WO2003032391A3 - Method for forming a package for electronic components and package for electronic components - Google Patents

Method for forming a package for electronic components and package for electronic components Download PDF

Info

Publication number
WO2003032391A3
WO2003032391A3 PCT/EP2002/010685 EP0210685W WO03032391A3 WO 2003032391 A3 WO2003032391 A3 WO 2003032391A3 EP 0210685 W EP0210685 W EP 0210685W WO 03032391 A3 WO03032391 A3 WO 03032391A3
Authority
WO
WIPO (PCT)
Prior art keywords
package
electronic components
forming
flexible substrate
heat sink
Prior art date
Application number
PCT/EP2002/010685
Other languages
French (fr)
Other versions
WO2003032391A2 (en
Inventor
Torsten Hauck
Joerg Strogies
Anton Johann Kolbeck
Christina Bohm
Original Assignee
Motorola Inc
Torsten Hauck
Joerg Strogies
Anton Johann Kolbeck
Christina Bohm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc, Torsten Hauck, Joerg Strogies, Anton Johann Kolbeck, Christina Bohm filed Critical Motorola Inc
Priority to AU2002337129A priority Critical patent/AU2002337129A1/en
Publication of WO2003032391A2 publication Critical patent/WO2003032391A2/en
Publication of WO2003032391A3 publication Critical patent/WO2003032391A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A package (30) for electronic components comprises substantially sheet-like elements in a stack: a heat sink (32); a flexible substrate (34) carrying at least one conductor layer (36) and at least one electronic component (40); a gap filler (42); and a lid (44); wherein the gap filler applies a pressure to the flexible substrate such that the flexible substrate and the heat sink are in mechanical contact. The method of forming the package is performed without an adhesive being used. The package can easily be combined with ribbon cables.
PCT/EP2002/010685 2001-10-04 2002-09-23 Method for forming a package for electronic components and package for electronic components WO2003032391A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002337129A AU2002337129A1 (en) 2001-10-04 2002-09-23 Method for forming a package for electronic components and package for electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0123807.0 2001-10-04
GB0123807A GB2380613A (en) 2001-10-04 2001-10-04 Package for electronic components and method for forming such a package

Publications (2)

Publication Number Publication Date
WO2003032391A2 WO2003032391A2 (en) 2003-04-17
WO2003032391A3 true WO2003032391A3 (en) 2004-01-29

Family

ID=9923207

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/010685 WO2003032391A2 (en) 2001-10-04 2002-09-23 Method for forming a package for electronic components and package for electronic components

Country Status (3)

Country Link
AU (1) AU2002337129A1 (en)
GB (1) GB2380613A (en)
WO (1) WO2003032391A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005026233B4 (en) * 2005-06-07 2008-08-07 Tyco Electronics Ec Kft Electric power module
DE102009015757A1 (en) * 2009-04-01 2010-10-14 Siemens Aktiengesellschaft Pressure support for an electronic circuit
DE102017212233A1 (en) 2017-07-18 2019-01-24 Siemens Aktiengesellschaft Electrical assembly and method of making an electrical assembly
WO2024041759A1 (en) * 2022-08-24 2024-02-29 Microchip Technology Caldicot Limited Electronic device package including a gel

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0116396A2 (en) * 1983-01-06 1984-08-22 Crystalate Electronics Limited Electrical assembly
DE4316639A1 (en) * 1992-07-08 1994-01-13 Mitsubishi Electric Corp Semiconductor device and method for its manufacture
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
US5808868A (en) * 1995-09-08 1998-09-15 Siemens Aktiengesellschaft Electronic module with power components
US6154369A (en) * 1998-03-23 2000-11-28 Motorola, Inc. Electronic assembly for removing heat from a semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4111247C3 (en) * 1991-04-08 1996-11-21 Export Contor Ausenhandelsgese Circuit arrangement
US5455458A (en) * 1993-08-09 1995-10-03 Hughes Aircraft Company Phase change cooling of semiconductor power modules

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0116396A2 (en) * 1983-01-06 1984-08-22 Crystalate Electronics Limited Electrical assembly
DE4316639A1 (en) * 1992-07-08 1994-01-13 Mitsubishi Electric Corp Semiconductor device and method for its manufacture
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
US5808868A (en) * 1995-09-08 1998-09-15 Siemens Aktiengesellschaft Electronic module with power components
US6154369A (en) * 1998-03-23 2000-11-28 Motorola, Inc. Electronic assembly for removing heat from a semiconductor device

Also Published As

Publication number Publication date
GB0123807D0 (en) 2001-11-21
AU2002337129A1 (en) 2003-04-22
GB2380613A (en) 2003-04-09
WO2003032391A2 (en) 2003-04-17

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