GB0130524D0 - Surface acoustic wave apparatus and manufacturing method therefor - Google Patents
Surface acoustic wave apparatus and manufacturing method thereforInfo
- Publication number
- GB0130524D0 GB0130524D0 GBGB0130524.2A GB0130524A GB0130524D0 GB 0130524 D0 GB0130524 D0 GB 0130524D0 GB 0130524 A GB0130524 A GB 0130524A GB 0130524 D0 GB0130524 D0 GB 0130524D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- manufacturing
- acoustic wave
- surface acoustic
- method therefor
- wave apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000010897 surface acoustic wave method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02897—Means for compensation or elimination of undesirable effects of strain or mechanical damage, e.g. strain due to bending influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0300791A GB2381976B (en) | 2000-12-26 | 2001-12-20 | Surface acoustic wave apparatus and manufacturing method therefor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000395515 | 2000-12-26 | ||
JP2001297021A JP3925133B2 (en) | 2000-12-26 | 2001-09-27 | Method for manufacturing surface acoustic wave device and surface acoustic wave device |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0130524D0 true GB0130524D0 (en) | 2002-02-06 |
GB2374993A GB2374993A (en) | 2002-10-30 |
GB2374993B GB2374993B (en) | 2003-04-23 |
Family
ID=26606690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0130524A Expired - Lifetime GB2374993B (en) | 2000-12-26 | 2001-12-20 | Surface acoustic wave apparatus and manufacturing method therefor |
Country Status (7)
Country | Link |
---|---|
US (2) | US6792656B2 (en) |
JP (1) | JP3925133B2 (en) |
KR (1) | KR20020052958A (en) |
CN (1) | CN1180530C (en) |
DE (1) | DE10163297B4 (en) |
GB (1) | GB2374993B (en) |
TW (1) | TW589787B (en) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003087080A (en) * | 2001-07-06 | 2003-03-20 | Murata Mfg Co Ltd | Surface acoustic wave element and manufacturing method therefor |
JP2004129224A (en) * | 2002-07-31 | 2004-04-22 | Murata Mfg Co Ltd | Piezoelectric component and manufacturing method thereof |
JP3646116B2 (en) | 2003-07-17 | 2005-05-11 | Tdk株式会社 | Surface acoustic wave device, surface acoustic wave device, surface acoustic wave duplexer, and method of manufacturing surface acoustic wave device |
JP4419732B2 (en) | 2003-09-02 | 2010-02-24 | 株式会社村田製作所 | Surface acoustic wave device and manufacturing method thereof |
JP2005117151A (en) * | 2003-10-03 | 2005-04-28 | Murata Mfg Co Ltd | Method of manufacturing surface acoustic wave device and surface acoustic wave device |
JP4556568B2 (en) * | 2004-09-03 | 2010-10-06 | パナソニック株式会社 | Manufacturing method of surface acoustic wave device |
DE102005009358B4 (en) * | 2005-03-01 | 2021-02-04 | Snaptrack, Inc. | Solderable Contact and Method of Manufacture |
US8143681B2 (en) * | 2006-04-20 | 2012-03-27 | The George Washington University | Saw devices, processes for making them, and methods of use |
US20100007444A1 (en) * | 2006-04-20 | 2010-01-14 | Anis Nurashikin Nordin | GHz Surface Acoustic Resonators in RF-CMOS |
WO2007125724A1 (en) * | 2006-04-28 | 2007-11-08 | Murata Manufacturing Co., Ltd. | Electronic component and method for manufacturing same |
