GB0204971D0 - No title - Google Patents

No title

Info

Publication number
GB0204971D0
GB0204971D0 GBGB0204971.6A GB0204971A GB0204971D0 GB 0204971 D0 GB0204971 D0 GB 0204971D0 GB 0204971 A GB0204971 A GB 0204971A GB 0204971 D0 GB0204971 D0 GB 0204971D0
Authority
GB
United Kingdom
Prior art keywords
title
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0204971.6A
Other versions
GB2370040A (en
GB2370040A8 (en
GB2370040B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Ceramics and Plastics Inc
Original Assignee
Saint Gobain Ceramics and Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics and Plastics Inc filed Critical Saint Gobain Ceramics and Plastics Inc
Publication of GB0204971D0 publication Critical patent/GB0204971D0/en
Publication of GB2370040A publication Critical patent/GB2370040A/en
Publication of GB2370040A8 publication Critical patent/GB2370040A8/en
Application granted granted Critical
Publication of GB2370040B publication Critical patent/GB2370040B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/29386—Base material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/29393—Base material with a principal constituent of the material being a solid not provided for in groups H01L2224/293 - H01L2224/29391, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
GB0204971A 1999-09-21 2000-09-20 Thermally conductive materials in a hydrophobic compound for thermal management Expired - Fee Related GB2370040B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40016999A 1999-09-21 1999-09-21
PCT/US2000/025811 WO2001021393A1 (en) 1999-09-21 2000-09-20 Thermally conductive materials in a hydrophobic compound for thermal management

Publications (4)

Publication Number Publication Date
GB0204971D0 true GB0204971D0 (en) 2002-04-17
GB2370040A GB2370040A (en) 2002-06-19
GB2370040A8 GB2370040A8 (en) 2002-06-19
GB2370040B GB2370040B (en) 2003-10-29

Family

ID=23582496

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0204971A Expired - Fee Related GB2370040B (en) 1999-09-21 2000-09-20 Thermally conductive materials in a hydrophobic compound for thermal management

Country Status (5)

Country Link
JP (2) JP2003509578A (en)
AU (1) AU3886801A (en)
DE (1) DE10085011T1 (en)
GB (1) GB2370040B (en)
WO (1) WO2001021393A1 (en)

