evaluate the wettability. The melting point was measured using a thermal analyzer (D) manufactured by MAC SCIENCE.
SC3100 type) at a heating / cooling rate of 10 ° C./min. In addition, the evaluation of wettability was performed according to the following (1),
(2) and (3) were performed.

【００１７】（１）上記融点測定で得た各液相線温度よ
り２０℃高い温度に窒素気流中で保持するＺｎ合金浴を
調製する。(1) Prepare a Zn alloy bath which is maintained in a nitrogen stream at a temperature higher by 20 ° C. than each liquidus temperature obtained by the above melting point measurement.

【００１８】（２）Ａｇめっきを施した銅片を上記浴中
に５秒間浸漬した後、該銅片を取り出し観察する。(2) After immersing the Ag-plated copper piece in the above bath for 5 seconds, the copper piece is taken out and observed.

【００１９】（３）取り出した銅片のＡｇめっき面にＺ
ｎ合金融液が濡れ広がった場合に「良」と、濡れ広がら
なかった場合に「不良」と評価する。(3) Z is applied to the Ag-plated surface of the copper piece taken out.
It is evaluated as “good” when the liquid is spread, and “bad” when the liquid is not spread.

【００２０】上記測定・評価の結果を表１に示す。Table 1 shows the results of the above measurement and evaluation.

【００２１】[0021]

【表１】 [Table 1]

【００２２】表１より、実施例のＺｎ合金は、Ｇａの添
加によって融点が適度に低下しており、より好適な組成
範囲では、２６５〜３２０℃の固相線温度を有するとと
もに、濡れ性にも問題がないので、電子部品や機械部品
の組立における高温はんだ付用に好適であることがわか
る。According to Table 1, the melting point of the Zn alloys of the examples is appropriately lowered by the addition of Ga. In a more preferable composition range, the Zn alloy has a solidus temperature of 265 to 320 ° C. Since there is no problem, it is understood that the method is suitable for high-temperature soldering in assembling electronic parts and mechanical parts.

【００２３】[0023]

【発明の効果】本発明により、従来のＰｂ系はんだ合金
を代替できるはんだ合金を提供することができる。According to the present invention, it is possible to provide a solder alloy which can replace a conventional Pb-based solder alloy.

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 Ａｌを１〜７重量％、Ｍｇを０．５〜６
重量％、およびＧａを０．１〜２０重量％含み、残部が
Ｚｎおよび不可避不純物からなる高温はんだ付用Ｚｎ合
金。1. An Al content of 1 to 7% by weight and a Mg content of 0.5 to 6%.
A high-temperature soldering Zn alloy containing 0.1 to 20% by weight of Ga and 0.1 to 20% by weight of Ga, with the balance being Zn and unavoidable impurities. 【請求項２】 Ａｌの含有量が３〜４重量％であり、Ｍ
ｇの含有量が２．５〜３重量％である請求項１に記載の
高温はんだ付用Ｚｎ合金。2. The method according to claim 1, wherein the content of Al is 3 to 4% by weight,
The Zn alloy for high-temperature soldering according to claim 1, wherein the content of g is 2.5 to 3% by weight. 【請求項３】 Ｇａの含有量が２〜１３重量％である請
求項１または２に記載の高温はんだ付用Ｚｎ合金。3. The Zn alloy for high-temperature soldering according to claim 1, wherein the content of Ga is 2 to 13% by weight.
JP33442797A 1997-12-04 1997-12-04 Zn alloy for high temperature soldering Expired - Lifetime JP3878305B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33442797A JP3878305B2 (en) 1997-12-04 1997-12-04 Zn alloy for high temperature soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33442797A JP3878305B2 (en) 1997-12-04 1997-12-04 Zn alloy for high temperature soldering

Publications (2)

Publication Number Publication Date
JPH11172352A true JPH11172352A (en) 1999-06-29
JP3878305B2 JP3878305B2 (en) 2007-02-07

Family

ID=18277264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33442797A Expired - Lifetime JP3878305B2 (en) 1997-12-04 1997-12-04 Zn alloy for high temperature soldering

Country Status (1)

