FR3125941B1 - MULTILAYER PRINTED CIRCUIT BOARD - Google Patents

MULTILAYER PRINTED CIRCUIT BOARD Download PDF

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Publication number
FR3125941B1
FR3125941B1 FR2108248A FR2108248A FR3125941B1 FR 3125941 B1 FR3125941 B1 FR 3125941B1 FR 2108248 A FR2108248 A FR 2108248A FR 2108248 A FR2108248 A FR 2108248A FR 3125941 B1 FR3125941 B1 FR 3125941B1
Authority
FR
France
Prior art keywords
printed circuit
circuit board
multilayer printed
layers
metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2108248A
Other languages
French (fr)
Other versions
FR3125941A1 (en
Inventor
Geoffroy Aupee
Pierre-Yves Michaud
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR2108248A priority Critical patent/FR3125941B1/en
Application filed by Thales SA filed Critical Thales SA
Priority to US17/875,683 priority patent/US20230032026A1/en
Priority to JP2022120997A priority patent/JP2023021066A/en
Priority to EP22187479.5A priority patent/EP4125309A1/en
Priority to TW111128388A priority patent/TW202318944A/en
Priority to CN202210904163.7A priority patent/CN115696720A/en
Priority to KR1020220094935A priority patent/KR20230018350A/en
Publication of FR3125941A1 publication Critical patent/FR3125941A1/en
Application granted granted Critical
Publication of FR3125941B1 publication Critical patent/FR3125941B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Les modes de réalisation de l’invention fournissent une carte de circuits imprimés multicouche (10) destinée à connecter des composants électroniques (304), la carte (10) comprenant un empilement de plusieurs couches conductrices (100), les couches conductrices (100) comprenant deux couches en surface (101) et une ou plusieurs couches internes (102), la carte (10) comprenant un ou plusieurs trous de type contre-percé (202), chaque trou de type contre-percé (202) comprenant une partie avec métallisation (2021) s’ouvrant sur l’une des deux couches en surface (101) et une partie sans métallisation (2022) s’ouvrant sur l’autre couche en surface (101), la carte de circuits imprimés multicouche (10) peut avantageusement comprendre une ou plusieurs pastilles métalliques d’isolation (301), chaque pastille métallique d’isolation (301) étant assemblée sur l’une des deux couches en surface (101) de manière à venir occulter un trou de type contre-percé (202) correspondant au niveau de sa partie sans métallisation (2022). Figure pour l’abrégé : Fig. 2Embodiments of the invention provide a multilayer printed circuit board (10) for connecting electronic components (304), the board (10) comprising a stack of a plurality of conductive layers (100), the conductive layers (100) comprising two surface layers (101) and one or more internal layers (102), the card (10) comprising one or more counter-drilled type holes (202), each counter-drilled type hole (202) comprising a part with metallization (2021) opening onto one of the two surface layers (101) and a part without metallization (2022) opening onto the other surface layer (101), the multilayer printed circuit board (10 ) can advantageously comprise one or more metal insulation pads (301), each metal insulation pad (301) being assembled on one of the two surface layers (101) so as to obscure a counter-type hole pierced (202) corresponding to the level of its part without metallization (2022). Figure for abstract: Fig. 2

FR2108248A 2021-07-29 2021-07-29 MULTILAYER PRINTED CIRCUIT BOARD Active FR3125941B1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR2108248A FR3125941B1 (en) 2021-07-29 2021-07-29 MULTILAYER PRINTED CIRCUIT BOARD
JP2022120997A JP2023021066A (en) 2021-07-29 2022-07-28 multilayer printed circuit board
EP22187479.5A EP4125309A1 (en) 2021-07-29 2022-07-28 Multi-layer printed circuit board
TW111128388A TW202318944A (en) 2021-07-29 2022-07-28 Multilayer printed circuit board
US17/875,683 US20230032026A1 (en) 2021-07-29 2022-07-28 Multilayer printed circuit board
CN202210904163.7A CN115696720A (en) 2021-07-29 2022-07-29 Multilayer printed circuit board
KR1020220094935A KR20230018350A (en) 2021-07-29 2022-07-29 Multilayer printed circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2108248 2021-07-29
FR2108248A FR3125941B1 (en) 2021-07-29 2021-07-29 MULTILAYER PRINTED CIRCUIT BOARD

Publications (2)

Publication Number Publication Date
FR3125941A1 FR3125941A1 (en) 2023-02-03
FR3125941B1 true FR3125941B1 (en) 2023-11-03

Family

ID=80113291

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2108248A Active FR3125941B1 (en) 2021-07-29 2021-07-29 MULTILAYER PRINTED CIRCUIT BOARD

Country Status (7)

Country Link
US (1) US20230032026A1 (en)
EP (1) EP4125309A1 (en)
JP (1) JP2023021066A (en)
KR (1) KR20230018350A (en)
CN (1) CN115696720A (en)
FR (1) FR3125941B1 (en)
TW (1) TW202318944A (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7364461B1 (en) * 2007-02-28 2008-04-29 Sv Probe Pte. Ltd. Direct attachment of coaxial cables
CN112888152B (en) * 2014-11-21 2024-06-07 安费诺公司 Matched backboard for high-speed and high-density electric connector
US10973122B1 (en) * 2020-05-29 2021-04-06 Hewlett Packard Enterprise Development Lp Differential via stack

Also Published As

Publication number Publication date
EP4125309A1 (en) 2023-02-01
TW202318944A (en) 2023-05-01
CN115696720A (en) 2023-02-03
JP2023021066A (en) 2023-02-09
FR3125941A1 (en) 2023-02-03
KR20230018350A (en) 2023-02-07
US20230032026A1 (en) 2023-02-02

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