GB1020457A - A process for the production of semi-conductor plates - Google Patents

A process for the production of semi-conductor plates

Info

Publication number
GB1020457A
GB1020457A GB42355/62A GB4235562A GB1020457A GB 1020457 A GB1020457 A GB 1020457A GB 42355/62 A GB42355/62 A GB 42355/62A GB 4235562 A GB4235562 A GB 4235562A GB 1020457 A GB1020457 A GB 1020457A
Authority
GB
United Kingdom
Prior art keywords
foil
plates
semi
sections
swelling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB42355/62A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of GB1020457A publication Critical patent/GB1020457A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/329—Plural breakers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/371—Movable breaking tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
GB42355/62A 1961-11-10 1962-11-09 A process for the production of semi-conductor plates Expired GB1020457A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0076635 1961-11-10

Publications (1)

Publication Number Publication Date
GB1020457A true GB1020457A (en) 1966-02-16

Family

ID=7506269

Family Applications (1)

Application Number Title Priority Date Filing Date
GB42355/62A Expired GB1020457A (en) 1961-11-10 1962-11-09 A process for the production of semi-conductor plates

Country Status (5)

Country Link
US (1) US3206088A (enExample)
CH (1) CH408219A (enExample)
DE (1) DE1427749A1 (enExample)
GB (1) GB1020457A (enExample)
NL (1) NL284964A (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1602001C3 (de) * 1965-04-30 1975-07-03 Nippon Electric Co. Ltd., Tokio Verfahren zur Herstellung von Halbleiterelementen
US3396452A (en) * 1965-06-02 1968-08-13 Nippon Electric Co Method and apparatus for breaking a semiconductor wafer into elementary pieces
US3384278A (en) * 1965-10-21 1968-05-21 Muskegon Piston Ring Co Inc Method and apparatus for separating the segments of scored piston rings
US3448510A (en) * 1966-05-20 1969-06-10 Western Electric Co Methods and apparatus for separating articles initially in a compact array,and composite assemblies so formed
NL6709523A (enExample) * 1967-07-08 1969-01-10
US3601296A (en) * 1968-12-30 1971-08-24 Texas Instruments Inc Device for breaking scribed slices of semiconductor material
US3578227A (en) * 1969-10-01 1971-05-11 Transitron Electronic Corp Method of breaking dice
US3870196A (en) * 1973-09-28 1975-03-11 Laurier Associates Inc High yield method of breaking wafer into dice
US3918150A (en) * 1974-02-08 1975-11-11 Gen Electric System for separating a semiconductor wafer into discrete pellets
US4247031A (en) * 1979-04-10 1981-01-27 Rca Corporation Method for cracking and separating pellets formed on a wafer
JPS6282008A (ja) * 1985-10-04 1987-04-15 三菱電機株式会社 半導体ウエハ−ブレイク装置
IT1218088B (it) * 1988-06-16 1990-04-12 Aisa Spa Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi
US5029418A (en) * 1990-03-05 1991-07-09 Eastman Kodak Company Sawing method for substrate cutting operations
US5393706A (en) * 1993-01-07 1995-02-28 Texas Instruments Incorporated Integrated partial sawing process
CA2162917A1 (en) * 1993-05-15 1994-11-24 Dirk Emrich Device, clamping tool and process for breaking away cuttings when cutting out blanks from cardboard
US6312800B1 (en) * 1997-02-10 2001-11-06 Lintec Corporation Pressure sensitive adhesive sheet for producing a chip
US20060024922A1 (en) * 2004-07-27 2006-02-02 Da-Tung Wen Method for cutting wafer
TW201306104A (zh) * 2011-07-27 2013-02-01 Lextar Electronics Croportion 晶粒分離製程及其裝置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2970730A (en) * 1957-01-08 1961-02-07 Motorola Inc Dicing semiconductor wafers
US3040489A (en) * 1959-03-13 1962-06-26 Motorola Inc Semiconductor dicing
US3099375A (en) * 1960-10-07 1963-07-30 Package Machinery Co Gum breaking device

Also Published As

Publication number Publication date
DE1427749A1 (de) 1968-12-12
NL284964A (enExample) 1900-01-01
CH408219A (de) 1966-02-28
US3206088A (en) 1965-09-14

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