FR3093862B1 - Structure semi-conductrice optoélectronique comprenant une couche d’injection de type p à base d’InGaN - Google Patents
Structure semi-conductrice optoélectronique comprenant une couche d’injection de type p à base d’InGaN Download PDFInfo
- Publication number
- FR3093862B1 FR3093862B1 FR1902447A FR1902447A FR3093862B1 FR 3093862 B1 FR3093862 B1 FR 3093862B1 FR 1902447 A FR1902447 A FR 1902447A FR 1902447 A FR1902447 A FR 1902447A FR 3093862 B1 FR3093862 B1 FR 3093862B1
- Authority
- FR
- France
- Prior art keywords
- ingan
- type injection
- injection layer
- semiconductor structure
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002347 injection Methods 0.000 title abstract 4
- 239000007924 injection Substances 0.000 title abstract 4
- 230000005693 optoelectronics Effects 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
L’invention porte sur une structure semi-conductrice optoélectronique (SC) comprenant une couche active (6) à base d’InGaN disposée entre une couche d'injection de type n (5) et une couche d'injection de type p (7), la couche d'injection de type p (7) comprenant une première couche d’InGaN (7a) en contact avec la couche active et, disposée sur la première couche (7a), une deuxième couche (7b) présentant une partie superficielle en GaN. Figure à publier avec l’abrégé : Fig. 1
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1902447A FR3093862B1 (fr) | 2019-03-11 | 2019-03-11 | Structure semi-conductrice optoélectronique comprenant une couche d’injection de type p à base d’InGaN |
TW109105908A TW202101784A (zh) | 2019-03-11 | 2020-02-24 | 包含基於ingan之p型注入層之光電半導體結構 |
EP20706729.9A EP3939097A1 (fr) | 2019-03-11 | 2020-02-25 | Structure semi-conductrice optoélectronique comprenant une couche d'injection de type p à base d'ingan |
CN202080008522.XA CN113272972A (zh) | 2019-03-11 | 2020-02-25 | 包括基于InGaN的P型注入层的光电半导体结构 |
PCT/EP2020/054825 WO2020182457A1 (fr) | 2019-03-11 | 2020-02-25 | Structure semi-conductrice optoélectronique comprenant une couche d'injection de type p à base d'ingan |
US17/435,014 US20220140190A1 (en) | 2019-03-11 | 2020-02-25 | Optoelectronic semiconductor structure comprising a p-type injection layer based on ingan |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1902447 | 2019-03-11 | ||
FR1902447A FR3093862B1 (fr) | 2019-03-11 | 2019-03-11 | Structure semi-conductrice optoélectronique comprenant une couche d’injection de type p à base d’InGaN |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3093862A1 FR3093862A1 (fr) | 2020-09-18 |
FR3093862B1 true FR3093862B1 (fr) | 2022-07-29 |
Family
ID=67383986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1902447A Active FR3093862B1 (fr) | 2019-03-11 | 2019-03-11 | Structure semi-conductrice optoélectronique comprenant une couche d’injection de type p à base d’InGaN |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220140190A1 (fr) |
EP (1) | EP3939097A1 (fr) |
CN (1) | CN113272972A (fr) |
FR (1) | FR3093862B1 (fr) |
TW (1) | TW202101784A (fr) |
WO (1) | WO2020182457A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230131918A1 (en) * | 2021-10-25 | 2023-04-27 | Meta Platforms Technologies, Llc | Strain management of iii-p micro-led epitaxy towards higher efficiency and low bow |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0215852A1 (fr) | 1985-03-08 | 1987-04-01 | Hubert Petutschnig | Moteur a piston rotatif |
DE8509328U1 (de) | 1985-03-28 | 1985-10-10 | Aluminium-Walzwerke Singen Gmbh, 7700 Singen | Verbundelement aus zwei aneinander festliegenden Profilelementen |
US5777350A (en) * | 1994-12-02 | 1998-07-07 | Nichia Chemical Industries, Ltd. | Nitride semiconductor light-emitting device |
JP3645233B2 (ja) * | 2001-06-07 | 2005-05-11 | 日本電信電話株式会社 | 半導体素子 |
CN102157656B (zh) * | 2011-01-26 | 2012-09-26 | 中山大学 | 一种加强载流子注入效率的氮化物发光二极管以及制作方法 |
US9029867B2 (en) * | 2011-07-08 | 2015-05-12 | RoseStreet Labs Energy, LLC | Multi-color light emitting devices with compositionally graded cladding group III-nitride layers grown on substrates |
JP5598437B2 (ja) * | 2011-07-12 | 2014-10-01 | 豊田合成株式会社 | Iii族窒化物半導体発光素子の製造方法 |
JP5874593B2 (ja) * | 2011-12-23 | 2016-03-02 | 豊田合成株式会社 | Iii族窒化物半導体発光素子とその製造方法 |
FR2992465B1 (fr) * | 2012-06-22 | 2015-03-20 | Soitec Silicon On Insulator | Procede de fabrication collective de leds et structure pour la fabrication collective de leds |
KR20150025264A (ko) * | 2013-08-28 | 2015-03-10 | 삼성전자주식회사 | 정공주입층을 구비하는 반도체 발광 소자 및 그 제조 방법 |
US9059356B1 (en) * | 2013-11-22 | 2015-06-16 | Sandia Corporation | Laterally injected light-emitting diode and laser diode |
-
2019
- 2019-03-11 FR FR1902447A patent/FR3093862B1/fr active Active
-
2020
- 2020-02-24 TW TW109105908A patent/TW202101784A/zh unknown
- 2020-02-25 WO PCT/EP2020/054825 patent/WO2020182457A1/fr unknown
- 2020-02-25 US US17/435,014 patent/US20220140190A1/en active Pending
- 2020-02-25 EP EP20706729.9A patent/EP3939097A1/fr active Pending
- 2020-02-25 CN CN202080008522.XA patent/CN113272972A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2020182457A1 (fr) | 2020-09-17 |
CN113272972A (zh) | 2021-08-17 |
FR3093862A1 (fr) | 2020-09-18 |
US20220140190A1 (en) | 2022-05-05 |
TW202101784A (zh) | 2021-01-01 |
EP3939097A1 (fr) | 2022-01-19 |
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Year of fee payment: 2 |
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Effective date: 20200918 |
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Year of fee payment: 3 |
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PLFP | Fee payment |
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PLFP | Fee payment |
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