FR3071694B1 - Piece moulee de boitier et module electronique - Google Patents

Piece moulee de boitier et module electronique Download PDF

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Publication number
FR3071694B1
FR3071694B1 FR1858879A FR1858879A FR3071694B1 FR 3071694 B1 FR3071694 B1 FR 3071694B1 FR 1858879 A FR1858879 A FR 1858879A FR 1858879 A FR1858879 A FR 1858879A FR 3071694 B1 FR3071694 B1 FR 3071694B1
Authority
FR
France
Prior art keywords
housing
molded part
electronic component
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1858879A
Other languages
English (en)
Other versions
FR3071694A1 (fr
Inventor
Manuel Engewald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ellenberger and Poensgen GmbH
Original Assignee
Ellenberger and Poensgen GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ellenberger and Poensgen GmbH filed Critical Ellenberger and Poensgen GmbH
Publication of FR3071694A1 publication Critical patent/FR3071694A1/fr
Application granted granted Critical
Publication of FR3071694B1 publication Critical patent/FR3071694B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne une pièce moulée de boîtier (2) pour le montage d'un composant électronique sur une carte de circuit imprimé (20), comprenant un côté de réception (4) qui présente une ouverture de boîtier (6) pour recevoir le composant électronique (18) dans une cavité intérieure de boîtier (16), un côté de connexion (8) adjacent au côté de réception (4) avec des passages de connexion (10) pour les connexions électriques (54) du composant électronique (18), et un côté de montage (12) avec un profil de montage (14) formé dessus pour un positionnement et un maintien sans outils du boîtier sur la carte de circuit imprimé (20). En outre, l'invention concerne un module électronique (66) avec un boîtier de module (68) dans lequel sont insérées une carte de circuit imprimé (20) et une telle pièce moulée de boîtier (2) avec un composant électronique (18) inséré dedans.
FR1858879A 2017-09-28 2018-09-27 Piece moulee de boitier et module electronique Expired - Fee Related FR3071694B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2020171059391 2017-09-28
DE202017105939.1U DE202017105939U1 (de) 2017-09-28 2017-09-28 Gehäuseformteil sowie elektronische Baugruppe

Publications (2)

Publication Number Publication Date
FR3071694A1 FR3071694A1 (fr) 2019-03-29
FR3071694B1 true FR3071694B1 (fr) 2021-01-29

Family

ID=65084863

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1858879A Expired - Fee Related FR3071694B1 (fr) 2017-09-28 2018-09-27 Piece moulee de boitier et module electronique

Country Status (3)

Country Link
US (1) US11102903B2 (fr)
DE (2) DE202017105939U1 (fr)
FR (1) FR3071694B1 (fr)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4362904A (en) * 1982-01-18 1982-12-07 Reliance Electric Company Printed circuit board component mounting support and spacer
JPS6181170U (fr) 1984-10-31 1986-05-29
US4941069A (en) * 1988-07-07 1990-07-10 Zenith Electronics Corporation Rectifier spacer/mounting assembly
US5901045A (en) * 1997-03-06 1999-05-04 Cabletron Systems, Inc. Method and apparatus for isolating component leads
AU9247098A (en) * 1998-09-16 2000-04-03 Luciano Da Luz Moraes Mounting of capacitors in electrical control box
US6677580B1 (en) * 1999-10-07 2004-01-13 Rohm Co., Ltd. Photo-interrupter and semiconductor device using it
US6648679B2 (en) * 2002-03-07 2003-11-18 General Instrument Corporation Method and apparatus for optical component mounting
US6916194B2 (en) * 2003-02-20 2005-07-12 Rockwell Automation Technologies, Inc. Modular electrical device with improved seal
US6751103B1 (en) * 2003-03-07 2004-06-15 American Megatrends, Inc. Retainer clip
TW573887U (en) * 2003-05-13 2004-01-21 Ferrico Corp Base for electronic device
US20070285909A1 (en) * 2006-06-08 2007-12-13 Honeywell International Inc. System and method for mounting components on a printed wiring board
KR101161963B1 (ko) * 2007-09-26 2012-07-04 몰렉스 인코포레이티드 전기 부품 장착 조립체
CN102196703B (zh) * 2010-03-16 2015-10-14 日立汽车系统株式会社 电子设备
IN2014CN01994A (fr) * 2011-08-15 2015-05-29 Sma Solar Technology Ag
US9398701B2 (en) * 2013-03-14 2016-07-19 General Electric Company Component holding structures, system, and method
WO2014200459A1 (fr) * 2013-06-10 2014-12-18 Schneider Electric Solar Inverters Usa, Inc. Système électronique et son procédé de formation
JP2016178717A (ja) * 2015-03-18 2016-10-06 愛三工業株式会社 電子制御装置及びその製造方法
US9564698B2 (en) * 2015-05-18 2017-02-07 Autoliv Asp, Inc. Capacitor frame assembly
JP6493174B2 (ja) * 2015-11-23 2019-04-03 株式会社デンソー 電子機器
DE102016206930A1 (de) * 2016-04-25 2017-10-26 Schaeffler Technologies AG & Co. KG Elektronikmodul mit einem ein optimiertes Design aufweisenden Halteelement zur verbesserten Flächennutzung der Leiterplatte

Also Published As

Publication number Publication date
US11102903B2 (en) 2021-08-24
DE202017105939U1 (de) 2019-01-08
US20190098787A1 (en) 2019-03-28
FR3071694A1 (fr) 2019-03-29
DE102018215968A1 (de) 2019-03-28

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Year of fee payment: 2

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Effective date: 20191101

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