GB0221463D0 - Heat-dissipating device - Google Patents

Heat-dissipating device

Info

Publication number
GB0221463D0
GB0221463D0 GBGB0221463.3A GB0221463A GB0221463D0 GB 0221463 D0 GB0221463 D0 GB 0221463D0 GB 0221463 A GB0221463 A GB 0221463A GB 0221463 D0 GB0221463 D0 GB 0221463D0
Authority
GB
United Kingdom
Prior art keywords
heat
dissipating device
dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0221463.3A
Other versions
GB2390482A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of GB0221463D0 publication Critical patent/GB0221463D0/en
Publication of GB2390482A publication Critical patent/GB2390482A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB0221463A 2002-07-01 2002-09-16 Heat dissipating device Withdrawn GB2390482A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91114537 2002-07-01

Publications (2)

Publication Number Publication Date
GB0221463D0 true GB0221463D0 (en) 2002-10-23
GB2390482A GB2390482A (en) 2004-01-07

Family

ID=21688314

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0221463A Withdrawn GB2390482A (en) 2002-07-01 2002-09-16 Heat dissipating device

Country Status (4)

Country Link
US (1) US20040000394A1 (en)
JP (1) JP2004040069A (en)
DE (1) DE10244625A1 (en)
GB (1) GB2390482A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6911231B2 (en) * 1996-10-25 2005-06-28 New Qu Energy Limited Method for producing a heat transfer medium and device
KR101087861B1 (en) * 2004-03-15 2011-11-30 엘지전자 주식회사 A heat source cooling structure for computer
US7878232B2 (en) * 2004-07-09 2011-02-01 GE Lighting Solutions, LLC Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management
KR101273359B1 (en) * 2011-05-09 2013-06-11 강준수 a generator for hot wind with field of buffer
TW201339513A (en) * 2012-03-16 2013-10-01 Hon Hai Prec Ind Co Ltd Cooling system
JP6104380B2 (en) * 2013-06-20 2017-03-29 三菱電機株式会社 Power conversion device for vehicle
WO2016116172A1 (en) * 2015-01-23 2016-07-28 Quantum Technologie (Deutschland) Gmbh Quantum medium formula and preparation process for heat transfer
CN106163154B (en) * 2016-07-20 2019-04-09 广东网域科技有限公司 A kind of high intensity interchanger
CN107613732A (en) * 2017-09-28 2018-01-19 深圳兴奇宏科技有限公司 Heat-sinking structure of chassis
CN108925107B (en) * 2018-07-11 2020-04-10 佛山市众盈电子有限公司 Load and temperature double-control power supply device
CN112197429A (en) * 2020-10-10 2021-01-08 江苏九州电器有限公司 Ventilation structure of electric heater

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4520425A (en) * 1982-08-12 1985-05-28 Mitsubishi Denki Kabushiki Kaisha Control apparatus with improved structure for cooling circuit elements
WO1995025255A1 (en) * 1992-09-28 1995-09-21 Aavid Engineering, Inc. Apparatus and method for cooling heat generating electronic components in a cabinet
RU2190533C2 (en) * 1996-10-25 2002-10-10 Юши Ку Heat superconductor
US6062302A (en) * 1997-09-30 2000-05-16 Lucent Technologies Inc. Composite heat sink
US5917697A (en) * 1998-01-27 1999-06-29 Wang; Daniel CPU cooling arrangement
CA2310358A1 (en) * 1999-06-01 2000-12-01 Showa Aluminum Corporation Heat sinks for cpus for use in personal computers
US6410982B1 (en) * 1999-11-12 2002-06-25 Intel Corporation Heatpipesink having integrated heat pipe and heat sink
DE20010663U1 (en) * 2000-06-15 2000-10-26 Schlomka Georg Cooling element and cooling device
GB2364179A (en) * 2000-06-30 2002-01-16 Jern Ru Ind Co Ltd A heat dissipation device
US6408935B1 (en) * 2000-08-16 2002-06-25 Thermal Corp. Heat sink assembly with over-molded cooling fins

Also Published As

Publication number Publication date
US20040000394A1 (en) 2004-01-01
DE10244625A1 (en) 2004-01-22
GB2390482A (en) 2004-01-07
JP2004040069A (en) 2004-02-05

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)