FR3079439B1 - Dispositif de prehension - Google Patents

Dispositif de prehension Download PDF

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Publication number
FR3079439B1
FR3079439B1 FR1852728A FR1852728A FR3079439B1 FR 3079439 B1 FR3079439 B1 FR 3079439B1 FR 1852728 A FR1852728 A FR 1852728A FR 1852728 A FR1852728 A FR 1852728A FR 3079439 B1 FR3079439 B1 FR 3079439B1
Authority
FR
France
Prior art keywords
plate
openings
nozzle
extending
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1852728A
Other languages
English (en)
French (fr)
Other versions
FR3079439A1 (fr
Inventor
Mickael Launay
Pierre Yves Duvivier
Chakib Bensaid
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ecm Greentech Fr
Original Assignee
Semco Tech Sas
Semco Technologies Sas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semco Tech Sas, Semco Technologies Sas filed Critical Semco Tech Sas
Priority to FR1852728A priority Critical patent/FR3079439B1/fr
Priority to TW108108403A priority patent/TWI779174B/zh
Priority to EP19718776.8A priority patent/EP3774207B1/fr
Priority to CN201980022249.3A priority patent/CN111989196B/zh
Priority to PCT/FR2019/050592 priority patent/WO2019186025A1/fr
Priority to KR1020207030808A priority patent/KR102646149B1/ko
Priority to ES19718776T priority patent/ES2952760T3/es
Publication of FR3079439A1 publication Critical patent/FR3079439A1/fr
Application granted granted Critical
Publication of FR3079439B1 publication Critical patent/FR3079439B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/52—PV systems with concentrators

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Vending Machines For Individual Products (AREA)
  • Massaging Devices (AREA)
FR1852728A 2018-03-29 2018-03-29 Dispositif de prehension Active FR3079439B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR1852728A FR3079439B1 (fr) 2018-03-29 2018-03-29 Dispositif de prehension
TW108108403A TWI779174B (zh) 2018-03-29 2019-03-13 拾取裝置
CN201980022249.3A CN111989196B (zh) 2018-03-29 2019-03-15 夹紧装置
PCT/FR2019/050592 WO2019186025A1 (fr) 2018-03-29 2019-03-15 Dispositif de prehension
EP19718776.8A EP3774207B1 (fr) 2018-03-29 2019-03-15 Dispositif de prehension
KR1020207030808A KR102646149B1 (ko) 2018-03-29 2019-03-15 그리퍼
ES19718776T ES2952760T3 (es) 2018-03-29 2019-03-15 Dispositivo de agarre

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1852728 2018-03-29
FR1852728A FR3079439B1 (fr) 2018-03-29 2018-03-29 Dispositif de prehension

Publications (2)

Publication Number Publication Date
FR3079439A1 FR3079439A1 (fr) 2019-10-04
FR3079439B1 true FR3079439B1 (fr) 2020-04-24

Family

ID=62223006

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1852728A Active FR3079439B1 (fr) 2018-03-29 2018-03-29 Dispositif de prehension

Country Status (7)

Country Link
EP (1) EP3774207B1 (ko)
KR (1) KR102646149B1 (ko)
CN (1) CN111989196B (ko)
ES (1) ES2952760T3 (ko)
FR (1) FR3079439B1 (ko)
TW (1) TWI779174B (ko)
WO (1) WO2019186025A1 (ko)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989012907A1 (en) * 1988-06-17 1989-12-28 Epsilon Technology, Inc. Wafer handling system with bernoulli pick-up
JPH05146983A (ja) * 1991-11-21 1993-06-15 Toyo Commun Equip Co Ltd 選択式吸着装置
WO1997045862A1 (en) * 1996-05-31 1997-12-04 Ipec Precision, Inc. Non-contact holder for wafer-like articles
JP2000290777A (ja) * 1999-04-07 2000-10-17 Tokyo Electron Ltd ガス処理装置、バッフル部材、及びガス処理方法
JP4214509B2 (ja) * 2002-12-03 2009-01-28 株式会社ニコン 吸着保持部材及び吸着保持装置
JP4613800B2 (ja) * 2004-12-01 2011-01-19 株式会社Ｉｈｉ 浮上装置および搬送装置
JP2007324442A (ja) * 2006-06-02 2007-12-13 Smc Corp 非接触搬送装置
JP2008060489A (ja) * 2006-09-04 2008-03-13 Nippon Steel Chem Co Ltd 電子部品吸着保持具
DE102009010164A1 (de) * 2009-02-23 2010-09-02 Grenzebach Maschinenbau Gmbh Vorrichtung und Verfahren zum berührungslosen Erfassen von Glasplatten
JP2012223860A (ja) * 2011-04-20 2012-11-15 Murata Machinery Ltd 吸引チャック、及びそれを備えたワークの移載装置
CN103422071B (zh) * 2012-05-18 2015-06-17 中国地质大学（北京） 一种可快速更换匀气方式的真空腔室
TWM461619U (zh) * 2013-05-17 2013-09-11 Utechzone Co Ltd 真空吸盤及裝設有真空吸盤之支架型真空吸附設備
JP6292842B2 (ja) * 2013-11-25 2018-03-14 株式会社ジェーイーエル 基板保持装置

Also Published As

Publication number Publication date
WO2019186025A1 (fr) 2019-10-03
EP3774207A1 (fr) 2021-02-17
TWI779174B (zh) 2022-10-01
TW201943021A (zh) 2019-11-01
CN111989196A (zh) 2020-11-24
KR102646149B1 (ko) 2024-03-08
KR20210018200A (ko) 2021-02-17
FR3079439A1 (fr) 2019-10-04
EP3774207B1 (fr) 2023-06-07
ES2952760T3 (es) 2023-11-03
CN111989196B (zh) 2023-03-10

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Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20191004

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TP Transmission of property

Owner name: ECM GREENTECH, FR

Effective date: 20210809

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