FR3105748B1 - Dispositif pour traitement par laser et procédé de traitement au laser - Google Patents

Dispositif pour traitement par laser et procédé de traitement au laser Download PDF

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Publication number
FR3105748B1
FR3105748B1 FR1915606A FR1915606A FR3105748B1 FR 3105748 B1 FR3105748 B1 FR 3105748B1 FR 1915606 A FR1915606 A FR 1915606A FR 1915606 A FR1915606 A FR 1915606A FR 3105748 B1 FR3105748 B1 FR 3105748B1
Authority
FR
France
Prior art keywords
laser treatment
laser processing
laser
treatment method
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1915606A
Other languages
English (en)
Other versions
FR3105748A1 (fr
Inventor
Tiphaine Dupont
Mehdi Daanoune
Olivier Jeannin
Ivan-Christophe Robin
Florian Dupont
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aledia
Original Assignee
Aledia
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR1915606A priority Critical patent/FR3105748B1/fr
Application filed by Aledia filed Critical Aledia
Priority to CN202080089847.5A priority patent/CN114868241A/zh
Priority to JP2022539285A priority patent/JP2023508443A/ja
Priority to KR1020227022957A priority patent/KR20220119630A/ko
Priority to PCT/EP2020/087242 priority patent/WO2021130136A1/fr
Priority to US17/788,259 priority patent/US20230035764A1/en
Priority to EP20824294.1A priority patent/EP4082037A1/fr
Publication of FR3105748A1 publication Critical patent/FR3105748A1/fr
Application granted granted Critical
Publication of FR3105748B1 publication Critical patent/FR3105748B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/322—Bonding taking account of the properties of the material involved involving coated metal parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Integrated Circuits (AREA)
  • Semiconductor Lasers (AREA)
  • Laser Beam Processing (AREA)
  • Led Devices (AREA)

Abstract

Dispositif pour traitement par laser et procédé de traitement au laser La présente description concerne un dispositif (20) configuré pour un traitement au laser, comprenant un substrat (22) transparent pour le laser et des objets (30), chaque objet étant fixé au substrat par l'intermédiaire d'un cristal photonique (40). Figure pour l'abrégé : Fig. 2
FR1915606A 2019-12-26 2019-12-26 Dispositif pour traitement par laser et procédé de traitement au laser Active FR3105748B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR1915606A FR3105748B1 (fr) 2019-12-26 2019-12-26 Dispositif pour traitement par laser et procédé de traitement au laser
JP2022539285A JP2023508443A (ja) 2019-12-26 2020-12-18 レーザ処理デバイス及びレーザ処理方法
KR1020227022957A KR20220119630A (ko) 2019-12-26 2020-12-18 레이저 처리 장치 및 레이저 처리 방법
PCT/EP2020/087242 WO2021130136A1 (fr) 2019-12-26 2020-12-18 Dispositif pour traitement par laser et procédé de traitement au laser
CN202080089847.5A CN114868241A (zh) 2019-12-26 2020-12-18 激光处理装置和激光处理方法
US17/788,259 US20230035764A1 (en) 2019-12-26 2020-12-18 Laser treatment device and laser treatment method
EP20824294.1A EP4082037A1 (fr) 2019-12-26 2020-12-18 Dispositif pour traitement par laser et procédé de traitement au laser

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1915606 2019-12-26
FR1915606A FR3105748B1 (fr) 2019-12-26 2019-12-26 Dispositif pour traitement par laser et procédé de traitement au laser

Publications (2)

Publication Number Publication Date
FR3105748A1 FR3105748A1 (fr) 2021-07-02
FR3105748B1 true FR3105748B1 (fr) 2022-09-02

Family

ID=70918521

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1915606A Active FR3105748B1 (fr) 2019-12-26 2019-12-26 Dispositif pour traitement par laser et procédé de traitement au laser

Country Status (7)

Country Link
US (1) US20230035764A1 (fr)
EP (1) EP4082037A1 (fr)
JP (1) JP2023508443A (fr)
KR (1) KR20220119630A (fr)
CN (1) CN114868241A (fr)
FR (1) FR3105748B1 (fr)
WO (1) WO2021130136A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11908723B2 (en) 2021-12-03 2024-02-20 International Business Machines Corporation Silicon handler with laser-release layers
EP4389692A1 (fr) * 2022-12-19 2024-06-26 Epinovatech AB Dispositif et procédé de stockage d'hydrogène

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7052941B2 (en) * 2003-06-24 2006-05-30 Sang-Yun Lee Method for making a three-dimensional integrated circuit structure
WO2016114382A1 (fr) * 2015-01-16 2016-07-21 住友電気工業株式会社 Procédé de fabrication de substrat semi-conducteur, substrat semi-conducteur, procédé de fabrication de substrat semi-conducteur composite, substrat semi-conducteur composite, et substrat de soudage semi-conducteur
WO2017004497A1 (fr) * 2015-07-01 2017-01-05 Sensor Electronic Technology, Inc. Élimination de structure de substrat
US10892381B2 (en) * 2018-02-28 2021-01-12 Sensor Electronic Technology, Inc. Semiconductor structure with layer having protrusions

Also Published As

Publication number Publication date
US20230035764A1 (en) 2023-02-02
WO2021130136A1 (fr) 2021-07-01
KR20220119630A (ko) 2022-08-30
FR3105748A1 (fr) 2021-07-02
CN114868241A (zh) 2022-08-05
EP4082037A1 (fr) 2022-11-02
JP2023508443A (ja) 2023-03-02

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