GB1028715A - Improvements in semi-conductors - Google Patents

Improvements in semi-conductors

Info

Publication number
GB1028715A
GB1028715A GB1204163A GB1204163A GB1028715A GB 1028715 A GB1028715 A GB 1028715A GB 1204163 A GB1204163 A GB 1204163A GB 1204163 A GB1204163 A GB 1204163A GB 1028715 A GB1028715 A GB 1028715A
Authority
GB
United Kingdom
Prior art keywords
disc
soldered
semi
copper
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1204163A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB1028715A publication Critical patent/GB1028715A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Abstract

1,028,715. Semi-conductor rectifiers. ROBERT BOSCH G.m.b.H. March 27, 1963 [April 6, 1962], No. 12041/63. Heading H1K. A semi-conductor body containing a PN junction has at least part of the body and the marginal region of the junction covered with an impervious glass coating 17. A copper cup 10 has soldered within it by a silver layer a molybdenum disc 12, to which is soldered by a silver-copper-tin layer a silicon disc 14. Between this and another Mo disc 16 is fixed an aluminium foil 15 serving as a donor to silicon and a copper electrode 19 is soldered to the disc 16. Resin 20 seals the device and to prevent contamination in the event of cracks appearing in the resin the glass coating 17 is applied.
GB1204163A 1962-04-06 1963-03-27 Improvements in semi-conductors Expired GB1028715A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1962B0066685 DE1231811B (en) 1962-04-06 1962-04-06 Semiconductor device

Publications (1)

Publication Number Publication Date
GB1028715A true GB1028715A (en) 1966-05-04

Family

ID=6975232

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1204163A Expired GB1028715A (en) 1962-04-06 1963-03-27 Improvements in semi-conductors

Country Status (2)

Country Link
DE (1) DE1231811B (en)
GB (1) GB1028715A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5893358A (en) * 1981-11-30 1983-06-03 Mitsubishi Electric Corp Semiconductor device
DE3505086A1 (en) * 1985-02-14 1986-08-28 Brown, Boveri & Cie Ag, 6800 Mannheim Power semiconductor module with a plastic casing

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2827597A (en) * 1953-10-02 1958-03-18 Int Rectifier Corp Rectifying mounting
FR1267686A (en) * 1959-09-22 1961-07-21 Unitrode Transistor Products Semiconductor device
US2998558A (en) * 1959-10-19 1961-08-29 Pacific Semiconductors Inc Semiconductor device and method of manufacturing same

Also Published As

Publication number Publication date
DE1231811B (en) 1967-01-05

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