GB0123807D0 - Method for forming a package for electronic components and package for electronic components - Google Patents

Method for forming a package for electronic components and package for electronic components

Info

Publication number
GB0123807D0
GB0123807D0 GB0123807A GB0123807A GB0123807D0 GB 0123807 D0 GB0123807 D0 GB 0123807D0 GB 0123807 A GB0123807 A GB 0123807A GB 0123807 A GB0123807 A GB 0123807A GB 0123807 D0 GB0123807 D0 GB 0123807D0
Authority
GB
United Kingdom
Prior art keywords
package
electronic components
forming
electronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0123807A
Other versions
GB2380613A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to GB0123807A priority Critical patent/GB2380613A/en
Publication of GB0123807D0 publication Critical patent/GB0123807D0/en
Priority to PCT/EP2002/010685 priority patent/WO2003032391A2/en
Priority to AU2002337129A priority patent/AU2002337129A1/en
Publication of GB2380613A publication Critical patent/GB2380613A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB0123807A 2001-10-04 2001-10-04 Package for electronic components and method for forming such a package Withdrawn GB2380613A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB0123807A GB2380613A (en) 2001-10-04 2001-10-04 Package for electronic components and method for forming such a package
PCT/EP2002/010685 WO2003032391A2 (en) 2001-10-04 2002-09-23 Method for forming a package for electronic components and package for electronic components
AU2002337129A AU2002337129A1 (en) 2001-10-04 2002-09-23 Method for forming a package for electronic components and package for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0123807A GB2380613A (en) 2001-10-04 2001-10-04 Package for electronic components and method for forming such a package

Publications (2)

Publication Number Publication Date
GB0123807D0 true GB0123807D0 (en) 2001-11-21
GB2380613A GB2380613A (en) 2003-04-09

Family

ID=9923207

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0123807A Withdrawn GB2380613A (en) 2001-10-04 2001-10-04 Package for electronic components and method for forming such a package

Country Status (3)

Country Link
AU (1) AU2002337129A1 (en)
GB (1) GB2380613A (en)
WO (1) WO2003032391A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113410193A (en) * 2021-05-27 2021-09-17 力成科技（苏州）有限公司 8+1 heap chip package device
CN113410193B (en) * 2021-05-27 2024-05-03 元成科技(苏州)有限公司 8+1 Stacked chip packaging device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005026233B4 (en) * 2005-06-07 2008-08-07 Tyco Electronics Ec Kft Electric power module
DE102009015757A1 (en) * 2009-04-01 2010-10-14 Siemens Aktiengesellschaft Pressure support for an electronic circuit
DE102017212233A1 (en) 2017-07-18 2019-01-24 Siemens Aktiengesellschaft Electrical assembly and method of making an electrical assembly
WO2024041759A1 (en) * 2022-08-24 2024-02-29 Microchip Technology Caldicot Limited Electronic device package including a gel

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2136212B (en) * 1983-01-06 1986-10-15 Welwyn Electronics Ltd Cooling components on printed circuit boards
DE4111247C3 (en) * 1991-04-08 1996-11-21 Export Contor Ausenhandelsgese Circuit arrangement
JPH0629459A (en) * 1992-07-08 1994-02-04 Mitsubishi Electric Corp Semiconductor device and manufacture thereof
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
US5455458A (en) * 1993-08-09 1995-10-03 Hughes Aircraft Company Phase change cooling of semiconductor power modules
DE19533298A1 (en) * 1995-09-08 1997-03-13 Siemens Ag Electronic module with power components
JPH11297906A (en) * 1998-03-23 1999-10-29 Motorola Inc Electronic assembly and its manufacture

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113410193A (en) * 2021-05-27 2021-09-17 力成科技（苏州）有限公司 8+1 heap chip package device
CN113410193B (en) * 2021-05-27 2024-05-03 元成科技(苏州)有限公司 8+1 Stacked chip packaging device

Also Published As

Publication number Publication date
AU2002337129A1 (en) 2003-04-22
GB2380613A (en) 2003-04-09
WO2003032391A3 (en) 2004-01-29
WO2003032391A2 (en) 2003-04-17

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)