Country Link
JP (1) JP3878305B2 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002009936A1 (en) * 2000-07-31 2002-02-07 Honeywell International Inc. Lead-free alloys with improved wetting properties
US7220493B2 (en) 2002-10-24 2007-05-22 Koa Kabushiki Kaisha Lead-free solder, and a lead-free joint
US7248141B2 (en) 2003-07-03 2007-07-24 Koa Kabushiki Kaisha Current fuse and method of making the current fuse
JP2007207558A (en) * 2006-02-01 2007-08-16 Nec Schott Components Corp Fusible alloy type thermal fuse and circuit protection element
WO2009066704A1 (en) 2007-11-20 2009-05-28 Toyota Jidosha Kabushiki Kaisha Solder material, process for producing the solder material, joint product, process for producing the joint product, power semiconductor module, and process for producing the power semiconductor module
WO2010089647A1 (en) 2009-02-05 2010-08-12 Toyota Jidosha Kabushiki Kaisha Junction body, semiconductor module, and manufacturing method for junction body
CN102632347A (en) * 2012-01-09 2012-08-15 西安交通大学 Aluminium matrix composite, brazing filler metal for aluminium alloy and brazing method
CN103231180A (en) * 2013-05-15 2013-08-07 郑州机械研究所 Aluminum alloy low-temperature brazing solder and production method thereof
US8669652B2 (en) 2011-03-29 2014-03-11 Hitachi Cable, Ltd. Lead component and method for manufacturing the same, and semiconductor package
US9520347B2 (en) 2013-05-03 2016-12-13 Honeywell International Inc. Lead frame construct for lead-free solder connections
US10046417B2 (en) 2011-08-17 2018-08-14 Honeywell International Inc. Lead-free solder compositions
CN111545948A (en) * 2020-05-18 2020-08-18 河南机电职业学院 Brazing alloy, brazing filler metal, preparation method and application of brazing filler metal and prepared brazing product

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002009936A1 (en) * 2000-07-31 2002-02-07 Honeywell International Inc. Lead-free alloys with improved wetting properties
JP2004514559A (en) * 2000-07-31 2004-05-20 ハネウエル・インターナシヨナル・インコーポレーテツド Lead-free alloy with improved wettability
US7220493B2 (en) 2002-10-24 2007-05-22 Koa Kabushiki Kaisha Lead-free solder, and a lead-free joint
US7248141B2 (en) 2003-07-03 2007-07-24 Koa Kabushiki Kaisha Current fuse and method of making the current fuse
JP2007207558A (en) * 2006-02-01 2007-08-16 Nec Schott Components Corp Fusible alloy type thermal fuse and circuit protection element
US8283783B2 (en) 2007-11-20 2012-10-09 Toyota Jidosha Kabushiki Kaisha Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same
WO2009066704A1 (en) 2007-11-20 2009-05-28 Toyota Jidosha Kabushiki Kaisha Solder material, process for producing the solder material, joint product, process for producing the joint product, power semiconductor module, and process for producing the power semiconductor module
WO2010089647A1 (en) 2009-02-05 2010-08-12 Toyota Jidosha Kabushiki Kaisha Junction body, semiconductor module, and manufacturing method for junction body
US8669652B2 (en) 2011-03-29 2014-03-11 Hitachi Cable, Ltd. Lead component and method for manufacturing the same, and semiconductor package
US10046417B2 (en) 2011-08-17 2018-08-14 Honeywell International Inc. Lead-free solder compositions
US10661393B2 (en) 2011-08-17 2020-05-26 Honeywell International Inc. Lead-free solder compositions
CN102632347A (en) * 2012-01-09 2012-08-15 西安交通大学 Aluminium matrix composite, brazing filler metal for aluminium alloy and brazing method
CN102632347B (en) * 2012-01-09 2014-07-02 西安交通大学 Aluminium matrix composite, brazing filler metal for aluminium alloy and brazing method
US9520347B2 (en) 2013-05-03 2016-12-13 Honeywell International Inc. Lead frame construct for lead-free solder connections
CN103231180A (en) * 2013-05-15 2013-08-07 郑州机械研究所 Aluminum alloy low-temperature brazing solder and production method thereof
CN111545948A (en) * 2020-05-18 2020-08-18 河南机电职业学院 Brazing alloy, brazing filler metal, preparation method and application of brazing filler metal and prepared brazing product

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