FR3105749B1 - Dispositif pour traitement par laser et procédé de traitement au laser - Google Patents
Dispositif pour traitement par laser et procédé de traitement au laser Download PDFInfo
- Publication number
- FR3105749B1 FR3105749B1 FR1915604A FR1915604A FR3105749B1 FR 3105749 B1 FR3105749 B1 FR 3105749B1 FR 1915604 A FR1915604 A FR 1915604A FR 1915604 A FR1915604 A FR 1915604A FR 3105749 B1 FR3105749 B1 FR 3105749B1
- Authority
- FR
- France
- Prior art keywords
- laser treatment
- laser
- support
- treatment
- treatment method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000013532 laser treatment Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 2
- 230000003287 optical effect Effects 0.000 abstract 1
- 238000011282 treatment Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Integrated Circuits (AREA)
- Laser Surgery Devices (AREA)
- Radiation-Therapy Devices (AREA)
Abstract
Dispositif pour traitement par laser et procédé de traitement au laser La présente description concerne un dispositif (40) configuré pour un traitement par un laser (18), comprenant un support (22) et des objets (30) fixés chacun au support par l'intermédiaire d'une région absorbante (28) pour le laser, le support (22) comprenant un système de guidage optique (42, 44, 50, 52) du laser vers au moins une pluralité desdites régions absorbantes. Figure pour l'abrégé : Fig. 3
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1915604A FR3105749B1 (fr) | 2019-12-26 | 2019-12-26 | Dispositif pour traitement par laser et procédé de traitement au laser |
EP20829616.0A EP4081366A1 (fr) | 2019-12-26 | 2020-12-22 | Dispositif pour traitement par laser et procede de traitement au laser |
US17/787,907 US20230024644A1 (en) | 2019-12-26 | 2020-12-22 | Laser treatment device and laser treatment method |
PCT/EP2020/087725 WO2021130285A1 (fr) | 2019-12-26 | 2020-12-22 | Dispositif pour traitement par laser et procede de traitement au laser |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1915604A FR3105749B1 (fr) | 2019-12-26 | 2019-12-26 | Dispositif pour traitement par laser et procédé de traitement au laser |
FR1915604 | 2019-12-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3105749A1 FR3105749A1 (fr) | 2021-07-02 |
FR3105749B1 true FR3105749B1 (fr) | 2022-12-16 |
Family
ID=70008823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1915604A Active FR3105749B1 (fr) | 2019-12-26 | 2019-12-26 | Dispositif pour traitement par laser et procédé de traitement au laser |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230024644A1 (fr) |
EP (1) | EP4081366A1 (fr) |
FR (1) | FR3105749B1 (fr) |
WO (1) | WO2021130285A1 (fr) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7768024B2 (en) * | 2005-12-02 | 2010-08-03 | The Regents Of The University Of California | Horizontal emitting, vertical emitting, beam shaped, distributed feedback (DFB) lasers fabricated by growth over a patterned substrate with multiple overgrowth |
CN202977961U (zh) * | 2012-05-11 | 2013-06-05 | 中国科学院西安光学精密机械研究所 | 波导锁模激光器 |
US9322996B2 (en) * | 2013-03-07 | 2016-04-26 | Aurrion, Inc. | Simultaneous processing of multiple photonic device layers |
US9362444B1 (en) * | 2015-03-18 | 2016-06-07 | International Business Machines Corporation | Optoelectronics and CMOS integration on GOI substrate |
-
2019
- 2019-12-26 FR FR1915604A patent/FR3105749B1/fr active Active
-
2020
- 2020-12-22 US US17/787,907 patent/US20230024644A1/en active Pending
- 2020-12-22 EP EP20829616.0A patent/EP4081366A1/fr active Pending
- 2020-12-22 WO PCT/EP2020/087725 patent/WO2021130285A1/fr unknown
Also Published As
Publication number | Publication date |
---|---|
EP4081366A1 (fr) | 2022-11-02 |
WO2021130285A1 (fr) | 2021-07-01 |
FR3105749A1 (fr) | 2021-07-02 |
US20230024644A1 (en) | 2023-01-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
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PLSC | Publication of the preliminary search report |
Effective date: 20210702 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
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PLFP | Fee payment |
Year of fee payment: 4 |
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PLFP | Fee payment |
Year of fee payment: 5 |