GB1016352A - Improvements in or relating to methods of manufacturing base plates of electrical circuit elements - Google Patents

Improvements in or relating to methods of manufacturing base plates of electrical circuit elements

Info

Publication number
GB1016352A
GB1016352A GB362363A GB362363A GB1016352A GB 1016352 A GB1016352 A GB 1016352A GB 362363 A GB362363 A GB 362363A GB 362363 A GB362363 A GB 362363A GB 1016352 A GB1016352 A GB 1016352A
Authority
GB
United Kingdom
Prior art keywords
wires
electrical circuit
circuit elements
mould
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB362363A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1016352A publication Critical patent/GB1016352A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/32—Sealing leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Push-Button Switches (AREA)

Abstract

<PICT:1016352/C1/1> <PICT:1016352/C1/2> In a method of manufacturing a base plate for electrical circuit elements, a plurality of current supply wires 4, Fig. 1, for the elements are initially sealed into a bead 10 of insulating material, which is then softened by heating and pulled into a mould 1 by longitudinal movement of the wires which are guided by bores 3 in the mould. In the event of the base plate having an irregular surface as shown in Fig. 7, one of the wires 28 may be moved more than the others. Prior to heating by burners 9 the bead may be located in the mould and heated sufficiently to attach it to one of the wires, after which it is withdrawn to complete the heating process. The wires 4 may support a transistor which is enclosed in a dome-shaped glass envelope which is hermetically sealed to the base plate.
GB362363A 1962-02-01 1963-01-29 Improvements in or relating to methods of manufacturing base plates of electrical circuit elements Expired GB1016352A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEP28717A DE1228004B (en) 1962-02-01 1962-02-01 Process for the production of glass feet for electronic components

Publications (1)

Publication Number Publication Date
GB1016352A true GB1016352A (en) 1966-01-12

Family

ID=7371358

Family Applications (1)

Application Number Title Priority Date Filing Date
GB362363A Expired GB1016352A (en) 1962-02-01 1963-01-29 Improvements in or relating to methods of manufacturing base plates of electrical circuit elements

Country Status (2)

Country Link
DE (1) DE1228004B (en)
GB (1) GB1016352A (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE963806C (en) * 1934-09-01 1957-05-16 Aeg Vacuum-tight seal for power supplies or electrode supports in discharge tubes
DE1764699U (en) * 1955-02-04 1958-04-10 Siemens Ag DIRECTORY OR TRANSISTOR ARRANGEMENT.

Also Published As

Publication number Publication date
DE1228004B (en) 1966-11-03

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