FR3119963B1 - Electronic assembly comprising an improved heat dissipation system - Google Patents

Electronic assembly comprising an improved heat dissipation system Download PDF

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Publication number
FR3119963B1
FR3119963B1 FR2101460A FR2101460A FR3119963B1 FR 3119963 B1 FR3119963 B1 FR 3119963B1 FR 2101460 A FR2101460 A FR 2101460A FR 2101460 A FR2101460 A FR 2101460A FR 3119963 B1 FR3119963 B1 FR 3119963B1
Authority
FR
France
Prior art keywords
heat dissipation
dissipation system
electronic assembly
improved heat
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2101460A
Other languages
French (fr)
Other versions
FR3119963A1 (en
Inventor
Grergory Hodebourg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Systemes de Controle Moteur SAS
Original Assignee
Valeo Systemes de Controle Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Systemes de Controle Moteur SAS filed Critical Valeo Systemes de Controle Moteur SAS
Priority to FR2101460A priority Critical patent/FR3119963B1/en
Publication of FR3119963A1 publication Critical patent/FR3119963A1/en
Application granted granted Critical
Publication of FR3119963B1 publication Critical patent/FR3119963B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change

Abstract

La présente invention concerne un ensemble (100) électronique comportant un logement (1) électronique dans lequel sont disposés au moins un élément électronique et un système de dissipation de chaleur, les composants électroniques (3) sont disposés sur une surface de support (4), du logement (1) et le système de dissipation de chaleur (9) est disposé entre les composants électroniques (3) et la surface de support (4) caractérisé en ce que le système de dissipation de chaleur est formé par une couche de Graphene (9). Figure pour l’abrégé : Fig. 1.The present invention relates to an electronic assembly (100) comprising an electronic housing (1) in which at least one electronic element and a heat dissipation system are arranged, the electronic components (3) are arranged on a support surface (4) , of the housing (1) and the heat dissipation system (9) is arranged between the electronic components (3) and the support surface (4) characterized in that the heat dissipation system is formed by a layer of Graphene (9). Figure for abstract: Fig. 1.

FR2101460A 2021-02-16 2021-02-16 Electronic assembly comprising an improved heat dissipation system Active FR3119963B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR2101460A FR3119963B1 (en) 2021-02-16 2021-02-16 Electronic assembly comprising an improved heat dissipation system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2101460 2021-02-16
FR2101460A FR3119963B1 (en) 2021-02-16 2021-02-16 Electronic assembly comprising an improved heat dissipation system

Publications (2)

Publication Number Publication Date
FR3119963A1 FR3119963A1 (en) 2022-08-19
FR3119963B1 true FR3119963B1 (en) 2024-03-29

Family

ID=76523011

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2101460A Active FR3119963B1 (en) 2021-02-16 2021-02-16 Electronic assembly comprising an improved heat dissipation system

Country Status (1)

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FR (1) FR3119963B1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140130862A (en) * 2013-05-02 2014-11-12 현대모비스 주식회사 Power module having improved cooling performance
EP3410472A1 (en) * 2017-05-31 2018-12-05 ABB Schweiz AG Power electronic module cooling arrangement
US20190373768A1 (en) * 2018-05-31 2019-12-05 Hanon Systems Electronics cold plate
DE102020103028A1 (en) * 2019-03-06 2020-09-10 GM Global Technology Operations LLC COMPOSITE ARRANGEMENTS FOR THERMAL COOLING OF ELECTRONIC COMPONENTS
FR3098081B1 (en) * 2019-06-30 2023-06-16 Valeo Systemes De Controle Moteur Cooling circuit for electronics housing with power module

Also Published As

Publication number Publication date
FR3119963A1 (en) 2022-08-19

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