FR3124308B1 - Puce électronique - Google Patents

Puce électronique Download PDF

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Publication number
FR3124308B1
FR3124308B1 FR2106460A FR2106460A FR3124308B1 FR 3124308 B1 FR3124308 B1 FR 3124308B1 FR 2106460 A FR2106460 A FR 2106460A FR 2106460 A FR2106460 A FR 2106460A FR 3124308 B1 FR3124308 B1 FR 3124308B1
Authority
FR
France
Prior art keywords
chip
whose
electronic chip
equal
rectangle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2106460A
Other languages
English (en)
Other versions
FR3124308A1 (fr
Inventor
Francois Tailliet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Rousset SAS
Original Assignee
STMicroelectronics Rousset SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Rousset SAS filed Critical STMicroelectronics Rousset SAS
Priority to FR2106460A priority Critical patent/FR3124308B1/fr
Priority to US17/839,976 priority patent/US20220406668A1/en
Priority to CN202221516806.2U priority patent/CN218568823U/zh
Priority to CN202210686837.0A priority patent/CN115497887A/zh
Publication of FR3124308A1 publication Critical patent/FR3124308A1/fr
Application granted granted Critical
Publication of FR3124308B1 publication Critical patent/FR3124308B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Puce électronique La présente description concerne une puce électronique (40A, 40B) comprenant un anneau d'étanchéité (41) dont la forme est contenue dans un rectangle dont la largeur est égale à la largeur maximale de ladite puce, et dont la longueur est égale à la longueur maximale de ladite puce, et au moins un plot de test (45) disposé au moins partiellement dans ledit rectangle, ledit plot de test (45) étant partagé avec au moins une autre puce électronique (40A, 40B). Figure pour l'abrégé : Fig. 4
FR2106460A 2021-06-17 2021-06-17 Puce électronique Active FR3124308B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR2106460A FR3124308B1 (fr) 2021-06-17 2021-06-17 Puce électronique
US17/839,976 US20220406668A1 (en) 2021-06-17 2022-06-14 Electronic chip
CN202221516806.2U CN218568823U (zh) 2021-06-17 2022-06-16 电子芯片
CN202210686837.0A CN115497887A (zh) 2021-06-17 2022-06-16 电子芯片

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2106460 2021-06-17
FR2106460A FR3124308B1 (fr) 2021-06-17 2021-06-17 Puce électronique

Publications (2)

Publication Number Publication Date
FR3124308A1 FR3124308A1 (fr) 2022-12-23
FR3124308B1 true FR3124308B1 (fr) 2023-11-03

Family

ID=77021546

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2106460A Active FR3124308B1 (fr) 2021-06-17 2021-06-17 Puce électronique

Country Status (2)

Country Link
US (1) US20220406668A1 (fr)
FR (1) FR3124308B1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5285082A (en) * 1989-11-08 1994-02-08 U.S. Philips Corporation Integrated test circuits having pads provided along scribe lines
JPH09252034A (ja) * 1996-03-18 1997-09-22 Mitsubishi Electric Corp 半導体ウエハ，半導体装置及び半導体装置の製造方法
US8680653B2 (en) * 2007-11-12 2014-03-25 Infineon Technologies Ag Wafer and a method of dicing a wafer
US9287188B2 (en) * 2013-02-05 2016-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for a seal ring structure

Also Published As

Publication number Publication date
US20220406668A1 (en) 2022-12-22
FR3124308A1 (fr) 2022-12-23

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