FR3099887B1 - Formation d'un polymère - Google Patents

Formation d'un polymère Download PDF

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Publication number
FR3099887B1
FR3099887B1 FR1909184A FR1909184A FR3099887B1 FR 3099887 B1 FR3099887 B1 FR 3099887B1 FR 1909184 A FR1909184 A FR 1909184A FR 1909184 A FR1909184 A FR 1909184A FR 3099887 B1 FR3099887 B1 FR 3099887B1
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France
Prior art keywords
polymer
formation
fluid
vis
wettability
Prior art date
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Active
Application number
FR1909184A
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English (en)
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FR3099887A1 (fr
Inventor
Fabien Allanic
Julien Ladroue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Tours SAS
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STMicroelectronics Tours SAS
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Publication date
Application filed by STMicroelectronics Tours SAS filed Critical STMicroelectronics Tours SAS
Priority to FR1909184A priority Critical patent/FR3099887B1/fr
Publication of FR3099887A1 publication Critical patent/FR3099887A1/fr
Application granted granted Critical
Publication of FR3099887B1 publication Critical patent/FR3099887B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Laser Beam Processing (AREA)

Abstract

Formation d'un polymère La présente description concerne un procédé de formation d'un polymère (130) sur une surface (116) à partir d'un fluide, comprenant une étape d'augmentation de la mouillabilité d'au moins une partie de ladite surface vis-à-vis dudit fluide par application d'une ou plusieurs impulsions laser sur ladite au moins une partie. Figure pour l'abrégé : Fig. 1
FR1909184A 2019-08-13 2019-08-13 Formation d'un polymère Active FR3099887B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1909184A FR3099887B1 (fr) 2019-08-13 2019-08-13 Formation d'un polymère

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1909184A FR3099887B1 (fr) 2019-08-13 2019-08-13 Formation d'un polymère
FR1909184 2019-08-13

Publications (2)

Publication Number Publication Date
FR3099887A1 FR3099887A1 (fr) 2021-02-19
FR3099887B1 true FR3099887B1 (fr) 2023-01-27

Family

ID=68281695

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1909184A Active FR3099887B1 (fr) 2019-08-13 2019-08-13 Formation d'un polymère

Country Status (1)

Country Link
FR (1) FR3099887B1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10338078B4 (de) * 2003-08-19 2008-10-16 Infineon Technologies Ag Halbleiterelement mit verbesserten Haftungseigenschaften der nichtmetallischen Oberflächen und Verfahren zu dessen Herstellung
JP6045356B2 (ja) * 2013-01-16 2016-12-14 三菱電機株式会社 半導体装置の製造方法
WO2018074035A1 (fr) * 2016-10-18 2018-04-26 株式会社デンソー Dispositif électronique et son procédé de fabrication
JP2018075805A (ja) * 2016-11-11 2018-05-17 株式会社デンソー 樹脂金属接合体及び圧力センサ

Also Published As

Publication number Publication date
FR3099887A1 (fr) 2021-02-19

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