US20090124513A1 (en) * | 2007-04-20 | 2009-05-14 | Patricia Berg | Multiplex Biosensor |
US8018010B2 (en) * | 2007-04-20 | 2011-09-13 | The George Washington University | Circular surface acoustic wave (SAW) devices, processes for making them, and methods of use |
US7958390B2 (en) * | 2007-05-15 | 2011-06-07 | Sandisk Corporation | Memory device for repairing a neighborhood of rows in a memory array using a patch table |
JP5197156B2 (en) * | 2007-06-19 | 2013-05-15 | キヤノン株式会社 | Wiring board |
WO2009016906A1 (en) | 2007-07-30 | 2009-02-05 | Murata Manufacturing Co., Ltd. | Elastic wave device and method for manufacturing the same |
JP4468436B2 (en) * | 2007-12-25 | 2010-05-26 | 富士通メディアデバイス株式会社 | Elastic wave device and manufacturing method thereof |
DE102008020783A1 (en) * | 2008-04-25 | 2009-10-29 | Epcos Ag | Filter chip with different conductive layers and method of manufacture |
DE102008062605B4 (en) | 2008-12-17 | 2018-10-18 | Snaptrack, Inc. | Component that works with acoustic waves, and method for its production |
JP5558158B2 (en) * | 2009-03-27 | 2014-07-23 | 京セラ株式会社 | Surface acoustic wave device and manufacturing method thereof |
CN102449906B (en) * | 2010-03-18 | 2014-10-01 | 松下电器产业株式会社 | Mems element, and manufacturing method of mems element |
US8960004B2 (en) | 2010-09-29 | 2015-02-24 | The George Washington University | Synchronous one-pole surface acoustic wave resonator |
CA2930648A1 (en) * | 2013-11-22 | 2015-05-28 | Sunnybrook Health Sciences Centre | Ultrasonic transducer with backing having spatially segmented surface |
CN106031031B (en) | 2014-02-18 | 2019-03-08 | 天工滤波方案日本有限公司 | Acoustic elecment and the ladder type filter for using acoustic elecment |
CN104015422A (en) * | 2014-06-19 | 2014-09-03 | 苏州普京真空技术有限公司 | Composite quartz crystal oscillation sheet |
KR101625450B1 (en) | 2014-11-05 | 2016-05-30 | (주)와이솔 | Surface Acoustic Wave Filter and Method for manufacturing |
JP6444787B2 (en) * | 2015-03-23 | 2018-12-26 | 太陽誘電株式会社 | Elastic wave device and manufacturing method thereof |
JP6402704B2 (en) * | 2015-11-19 | 2018-10-10 | 株式会社村田製作所 | Elastic wave device, duplexer and multiplexer |
CN105631106B (en) * | 2015-12-25 | 2018-11-20 | 北京航天微电科技有限公司 | A kind of high-frequency sound surface wave device acoustic-electric collaboration full-wave simulation method |
GB2571361B (en) * | 2018-03-02 | 2020-04-22 | Novosound Ltd | Ultrasound array transducer manufacturing |
CN108493325A (en) * | 2018-04-03 | 2018-09-04 | 清华大学 | A kind of high-frequency high-performance SAW device and preparation method thereof |
CN111200410B (en) * | 2018-11-16 | 2023-03-21 | 开元通信技术(厦门)有限公司 | Wafer-level packaging structure of acoustic wave device and preparation method thereof |
CN111786652B (en) * | 2019-04-04 | 2022-05-10 | 中芯集成电路(宁波)有限公司上海分公司 | Bulk acoustic wave resonator, method of manufacturing the same, filter, and radio frequency communication system |
CN110011633A (en) * | 2019-04-25 | 2019-07-12 | 北京中科飞鸿科技有限公司 | A kind of SAW filter preparation method with positive photoresist high adhesion force |
CN110927996A (en) * | 2019-12-16 | 2020-03-27 | 福建福晶科技股份有限公司 | Bonding structure and preparation of acousto-optic crystal and transducer |
