GB1004341A - Improvements in or relating to electric circuit elements - Google Patents

Improvements in or relating to electric circuit elements

Info

Publication number
GB1004341A
GB1004341A GB2723162A GB2723162A GB1004341A GB 1004341 A GB1004341 A GB 1004341A GB 2723162 A GB2723162 A GB 2723162A GB 2723162 A GB2723162 A GB 2723162A GB 1004341 A GB1004341 A GB 1004341A
Authority
GB
United Kingdom
Prior art keywords
filling body
envelope
filling
glass
july
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2723162A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1004341A publication Critical patent/GB1004341A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/20Seals between parts of vessels
    • H01J5/22Vacuum-tight joints between parts of vessel
    • H01J5/30Vacuum-tight joints between parts of vessel using packing-material, e.g. sealing-liquid or elastic insert
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00Discharge tubes and lamps
    • H01J2893/0033Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0047Closure other than lamp base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

1,004,341. Semi-conductor devices. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. July 16, 1962 [July 19, 1961], No. 27231/62. Heading H1K. A glass envelope containing a semi-conductor device is sealed by placing a filling body symmetrically with reference to the opening and filling the spaces between the body and the envelope with a synthetic resin. The filling body reduces the effects of the large difference in coefficient of expansion of the glass envelope and the synthetic resin. As shown, a glass envelope 1 containing a CdS photo resistor 2 and electrode system 3, 4, 5, 7 surrounded by silicone grease 9, is sealed by placing a glass rod 10 in the opening and surrounding it with epoxy resin 11. In a larger type of photo resistor the filling body consists of two rods between which the connecting leads emerge. In the case of a shallow cup-shaped envelope the filling body may be circular with apertures for the connecting leads, or may consist of two sectors of a circle. The filling body may be made of quartz or ceramic.
GB2723162A 1961-07-19 1962-07-16 Improvements in or relating to electric circuit elements Expired GB1004341A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL267281 1961-07-19

Publications (1)

Publication Number Publication Date
GB1004341A true GB1004341A (en) 1965-09-15

Family

ID=19753171

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2723162A Expired GB1004341A (en) 1961-07-19 1962-07-16 Improvements in or relating to electric circuit elements

Country Status (5)

Country Link
AT (1) AT240439B (en)
CH (1) CH421327A (en)
DK (1) DK106344C (en)
GB (1) GB1004341A (en)
NL (1) NL267281A (en)

Also Published As

Publication number Publication date
DK106344C (en) 1967-01-23
NL267281A (en)
CH421327A (en) 1966-09-30
AT240439B (en) 1965-05-25

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