GB1028363A - The cooling of semi-conductor devices - Google Patents

The cooling of semi-conductor devices

Info

Publication number
GB1028363A
GB1028363A GB144463A GB144463A GB1028363A GB 1028363 A GB1028363 A GB 1028363A GB 144463 A GB144463 A GB 144463A GB 144463 A GB144463 A GB 144463A GB 1028363 A GB1028363 A GB 1028363A
Authority
GB
United Kingdom
Prior art keywords
fluid
semi
condenser
cooling fluid
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB144463A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chausson Usines SA
Original Assignee
Chausson Usines SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chausson Usines SA filed Critical Chausson Usines SA
Publication of GB1028363A publication Critical patent/GB1028363A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1,028,363. Semi-conductor devices. DES USINES CHAUSSON S.A. Jan. 11, 1963 [Jan. 17, 1962], No. 1444/63. Heading H1K. A transistor or other semi-conductor device 5 (Fig. 1) is positioned in heat exchange relation with cooling fluid in the liquid state, which fluid is in a closed circuit. Heat emitted by the semi-conductor device 5 causes vaporization of the cooling fluid and the resultant vapour is passed to a condenser 13. The vapour is condensed to liquid which passes under gravity to an outlet of the condenser and thus to the main body of fluid in the liquid state. The fluid may be " Freon " (Registered Trade Mark). The device 5 is contained in an enclosure 1 and a duct 10 enables a vacuum to be obtained prior to filling with fluid. Several devices 5 may be contained in the same enclosure 1. In an alternative arrangement (Fig. 2, not shown) a sole plate 17 attached to a semiconductor device 5 has circulation ducts 18 in communication with a condenser 21. A reservoir 25 of liquid fluid is provided. The sole plate 17 may be dispensed with (Fig. 3, not shown) and the cooling fluid then flows through ducts 22 in the lower part of the semi-conduotor device 5. A number of semi-conductor devices may be cooled by cooling fluid which flows through ducts to a common condenser and reservoir (Fig. 4, not shown).
GB144463A 1962-01-17 1963-01-11 The cooling of semi-conductor devices Expired GB1028363A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR885102A FR1319387A (en) 1962-01-17 1962-01-17 Method and device for cooling semiconductor elements, in particular transistors

Publications (1)

Publication Number Publication Date
GB1028363A true GB1028363A (en) 1966-05-04

Family

ID=8770650

Family Applications (1)

Application Number Title Priority Date Filing Date
GB144463A Expired GB1028363A (en) 1962-01-17 1963-01-11 The cooling of semi-conductor devices

Country Status (3)

Country Link
DE (1) DE1439146B2 (en)
FR (1) FR1319387A (en)
GB (1) GB1028363A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3512582A (en) * 1968-07-15 1970-05-19 Ibm Immersion cooling system for modularly packaged components
DE2642160A1 (en) * 1975-09-20 1977-03-31 Hitachi Ltd BOILER COOLING DEVICE
EP0228212A2 (en) * 1985-12-16 1987-07-08 Hitachi, Ltd. Integrated circuit device
EP1081759A2 (en) * 1999-09-03 2001-03-07 Fujitsu Limited Cooling unit
EP1148772A2 (en) * 2000-04-19 2001-10-24 Thermal Form & Function LLC Cold plate utilizing fin with evaporating refrigerant

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2102254B2 (en) * 1971-01-19 1973-05-30 Robert Bosch Gmbh, 7000 Stuttgart COOLING DEVICE FOR POWER SEMICONDUCTOR COMPONENTS
US3774677A (en) * 1971-02-26 1973-11-27 Ibm Cooling system providing spray type condensation
JPS5430552A (en) * 1977-08-12 1979-03-07 Hitachi Ltd Boiling cooling apparatus
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3512582A (en) * 1968-07-15 1970-05-19 Ibm Immersion cooling system for modularly packaged components
DE2642160A1 (en) * 1975-09-20 1977-03-31 Hitachi Ltd BOILER COOLING DEVICE
EP0228212A2 (en) * 1985-12-16 1987-07-08 Hitachi, Ltd. Integrated circuit device
EP0228212A3 (en) * 1985-12-16 1989-09-27 Hitachi, Ltd. Integrated circuit device
EP1081759A2 (en) * 1999-09-03 2001-03-07 Fujitsu Limited Cooling unit
EP1081759A3 (en) * 1999-09-03 2003-08-27 Fujitsu Limited Cooling unit
US7337829B2 (en) 1999-09-03 2008-03-04 Fujitsu Limited Cooling unit
US7828047B2 (en) 1999-09-03 2010-11-09 Fujitsu Limited Cooling unit
EP1148772A2 (en) * 2000-04-19 2001-10-24 Thermal Form & Function LLC Cold plate utilizing fin with evaporating refrigerant
EP1148772A3 (en) * 2000-04-19 2004-01-21 Thermal Form & Function LLC Cold plate utilizing fin with evaporating refrigerant

Also Published As

Publication number Publication date
DE1439146B2 (en) 1974-01-17
FR1319387A (en) 1963-03-01
DE1439146A1 (en) 1969-04-03

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