CN115567027B (en) * | 2022-11-03 | 2023-07-07 | 常州承芯半导体有限公司 | Transducer, surface acoustic wave resonator, method of forming the same, and filter |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5643816A (en) * | 1979-09-17 | 1981-04-22 | Hitachi Ltd | Structure of bonding pad part |
JPS62173813A (en) * | 1986-01-28 | 1987-07-30 | Alps Electric Co Ltd | Surface acoustic wave element |
JPS63127610A (en) | 1986-11-17 | 1988-05-31 | Toshiba Corp | Manufacture of surface acoustic wave device |
JPH01103010A (en) | 1987-10-16 | 1989-04-20 | Hitachi Denshi Ltd | Manufacture of surface acoustic wave device |
JPH0248811A (en) | 1988-08-10 | 1990-02-19 | Mitsubishi Electric Corp | Surface acoustic wave element |
JPH09214280A (en) | 1996-02-08 | 1997-08-15 | Japan Radio Co Ltd | Surface elastic wave element |
JP3275775B2 (en) * | 1997-05-16 | 2002-04-22 | 株式会社村田製作所 | Surface acoustic wave device |
JPH11312943A (en) | 1998-04-28 | 1999-11-09 | Murata Mfg Co Ltd | Production of surface acoustic wave device |
JP3296356B2 (en) | 1999-02-08 | 2002-06-24 | 松下電器産業株式会社 | Surface acoustic wave device and method of manufacturing the same |
JP2000286662A (en) * | 1999-03-31 | 2000-10-13 | Toyo Commun Equip Co Ltd | Saw device and its production and structure of saw device |
JP3317274B2 (en) * | 1999-05-26 | 2002-08-26 | 株式会社村田製作所 | Surface acoustic wave device and method of manufacturing surface acoustic wave device |
JP3368885B2 (en) * | 2000-03-15 | 2003-01-20 | 株式会社村田製作所 | Manufacturing method of surface acoustic wave device |
JP3435639B2 (en) * | 2000-04-13 | 2003-08-11 | 株式会社村田製作所 | Method of manufacturing surface acoustic wave device and surface acoustic wave device |
JP3405329B2 (en) * | 2000-07-19 | 2003-05-12 | 株式会社村田製作所 | Surface wave device |
US6518860B2 (en) * | 2001-01-05 | 2003-02-11 | Nokia Mobile Phones Ltd | BAW filters having different center frequencies on a single substrate and a method for providing same |
JP2003087080A (en) * | 2001-07-06 | 2003-03-20 | Murata Mfg Co Ltd | Surface acoustic wave element and manufacturing method therefor |
-
2001
- 2001-09-27 JP JP2001297021A patent/JP3925133B2/en not_active Expired - Lifetime
- 2001-12-14 TW TW090131016A patent/TW589787B/en not_active IP Right Cessation
- 2001-12-20 GB GB0130524A patent/GB2374993B/en not_active Expired - Lifetime
- 2001-12-21 DE DE10163297A patent/DE10163297B4/en not_active Expired - Lifetime
- 2001-12-21 KR KR1020010082648A patent/KR20020052958A/en active Search and Examination
- 2001-12-26 US US10/025,901 patent/US6792656B2/en not_active Expired - Lifetime
- 2001-12-26 CN CNB011452145A patent/CN1180530C/en not_active Expired - Lifetime
-
2004
- 2004-03-23 US US10/806,404 patent/US7112913B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR20020052958A (en) | 2002-07-04 |
CN1365187A (en) | 2002-08-21 |
TW589787B (en) | 2004-06-01 |
DE10163297A1 (en) | 2002-07-25 |
US7112913B2 (en) | 2006-09-26 |
GB2374993B (en) | 2003-04-23 |
GB2374993A (en) | 2002-10-30 |
CN1180530C (en) | 2004-12-15 |
JP2002261560A (en) | 2002-09-13 |
US20020121841A1 (en) | 2002-09-05 |
US20040178698A1 (en) | 2004-09-16 |
JP3925133B2 (en) | 2007-06-06 |
US6792656B2 (en) | 2004-09-21 |
DE10163297B4 (en) | 2010-12-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE20 | Patent expired after termination of 20 years |
Expiry date: 20211219 |