GB0219608D0 - Substrate loading and unloading apparatus - Google Patents

Substrate loading and unloading apparatus

Info

Publication number
GB0219608D0
GB0219608D0 GBGB0219608.7A GB0219608A GB0219608D0 GB 0219608 D0 GB0219608 D0 GB 0219608D0 GB 0219608 A GB0219608 A GB 0219608A GB 0219608 D0 GB0219608 D0 GB 0219608D0
Authority
GB
United Kingdom
Prior art keywords
substrate loading
unloading apparatus
unloading
loading
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0219608.7A
Other versions
GB2392309B (en
GB2392309A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vistec Lithography Ltd
Original Assignee
Vistec Lithography Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vistec Lithography Ltd filed Critical Vistec Lithography Ltd
Priority to GB0219608A priority Critical patent/GB2392309B/en
Publication of GB0219608D0 publication Critical patent/GB0219608D0/en
Priority to DE10328347A priority patent/DE10328347A1/en
Priority to US10/644,185 priority patent/US7783377B2/en
Publication of GB2392309A publication Critical patent/GB2392309A/en
Application granted granted Critical
Publication of GB2392309B publication Critical patent/GB2392309B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
GB0219608A 2002-08-22 2002-08-22 Substrate loading and unloading apparatus Expired - Fee Related GB2392309B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB0219608A GB2392309B (en) 2002-08-22 2002-08-22 Substrate loading and unloading apparatus
DE10328347A DE10328347A1 (en) 2002-08-22 2003-06-24 Substrate loading and unloading device
US10/644,185 US7783377B2 (en) 2002-08-22 2003-08-20 Substrate loading and unloading apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0219608A GB2392309B (en) 2002-08-22 2002-08-22 Substrate loading and unloading apparatus

Publications (3)

Publication Number Publication Date
GB0219608D0 true GB0219608D0 (en) 2002-10-02
GB2392309A GB2392309A (en) 2004-02-25
GB2392309B GB2392309B (en) 2004-10-27

Family

ID=9942807

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0219608A Expired - Fee Related GB2392309B (en) 2002-08-22 2002-08-22 Substrate loading and unloading apparatus

Country Status (3)

Country Link
US (1) US7783377B2 (en)
DE (1) DE10328347A1 (en)
GB (1) GB2392309B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6824343B2 (en) * 2002-02-22 2004-11-30 Applied Materials, Inc. Substrate support
US20050229849A1 (en) * 2004-02-13 2005-10-20 Applied Materials, Inc. High productivity plasma processing chamber
US7470919B2 (en) * 2005-09-30 2008-12-30 Applied Materials, Inc. Substrate support assembly with thermal isolating plate
US7581916B2 (en) * 2006-07-14 2009-09-01 Ulvac-Phi, Inc. Sample introduction and transfer system and method
DE102007057950B4 (en) * 2007-02-16 2013-02-21 Ntg Neue Technologien Gmbh & Co Kg Device for holding workpieces, in particular in the surface treatment of lenses, semiconductors and the like under vacuum or atmosphere, by means of ion beams, use of the device and processing device
DE102008039757A1 (en) 2008-08-20 2010-02-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Actuator element and its use
TWI471891B (en) * 2009-02-22 2015-02-01 Mapper Lithography Ip Bv Charged particle lithography machine and substrate handling system
CN101814586B (en) * 2009-12-01 2011-09-28 东莞宏威数码机械有限公司 Clamping type substrate turnover device
CN101992948B (en) * 2010-09-30 2013-07-31 东莞宏威数码机械有限公司 Automatic substrate uploading device
CN102126630B (en) * 2010-12-29 2015-02-04 常州亿晶光电科技有限公司 Silicon chip image positioning and correcting device of full-automatic printer
CN102358519B (en) * 2011-07-09 2013-04-17 溧阳市正申饲料机械厂 Stacking machine
JP6226712B2 (en) * 2013-11-21 2017-11-08 光洋サーモシステム株式会社 Substrate support structure
CN104409404B (en) * 2014-11-13 2017-01-25 苏州迈为科技股份有限公司 Solar cell micro suction position adjustment method
KR102651054B1 (en) * 2016-02-22 2024-03-26 삼성디스플레이 주식회사 Transfering device, Method using the same and Display apparatus
DE102016111539A1 (en) * 2016-06-23 2017-12-28 Krones Aktiengesellschaft Method and device for handling in at least one row successively moving piece goods
CN112789486B (en) * 2019-07-05 2024-03-08 林振宇 Force and inclination monitoring system with self-locating identification

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968885A (en) * 1973-06-29 1976-07-13 International Business Machines Corporation Method and apparatus for handling workpieces
US4642436A (en) * 1984-09-14 1987-02-10 Rohr Industries, Inc. Automatic metallic honeycomb core manufacturing machine
US4642438A (en) * 1984-11-19 1987-02-10 International Business Machines Corporation Workpiece mounting and clamping system having submicron positioning repeatability
US4705951A (en) 1986-04-17 1987-11-10 Varian Associates, Inc. Wafer processing system
JPS63252439A (en) 1986-12-19 1988-10-19 アプライド　マテリアルズインコーポレーテッド Integrated processing system of multichamber
JPH0828205B2 (en) * 1989-10-27 1996-03-21 株式会社日立製作所 Wafer transfer device
US5996488A (en) * 1994-11-25 1999-12-07 Canon Kabushiki Kaisha Preparation of an electron source by offset printing electrodes having thickness less than 200 nm
JPH1010224A (en) 1996-06-03 1998-01-16 Megapulse Inc Method and system for integrating loran-c and satellite navigation system (sns) in order to enhance accuracy, availability and integrity of system
JPH10102249A (en) * 1996-09-27 1998-04-21 Nissin Electric Co Ltd Substrate holder
US6499933B2 (en) * 1997-04-03 2002-12-31 Tokyo Electron Limited Elevating mechanism, carrier conveying apparatus and heat treatment installation
JPH1135440A (en) 1997-07-18 1999-02-09 Kose Corp Cosmetic
JP3741401B2 (en) * 1998-02-27 2006-02-01 キヤノン株式会社 Substrate transport device, semiconductor manufacturing device, and liquid crystal plate manufacturing device
JPH11354405A (en) * 1998-06-05 1999-12-24 Hitachi Ltd Electron beam lithography device
KR100548711B1 (en) * 2000-03-16 2006-02-02 에이에스엠엘 네델란즈 비.브이. Substrate holder for lithographic apparatus
JP2003077974A (en) * 2001-08-31 2003-03-14 Hitachi Kokusai Electric Inc Substrate processing device and manufacturing method of semiconductor device

Also Published As

Publication number Publication date
US20040037676A1 (en) 2004-02-26
US7783377B2 (en) 2010-08-24
GB2392309B (en) 2004-10-27
DE10328347A1 (en) 2004-04-01
GB2392309A (en) 2004-02-25

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20120822