GB0418218D0 - Electrical device having a heat generating electrically resistive element and heat dissipating means therefor - Google Patents

Electrical device having a heat generating electrically resistive element and heat dissipating means therefor

Info

Publication number
GB0418218D0
GB0418218D0 GBGB0418218.4A GB0418218A GB0418218D0 GB 0418218 D0 GB0418218 D0 GB 0418218D0 GB 0418218 A GB0418218 A GB 0418218A GB 0418218 D0 GB0418218 D0 GB 0418218D0
Authority
GB
United Kingdom
Prior art keywords
resistive element
electrical device
electrically resistive
means therefor
dissipating means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0418218.4A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tyco Electronics UK Ltd
Original Assignee
Tyco Electronics UK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics UK Ltd filed Critical Tyco Electronics UK Ltd
Priority to GBGB0418218.4A priority Critical patent/GB0418218D0/en
Publication of GB0418218D0 publication Critical patent/GB0418218D0/en
Priority to EP05254890A priority patent/EP1628331B1/en
Priority to AT05254890T priority patent/ATE492027T1/en
Priority to DE602005025294T priority patent/DE602005025294D1/en
Priority to JP2005235395A priority patent/JP2006114881A/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
    • H01C17/12—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H01C3/10—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element having zig-zag or sinusoidal configuration
    • H01C3/12—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element having zig-zag or sinusoidal configuration lying in one plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/006—Thin film resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Non-Adjustable Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Physical Vapour Deposition (AREA)
  • Thermistors And Varistors (AREA)
  • Resistance Heating (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electronic Switches (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

This invention provides an electrical device (10) having improved heat transfer properties. The electrical device comprises an electrically conductive resistive element (18) provided on a heat transfer medium for transferring heat from the resistive element. The resistive element comprises an 80/20 nickel chromium material sputtered onto a surface of an aluminum nitride substrate. The 80/20 nickel chromium material is deposited on the surface of the substrate in thickness ranging from 0.5 to 25 microns. The resistance of the resistive element is controlled by altering the chemical composition of the sputtered film by introducing a reactive gas in the sputtering process.
GBGB0418218.4A 2004-08-16 2004-08-16 Electrical device having a heat generating electrically resistive element and heat dissipating means therefor Ceased GB0418218D0 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GBGB0418218.4A GB0418218D0 (en) 2004-08-16 2004-08-16 Electrical device having a heat generating electrically resistive element and heat dissipating means therefor
EP05254890A EP1628331B1 (en) 2004-08-16 2005-08-05 Electrical device having a heat generating electrically resistive element and heat dissipating means therefor
AT05254890T ATE492027T1 (en) 2004-08-16 2005-08-05 ELECTRICAL DEVICE COMPRISING A HEAT GENERATING ELECTRICAL RESISTANCE ELEMENT AND HEAT DISSIPATION MEANS THEREOF
DE602005025294T DE602005025294D1 (en) 2004-08-16 2005-08-05 An electric device comprising a heat generating electrical resistance element and heat dissipation means therefor
JP2005235395A JP2006114881A (en) 2004-08-16 2005-08-15 Electrical apparatus with heating electrically resistive element and means of heat dissipation for it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0418218.4A GB0418218D0 (en) 2004-08-16 2004-08-16 Electrical device having a heat generating electrically resistive element and heat dissipating means therefor

Publications (1)

Publication Number Publication Date
GB0418218D0 true GB0418218D0 (en) 2004-09-15

Family

ID=33017558

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0418218.4A Ceased GB0418218D0 (en) 2004-08-16 2004-08-16 Electrical device having a heat generating electrically resistive element and heat dissipating means therefor

Country Status (5)

Country Link
EP (1) EP1628331B1 (en)
JP (1) JP2006114881A (en)
AT (1) ATE492027T1 (en)
DE (1) DE602005025294D1 (en)
GB (1) GB0418218D0 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7843309B2 (en) 2007-09-27 2010-11-30 Vishay Dale Electronics, Inc. Power resistor
WO2009041974A1 (en) * 2007-09-27 2009-04-02 Vishay Dale Electronics, Inc. Power resistor
CN103093908B (en) * 2007-09-27 2017-04-26 韦沙戴尔电子公司 Power resistor
WO2012081369A1 (en) * 2010-12-17 2012-06-21 新日鐵化学株式会社 Electromagnetic noise suppressing body, use of same, and electronic device
JP2014241451A (en) * 2014-09-18 2014-12-25 住友金属鉱山株式会社 Resistance thin film element with copper conductor layer
CN206059059U (en) 2016-09-07 2017-03-29 南京南瑞继保电气有限公司 A kind of shell mechanism of Planar capacitor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498071A (en) * 1982-09-30 1985-02-05 Dale Electronics, Inc. High resistance film resistor
US5355281A (en) 1993-06-29 1994-10-11 E.B.G. Elektronische Bauelemente Gesellschaft M.B.H. Electrical device having a bonded ceramic-copper heat transfer medium
CA2252113A1 (en) * 1997-10-29 1999-04-29 Yoshihiko Numata Substrate and process for producing the same
GB2360530A (en) 2000-03-25 2001-09-26 Plasma Quest Ltd High target utilisation sputtering system with remote plasma source
US7106167B2 (en) * 2002-06-28 2006-09-12 Heetronix Stable high temperature sensor system with tungsten on AlN

Also Published As

Publication number Publication date
EP1628331A1 (en) 2006-02-22
EP1628331B1 (en) 2010-12-15
JP2006114881A (en) 2006-04-27
DE602005025294D1 (en) 2011-01-27
ATE492027T1 (en) 2011-01-15

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)