FR3071694B1 - Piece moulee de boitier et module electronique - Google Patents
Piece moulee de boitier et module electronique Download PDFInfo
- Publication number
- FR3071694B1 FR3071694B1 FR1858879A FR1858879A FR3071694B1 FR 3071694 B1 FR3071694 B1 FR 3071694B1 FR 1858879 A FR1858879 A FR 1858879A FR 1858879 A FR1858879 A FR 1858879A FR 3071694 B1 FR3071694 B1 FR 3071694B1
- Authority
- FR
- France
- Prior art keywords
- housing
- molded part
- electronic component
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
L'invention concerne une pièce moulée de boîtier (2) pour le montage d'un composant électronique sur une carte de circuit imprimé (20), comprenant un côté de réception (4) qui présente une ouverture de boîtier (6) pour recevoir le composant électronique (18) dans une cavité intérieure de boîtier (16), un côté de connexion (8) adjacent au côté de réception (4) avec des passages de connexion (10) pour les connexions électriques (54) du composant électronique (18), et un côté de montage (12) avec un profil de montage (14) formé dessus pour un positionnement et un maintien sans outils du boîtier sur la carte de circuit imprimé (20). En outre, l'invention concerne un module électronique (66) avec un boîtier de module (68) dans lequel sont insérées une carte de circuit imprimé (20) et une telle pièce moulée de boîtier (2) avec un composant électronique (18) inséré dedans.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2020171059391 | 2017-09-28 | ||
DE202017105939.1U DE202017105939U1 (de) | 2017-09-28 | 2017-09-28 | Gehäuseformteil sowie elektronische Baugruppe |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3071694A1 FR3071694A1 (fr) | 2019-03-29 |
FR3071694B1 true FR3071694B1 (fr) | 2021-01-29 |
Family
ID=65084863
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1858879A Expired - Fee Related FR3071694B1 (fr) | 2017-09-28 | 2018-09-27 | Piece moulee de boitier et module electronique |
Country Status (3)
Country | Link |
---|---|
US (1) | US11102903B2 (fr) |
DE (2) | DE202017105939U1 (fr) |
FR (1) | FR3071694B1 (fr) |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4362904A (en) * | 1982-01-18 | 1982-12-07 | Reliance Electric Company | Printed circuit board component mounting support and spacer |
JPS6181170U (fr) * | 1984-10-31 | 1986-05-29 | ||
US4941069A (en) * | 1988-07-07 | 1990-07-10 | Zenith Electronics Corporation | Rectifier spacer/mounting assembly |
US5901045A (en) * | 1997-03-06 | 1999-05-04 | Cabletron Systems, Inc. | Method and apparatus for isolating component leads |
US6300564B1 (en) * | 1998-09-16 | 2001-10-09 | Carrier Corporation | Mounting of capacitors in electrical control box |
EP1220328A4 (fr) * | 1999-10-07 | 2008-03-12 | Rohm Co Ltd | Photo-interrupteur et dispositif a semiconducteur utilisant ledit photo-interrupteur |
US6648679B2 (en) * | 2002-03-07 | 2003-11-18 | General Instrument Corporation | Method and apparatus for optical component mounting |
US6916194B2 (en) * | 2003-02-20 | 2005-07-12 | Rockwell Automation Technologies, Inc. | Modular electrical device with improved seal |
US6751103B1 (en) * | 2003-03-07 | 2004-06-15 | American Megatrends, Inc. | Retainer clip |
TW573887U (en) * | 2003-05-13 | 2004-01-21 | Ferrico Corp | Base for electronic device |
US20070285909A1 (en) * | 2006-06-08 | 2007-12-13 | Honeywell International Inc. | System and method for mounting components on a printed wiring board |
KR101472172B1 (ko) * | 2007-09-26 | 2014-12-12 | 몰렉스 인코포레이티드 | 전기 부품 장착 조립체 |
CN102196703B (zh) * | 2010-03-16 | 2015-10-14 | 日立汽车系统株式会社 | 电子设备 |
CN103782665B (zh) * | 2011-08-15 | 2017-04-26 | 艾思玛太阳能技术股份公司 | 在电路板的支持物中包括电容器的电子设备及其生产方法 |
US9398701B2 (en) * | 2013-03-14 | 2016-07-19 | General Electric Company | Component holding structures, system, and method |
ES2716602T3 (es) * | 2013-06-10 | 2019-06-13 | Schneider Electric Solar Inverters Usa Inc | Sistema electrónico y método para formar el mismo |
JP2016178717A (ja) * | 2015-03-18 | 2016-10-06 | 愛三工業株式会社 | 電子制御装置及びその製造方法 |
US9564698B2 (en) * | 2015-05-18 | 2017-02-07 | Autoliv Asp, Inc. | Capacitor frame assembly |
JP6493174B2 (ja) * | 2015-11-23 | 2019-04-03 | 株式会社デンソー | 電子機器 |
DE102016206930A1 (de) * | 2016-04-25 | 2017-10-26 | Schaeffler Technologies AG & Co. KG | Elektronikmodul mit einem ein optimiertes Design aufweisenden Halteelement zur verbesserten Flächennutzung der Leiterplatte |
-
2017
- 2017-09-28 DE DE202017105939.1U patent/DE202017105939U1/de active Active
-
2018
- 2018-09-19 DE DE102018215968.8A patent/DE102018215968A1/de active Pending
- 2018-09-27 FR FR1858879A patent/FR3071694B1/fr not_active Expired - Fee Related
- 2018-09-28 US US16/145,513 patent/US11102903B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
FR3071694A1 (fr) | 2019-03-29 |
US20190098787A1 (en) | 2019-03-28 |
DE202017105939U1 (de) | 2019-01-08 |
DE102018215968A1 (de) | 2019-03-28 |
US11102903B2 (en) | 2021-08-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
|
PLSC | Publication of the preliminary search report |
Effective date: 20191101 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
|
ST | Notification of lapse |
Effective date: 20220505 |