GB0911403D0 - Heat sink - Google Patents

Heat sink

Info

Publication number
GB0911403D0
GB0911403D0 GB0911403A GB0911403A GB0911403D0 GB 0911403 D0 GB0911403 D0 GB 0911403D0 GB 0911403 A GB0911403 A GB 0911403A GB 0911403 A GB0911403 A GB 0911403A GB 0911403 D0 GB0911403 D0 GB 0911403D0
Authority
GB
United Kingdom
Prior art keywords
heat sink
sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0911403A
Other versions
GB2471497A (en
GB2471497B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Lambda UK Ltd
Original Assignee
TDK Lambda UK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Lambda UK Ltd filed Critical TDK Lambda UK Ltd
Priority to GB0911403A priority Critical patent/GB2471497B/en
Publication of GB0911403D0 publication Critical patent/GB0911403D0/en
Publication of GB2471497A publication Critical patent/GB2471497A/en
Application granted granted Critical
Publication of GB2471497B publication Critical patent/GB2471497B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10454—Vertically mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
GB0911403A 2009-07-01 2009-07-01 Heat sink Active GB2471497B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0911403A GB2471497B (en) 2009-07-01 2009-07-01 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0911403A GB2471497B (en) 2009-07-01 2009-07-01 Heat sink

Publications (3)

Publication Number Publication Date
GB0911403D0 true GB0911403D0 (en) 2009-08-12
GB2471497A GB2471497A (en) 2011-01-05
GB2471497B GB2471497B (en) 2014-08-20

Family

ID=41008570

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0911403A Active GB2471497B (en) 2009-07-01 2009-07-01 Heat sink

Country Status (1)

Country Link
GB (1) GB2471497B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013201256A (en) * 2012-03-23 2013-10-03 Toshiba Lighting & Technology Corp Wiring board device, light-emitting module, lighting device, and method for manufacturing wiring board device
DE102012112389A1 (en) * 2012-12-17 2014-06-18 Aptronic Ag Electrical assembly for mounting on a DIN rail
FR3024011B1 (en) * 2014-07-15 2018-04-13 Valeo Equip Electr Moteur CONVERTER OF CURRENT POWER CONTINUOUS IN ALTERNATING CURRENT
DE102017100527A1 (en) * 2017-01-12 2018-07-12 Danfoss Silicon Power Gmbh Power module with optimized bonding wire layout
DE102017130362A1 (en) * 2017-12-18 2019-07-11 Valeo Schalter Und Sensoren Gmbh Method for producing an electronic assembly, electronic assembly, image forming apparatus, head-up display and vehicle with head-up display
CN111711358B (en) 2019-03-18 2021-08-06 台达电子工业股份有限公司 Voltage regulation module
CN111786541B (en) 2019-03-18 2021-10-29 台达电子工业股份有限公司 Voltage regulation module
CN112731996B (en) 2019-10-28 2022-07-15 台达电子工业股份有限公司 Voltage regulation module
WO2023075820A1 (en) * 2021-10-29 2023-05-04 Hewlett-Packard Development Company, L.P. Multi-electronic card holders

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02224393A (en) * 1989-02-27 1990-09-06 Nec Corp Method of soldering mixed mounting metal core printed board assembly
USH1471H (en) * 1993-04-26 1995-08-01 Braun David J Metal substrate double sided circuit board
JP3551491B2 (en) * 1994-10-07 2004-08-04 三菱電機株式会社 Printed circuit board with heat sink
FR2742294B1 (en) * 1995-12-11 1998-02-27 Valeo Electronique ELECTRONIC THERMAL DRAIN ASSEMBLY, IN PARTICULAR FOR A HIGH VOLTAGE TRANSFORMER OF A MOTOR VEHICLE PROJECTOR DISCHARGE LAMP
US7607790B2 (en) * 2006-12-18 2009-10-27 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Backlighting apparatus and manufacturing process

Also Published As

Publication number Publication date
GB2471497A (en) 2011-01-05
GB2471497B (en) 2014-08-20

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