GB1036434A - Improvements in or relating to the formation of a copper layer on an electrically non-conducting support - Google Patents
Improvements in or relating to the formation of a copper layer on an electrically non-conducting supportInfo
- Publication number
- GB1036434A GB1036434A GB618362A GB618362A GB1036434A GB 1036434 A GB1036434 A GB 1036434A GB 618362 A GB618362 A GB 618362A GB 618362 A GB618362 A GB 618362A GB 1036434 A GB1036434 A GB 1036434A
- Authority
- GB
- United Kingdom
- Prior art keywords
- support
- liquids
- bath
- catalyst
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
- C03C17/10—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the liquid phase
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
In a method of forming a Cu layer on an electrically non-conducting support, two liquids one of which comprises a solution of a copper salt and the other of which is a reducing agent are sprayed simultaneously on to a surface of the support and at the same time a catalyst, which may be included in at least one of the liquids, is sprayed on to the surface, the catalyst serving to assist in the interaction of the two liquids which do not contain free metal to produce free Cu which is deposited on the surface. The support may be a polyethylene terephthalate film. The copper solution may comprise CuSO4 . 5H2O, NaOH and sodium potassium tartrate or be an ammoniacal copper sulphate solution. The reducing agent may be formaldehyde or hydrazine hydrate. The catalyst may be palladium chloride, gold chloride or platinum chloride. Prior to depositing Cu, the support may be cleaned and roughened by vapour blasting with alumina, seeded by immersion in a SnCl2 or TiCl4 bath, and activated by immersion in an aqueous PdCl2 bath. The Cu may be built up by electroplating in an acid Cu bath.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB618362A GB1036434A (en) | 1962-02-16 | 1962-02-16 | Improvements in or relating to the formation of a copper layer on an electrically non-conducting support |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB618362A GB1036434A (en) | 1962-02-16 | 1962-02-16 | Improvements in or relating to the formation of a copper layer on an electrically non-conducting support |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1036434A true GB1036434A (en) | 1966-07-20 |
Family
ID=9809923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB618362A Expired GB1036434A (en) | 1962-02-16 | 1962-02-16 | Improvements in or relating to the formation of a copper layer on an electrically non-conducting support |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1036434A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103789763A (en) * | 2014-01-23 | 2014-05-14 | 青岛理工大学 | Preparation method for constructing antifriction and wear-resistant super-hydrophobic film based on hydrazine hydrate treatment |
-
1962
- 1962-02-16 GB GB618362A patent/GB1036434A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103789763A (en) * | 2014-01-23 | 2014-05-14 | 青岛理工大学 | Preparation method for constructing antifriction and wear-resistant super-hydrophobic film based on hydrazine hydrate treatment |
CN103789763B (en) * | 2014-01-23 | 2016-06-22 | 青岛理工大学 | Preparation method for constructing antifriction and wear-resistant super-hydrophobic film based on hydrazine hydrate treatment |
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