FR3115654B1 - Electronic assembly featuring an improved cooling system - Google Patents

Electronic assembly featuring an improved cooling system Download PDF

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Publication number
FR3115654B1
FR3115654B1 FR2011061A FR2011061A FR3115654B1 FR 3115654 B1 FR3115654 B1 FR 3115654B1 FR 2011061 A FR2011061 A FR 2011061A FR 2011061 A FR2011061 A FR 2011061A FR 3115654 B1 FR3115654 B1 FR 3115654B1
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France
Prior art keywords
cooling system
electronic assembly
improved cooling
electronic
assembly featuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2011061A
Other languages
French (fr)
Other versions
FR3115654A1 (en
Inventor
Grégory Hodebourg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Systemes de Controle Moteur SAS
Original Assignee
Valeo Systemes de Controle Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Valeo Systemes de Controle Moteur SAS filed Critical Valeo Systemes de Controle Moteur SAS
Priority to FR2011061A priority Critical patent/FR3115654B1/en
Publication of FR3115654A1 publication Critical patent/FR3115654A1/en
Application granted granted Critical
Publication of FR3115654B1 publication Critical patent/FR3115654B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Ensemble (100) électronique comportant un logement (1) électronique dans lequel sont disposés au moins un élément électronique et un système (10) de refroidissement, le système (10) de refroidissement comportant : - un circuit (2) de refroidissement, dans lequel circule un fluide de refroidissement, l’élément électronique étant disposé sur une surface de support (4) en contact avec le circuit (2) de refroidissement, - au moins un dissipateur (8) de chaleur disposé sur la face, des composants électroniques, opposée à la face en contact avec la surface (4) de contact. Figure pour l’abrégé : Fig. 1.Electronic assembly (100) comprising an electronic housing (1) in which are arranged at least one electronic element and a cooling system (10), the cooling system (10) comprising: - a cooling circuit (2), in which circulates a cooling fluid, the electronic element being arranged on a support surface (4) in contact with the cooling circuit (2), - at least one heat sink (8) arranged on the face, electronic components, opposite the face in contact with the contact surface (4). Figure for abstract: Fig. 1.

FR2011061A 2020-10-28 2020-10-28 Electronic assembly featuring an improved cooling system Active FR3115654B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR2011061A FR3115654B1 (en) 2020-10-28 2020-10-28 Electronic assembly featuring an improved cooling system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2011061A FR3115654B1 (en) 2020-10-28 2020-10-28 Electronic assembly featuring an improved cooling system
FR2011061 2020-10-28

Publications (2)

Publication Number Publication Date
FR3115654A1 FR3115654A1 (en) 2022-04-29
FR3115654B1 true FR3115654B1 (en) 2023-05-12

Family

ID=73699143

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2011061A Active FR3115654B1 (en) 2020-10-28 2020-10-28 Electronic assembly featuring an improved cooling system

Country Status (1)

Country Link
FR (1) FR3115654B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3127631A1 (en) * 2021-09-27 2023-03-31 Valeo Systemes De Controle Moteur Electronic assembly with an improved cooling element
FR3136142A1 (en) * 2022-05-30 2023-12-01 Valeo Systemes De Controle Moteur Electronic assembly comprising an improved heat dissipation system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008124430A (en) * 2006-10-18 2008-05-29 Hitachi Ltd Power semiconductor module
DE112009005537B3 (en) * 2008-04-09 2022-05-12 Fuji Electric Co., Ltd. Method of manufacturing a semiconductor device
CN104701274B (en) * 2013-12-10 2017-11-14 江苏宏微科技股份有限公司 Power model with double-radiator
CN110246808B (en) * 2018-03-09 2021-08-10 南京银茂微电子制造有限公司 Power module with reduced junction temperature and method of manufacturing the same
JP7153538B2 (en) * 2018-11-16 2022-10-14 日立Astemo株式会社 Power semiconductor module, power converter, and method for manufacturing power semiconductor module

Also Published As

Publication number Publication date
FR3115654A1 (en) 2022-04-29

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