GB1022075A - Improvements in or relating to film resistors - Google Patents
Improvements in or relating to film resistorsInfo
- Publication number
- GB1022075A GB1022075A GB4706762A GB4706762A GB1022075A GB 1022075 A GB1022075 A GB 1022075A GB 4706762 A GB4706762 A GB 4706762A GB 4706762 A GB4706762 A GB 4706762A GB 1022075 A GB1022075 A GB 1022075A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- atmosphere
- tantalum
- oxygen
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
- H01C17/12—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0688—Cermets, e.g. mixtures of metal and one or more of carbides, nitrides, oxides or borides
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Resistance Heating (AREA)
Abstract
<PICT:1022075/C6-C7/1> A film resistor comprises an amorphous film of tantalum and tantalum pentoxide deposited on a substrate, e.g. at a temperature of 100-400 DEG C. by reactive sputtering, in an atmosphere containing oxygen using tantalum, the flow rate of oxygen in the atmosphere being preferably 100-10,000 micron cu.foot/g. of sputtered Ta. The sputtered film may be anodized at 25 volts D.C. using an aqueous HNO3 electrolyte and then pre-aged by heating in air e.g. at 250-400 DEG C. for 1-5 hours. As shown in Fig. 1, the sputtering may be effected inside a vacuum chamber 11, containing an atmosphere of oxygen and argon of the desired pressure, by means of a cathode 12, composed of Ta or serving as a base for Ta e.g. in the form of a coating or foil, spaced from an anode 13 above which is disposed, supported on a platform 15, the substrate 16, which may be glazed ceramic or glass initially cleaned by boiling in aqua regia or H2O2. A refractory mask 17, which may be of aluminium, may bear under pressure against the upper surface of the substrate.ALSO:<PICT:1022075/C1/1> A film resistor comprises an amorphous film of tantalum and tantalum pentoxide deposited on a substrate, e.g. at a temperature of 100 DEG to 400 DEG C. by reactive sputtering, in an atmosphere containing oxygen using tantalum, the flow rate of oxygen in the atmosphere being preferably 100-10,000 micron cu. ft./g. of sputtered Ta. The sputtered film may be anodized at 25 volts D.C. using an aqueous HNO3 electrolyte and then pre-aged by heating in air, e.g. at 250-400 DEG C. for 1 to 5 hours. As shown in Fig. 1, the sputtering may be effected inside a vacuum chamber 11, containing an atmosphere of oxy gen and argon of the desired pressure, by means of a cathode 12, composed of Ta or serving as a base for Ta, e.g. in the form of a coating or foil, spaced from an anode 13 above which is disposed, supported on a platform 15, the substrate 16, which may be glazed ceramic or glass initially cleaned by boiling in aqua regia or H2O2. A refractory mask 17, which may be of aluminium, may bear under pressure against the upper surface of the substrate.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16076961A | 1961-12-20 | 1961-12-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1022075A true GB1022075A (en) | 1966-03-09 |
Family
ID=22578359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4706762A Expired GB1022075A (en) | 1961-12-20 | 1962-12-13 | Improvements in or relating to film resistors |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1022075A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0035351A2 (en) * | 1980-02-29 | 1981-09-09 | Gould Inc. | Deformable flexure element for strain gage transducer and method of manufacture |
FR2494437A1 (en) * | 1980-11-20 | 1982-05-21 | Commissariat Energie Atomique | MEASURING DEVICE COMPRISING A STRAIN GAUGE WITH A THIN GLASS HOLDER |
GB2152859A (en) * | 1983-11-19 | 1985-08-14 | Brenton Vann | Universal electro-magnetic drill stand base |
WO2002082474A1 (en) * | 2001-04-09 | 2002-10-17 | Vishay Dale Electronics, Inc. | Thin film resistor having tantalum pentoxide moisture barrier |
-
1962
- 1962-12-13 GB GB4706762A patent/GB1022075A/en not_active Expired
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0035351A2 (en) * | 1980-02-29 | 1981-09-09 | Gould Inc. | Deformable flexure element for strain gage transducer and method of manufacture |
EP0035351A3 (en) * | 1980-02-29 | 1981-10-07 | Gould Inc. | Deformable flexure element for strain gage transducer and method of manufacture |
FR2494437A1 (en) * | 1980-11-20 | 1982-05-21 | Commissariat Energie Atomique | MEASURING DEVICE COMPRISING A STRAIN GAUGE WITH A THIN GLASS HOLDER |
EP0053059A1 (en) * | 1980-11-20 | 1982-06-02 | Commissariat à l'Energie Atomique | Strain gauge measurement device with a thin-glass layer support |
GB2152859A (en) * | 1983-11-19 | 1985-08-14 | Brenton Vann | Universal electro-magnetic drill stand base |
WO2002082474A1 (en) * | 2001-04-09 | 2002-10-17 | Vishay Dale Electronics, Inc. | Thin film resistor having tantalum pentoxide moisture barrier |
US7170389B2 (en) | 2001-04-09 | 2007-01-30 | Vishay Dale Electronics, Inc. | Apparatus for tantalum pentoxide moisture barrier in film resistors |
US7214295B2 (en) | 2001-04-09 | 2007-05-08 | Vishay Dale Electronics, Inc. | Method for tantalum pentoxide moisture barrier in film resistors |
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