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US6673434B2 (en) 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
US7101565B2 (en) 2002-02-05 2006-09-05 Corpak Medsystems, Inc. Probiotic/prebiotic composition and delivery method
US20050016714A1 (en) 2003-07-09 2005-01-27 Chung Deborah D.L. Thermal paste for improving thermal contacts
JP4828429B2 (en) 2003-11-05 2011-11-30 ダウ・コーニング・コーポレイション Thermally conductive grease, and method and device using the grease
EP1568733A1 (en) * 2004-02-20 2005-08-31 Abb Research Ltd. Porous inorganic filler particles having an organopolysiloxane coating for use in curable casting compositions
JP5114112B2 (en) * 2006-09-07 2013-01-09 日東シンコー株式会社 Resin composition, heat conductive sheet, high heat conductive adhesive sheet with metal foil, and high heat conductive adhesive sheet with metal plate
JP5114111B2 (en) * 2006-09-07 2013-01-09 日東シンコー株式会社 Resin composition, heat conductive sheet, high heat conductive adhesive sheet with metal foil, and high heat conductive adhesive sheet with metal plate
US7527859B2 (en) * 2006-10-08 2009-05-05 Momentive Performance Materials Inc. Enhanced boron nitride composition and compositions made therewith
US8093713B2 (en) 2007-02-09 2012-01-10 Infineon Technologies Ag Module with silicon-based layer
DE102007023555A1 (en) * 2007-05-21 2008-11-27 Siemens Ag Hydrophobic surface coating for electronic and electrical components as well as uses for it
EP2408860B1 (en) 2009-03-16 2020-03-18 Dow Silicones Corporation Thermally conductive grease and methods and devices in which said grease is used
JP5152108B2 (en) * 2009-06-18 2013-02-27 Ｊｓｒ株式会社 Thermally conductive resin composition and thermally conductive film
WO2013089861A1 (en) * 2011-12-12 2013-06-20 Texas State University-San Marcos Varistor-transistor hybrid devices
EP2839507A4 (en) * 2012-04-17 2015-12-02 Momentive Performance Mat Inc Thermally conductive polymer compostions to reduce molding cycle time
KR101412774B1 (en) * 2012-07-27 2014-07-02 서울대학교산학협력단 Porous boron nitride and method for preparing the same
JP5934064B2 (en) * 2012-09-06 2016-06-15 ダイセルポリマー株式会社 Additive for thermoplastic resin
WO2014065910A1 (en) * 2012-10-26 2014-05-01 Laird Technologies, Inc. Thermally conductive polymer composites containing magnesium silicate and boron nitride
WO2015105106A1 (en) * 2014-01-08 2015-07-16 Jnc株式会社 Resin composition for heat-conductive sheet, heat-conductive sheet, resin-coated metal, and electronic device
JP2017520633A (en) * 2014-04-30 2017-07-27 ロジャーズ コーポレーション Thermally conductive composite material, method for producing the same, and article containing the composite material
TWI631179B (en) * 2014-05-21 2018-08-01 Toyobo Co., Ltd. Polyamine resin composition and method for improving heat aging resistance of polyamine resin
EP3157994B1 (en) * 2014-06-19 2022-05-04 LG Innotek Co., Ltd. Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the composition
EP3023456B1 (en) * 2014-11-18 2019-06-19 Miba Gleitlager Austria GmbH Sliding bearing element
WO2017086289A1 (en) * 2015-11-19 2017-05-26 東洋紡株式会社 High-melt-viscosity polyamide resin composition
JP6721692B2 (en) 2016-02-01 2020-07-15 キャボット コーポレイションＣａｂｏｔ Ｃｏｒｐｏｒａｔｉｏｎ Thermally conductive polymer composition containing carbon black
EP3839005B1 (en) * 2016-10-12 2023-07-19 Honeywell International Inc. Thermal interface materials including coloring agent
CN106385161B (en) * 2016-10-31 2018-10-12 江苏科岭能源科技有限公司 A kind of high-power air-cooled permanent-magnet speed governor
CN108638608A (en) * 2018-05-09 2018-10-12 苏州明上系统科技有限公司 A kind of high-hardness metal material
CN109439188B (en) * 2018-11-15 2020-09-11 北京林业大学 Super-hydrophobic photo-thermal coating and preparation method thereof
CN109880043B (en) * 2019-01-07 2021-04-20 江苏大学 Preparation method and anti-ultraviolet application of nano iron titanate modified polyurethane prepolymer
US11411263B2 (en) * 2019-03-06 2022-08-09 Laird Technologies, Inc. Thermal management and/or EMI mitigation materials including coated fillers
JP7435294B2 (en) 2020-06-17 2024-02-21 株式会社豊田中央研究所 High thermal conductivity grease composition
TW202248398A (en) * 2021-03-12 2022-12-16 日商拓自達電線股份有限公司 Thermally conductive sheet
TW202407077A (en) * 2022-06-22 2024-02-16 德商漢高股份有限及兩合公司 Thermal interface materials with soft filler dispersions

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3684836D1 (en) * 1985-07-29 1992-05-21 Shiseido Co Ltd POWDER COVERED WITH SILICONE POLYMER OR PARTICULAR MATERIAL.
US4849284A (en) * 1987-02-17 1989-07-18 Rogers Corporation Electrical substrate material
US4869954A (en) * 1987-09-10 1989-09-26 Chomerics, Inc. Thermally conductive materials
US5194480A (en) * 1991-05-24 1993-03-16 W. R. Grace & Co.-Conn. Thermally conductive elastomer
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
US5234712A (en) * 1992-06-08 1993-08-10 The Dow Chemical Company Method of making moisture resistant aluminum nitride powder and powder produced thereby
JPH08183906A (en) * 1994-12-28 1996-07-16 Shin Etsu Chem Co Ltd Suspension of boron nitride
DE19620942A1 (en) * 1995-06-05 1996-12-12 Gen Electric Efficient process for hydrophobicizing inorganic powder
JPH11134944A (en) * 1997-10-28 1999-05-21 Fujikura Ltd Highly thermally conductive insulating material and superconductive cable
JP3290127B2 (en) * 1998-01-27 2002-06-10 松下電工株式会社 Heat conductive silicone rubber composition and heat dissipation sheet comprising the heat conductive silicone rubber composition

Also Published As

Publication number Publication date
JP2006241470A (en) 2006-09-14
JP2003509578A (en) 2003-03-11
WO2001021393A1 (en) 2001-03-29
AU3886801A (en) 2001-04-24
GB2370040A (en) 2002-06-19
GB2370040A8 (en) 2002-06-19
GB2370040B (en) 2003-10-29
DE10085011T1 (en) 2003-01-16

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20110920