FR3127098B3 - Structure de dissipation de chaleur - Google Patents

Structure de dissipation de chaleur Download PDF

Info

Publication number
FR3127098B3
FR3127098B3 FR2200581A FR2200581A FR3127098B3 FR 3127098 B3 FR3127098 B3 FR 3127098B3 FR 2200581 A FR2200581 A FR 2200581A FR 2200581 A FR2200581 A FR 2200581A FR 3127098 B3 FR3127098 B3 FR 3127098B3
Authority
FR
France
Prior art keywords
heat dissipation
dissipation structure
substrate
electronic component
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2200581A
Other languages
English (en)
Other versions
FR3127098A3 (fr
Inventor
Su-Wei Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TMY Technology Inc
Original Assignee
TMY Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TMY Technology Inc filed Critical TMY Technology Inc
Publication of FR3127098A3 publication Critical patent/FR3127098A3/fr
Application granted granted Critical
Publication of FR3127098B3 publication Critical patent/FR3127098B3/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Structure de dissipation de chaleur (100) incluant un substrat (110), un composant électronique (120), un blindage (130) et un matériau thermoconducteur (140). Le substrat (110) présente une surface porteuse (110a). Le composant électronique (120) est disposé sur la surface porteuse (110a). Le blindage (130) recouvre le composant électronique (120) et forme une cavité (C) avec le substrat (110). Le matériau thermoconducteur (140) remplit la cavité (C). Figure de l’abrégé : Figure 1
FR2200581A 2021-09-11 2022-01-24 Structure de dissipation de chaleur Active FR3127098B3 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TW110210791 2021-09-11
TW110210791 2021-09-11
TW110215173U TWM627696U (zh) 2021-09-11 2021-12-21 散熱結構

Publications (2)

Publication Number Publication Date
FR3127098A3 FR3127098A3 (fr) 2023-03-17
FR3127098B3 true FR3127098B3 (fr) 2024-01-05

Family

ID=79191039

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2200581A Active FR3127098B3 (fr) 2021-09-11 2022-01-24 Structure de dissipation de chaleur

Country Status (3)

Country Link
JP (1) JP3235529U (fr)
FR (1) FR3127098B3 (fr)
TW (1) TWM627696U (fr)

Also Published As

Publication number Publication date
JP3235529U (ja) 2022-01-06
TWM627696U (zh) 2022-06-01
FR3127098A3 (fr) 2023-03-17

Similar Documents

Publication Publication Date Title
MY134807A (en) Electronic assembly comprising solderable thermal interface and methods of manufacture
ATE381248T1 (de) Flexible zwischenschaltungsstrukturen für elektrische geräte und lichtquellen mit derartigen strukturen
FR3061600B1 (fr) Dispositif electronique comprenant une puce rainuree
US7269015B2 (en) Heat sink interface insert
MY122916A (en) An electronic assembly having a wetting layer on a thermally conductive heat spreader
EP1394857A3 (fr) Dispositif semiconducteur
NO20044695L (no) Kortniva EMI skjerm med forhoyet termisk avledning
TW200726340A (en) Circuit device and manufacturing method of the same
MY166632A (en) Reactive solder material
FR3116383B1 (fr) Boîtier de circuit intégré avec dissipateur thermique et procédé de fabrication
EP1065916A3 (fr) Dispositif électronique enrobé dans la résine
EP0930648A3 (fr) Boítier semi-conducteur et module semi-conducteur utilisant le boítier
GB9909600D0 (en) Ceramic electronic part and mounting structure for the same
FR2426992A1 (fr) Laser a semiconducteur et fabrication de ce laser
FR3127098B3 (fr) Structure de dissipation de chaleur
CN111029380A (zh) 显示装置
EP1253636A4 (fr) Equipement electronique
DK24486A (da) Montering af halvlederchips
US20210398872A1 (en) Chip scale package structure of heat-dissipating type
ATE357741T1 (de) Leistungshalbleitermodul mit sensorikbauteil
JPS5478982A (en) Semiconductor device and its manufacture
FR3129809B1 (fr) Dissipation de chaleur
EP1091617A3 (fr) Dispositif à semi-conducteur
ATE466991T1 (de) Bügeleisen
FR3102832B1 (fr) Ensemble de sources lumineuses, dispositif d'éclairage automobile et procédé de fabrication

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5