FR3065115B1 - Boitier hermetique pour un detecteur de rayonnement infrarouge - Google Patents

Boitier hermetique pour un detecteur de rayonnement infrarouge Download PDF

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Publication number
FR3065115B1
FR3065115B1 FR1753127A FR1753127A FR3065115B1 FR 3065115 B1 FR3065115 B1 FR 3065115B1 FR 1753127 A FR1753127 A FR 1753127A FR 1753127 A FR1753127 A FR 1753127A FR 3065115 B1 FR3065115 B1 FR 3065115B1
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chip
infrared radiation
radiation detector
hermetic housing
detection device
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FR1753127A
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FR3065115A1 (fr
Inventor
Jerome Favier
Mickael Miglietti
Christel Loic Tisse
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Ulis SAS
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Ulis SAS
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

Boîtier hermétique pour détecteur de rayonnement infrarouge comprenant : une première puce (24) sur et dans laquelle sont formés un dispositif de détection de rayonnement infrarouge (42), un circuit de lecture du dispositif et des zones de connexion électrique du circuit de lecture ; une seconde puce (26), superposée sur la première puce, transparente au rayonnement infrarouge sur au moins une partie de sa surface, et ayant au moins une dimension de valeur supérieure à celle de la première puce de sorte qu'au moins une partie de la seconde puce s'étende au-delà du bord de la première puce ; un joint de scellement métallique (34) entre les deux puces entourant le dispositif de détection ; des premières connexions électriques (50), entre les première et seconde puces ; et des secondes connexions électriques (32) s'étendant à partir de ladite au moins une partie de la seconde puce.
FR1753127A 2017-04-10 2017-04-10 Boitier hermetique pour un detecteur de rayonnement infrarouge Active FR3065115B1 (fr)

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FR1753127 2017-04-10
FR1753127A FR3065115B1 (fr) 2017-04-10 2017-04-10 Boitier hermetique pour un detecteur de rayonnement infrarouge

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Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7276798B2 (en) * 2002-05-23 2007-10-02 Honeywell International Inc. Integral topside vacuum package
FR2865467B1 (fr) * 2004-01-22 2007-01-05 Commissariat Energie Atomique Dispositif et procede pour assurer l'hermeticite d'une cavite en presence d'un via
KR100498708B1 (ko) * 2004-11-08 2005-07-01 옵토팩 주식회사 반도체 소자용 전자패키지 및 그 패키징 방법
US7923298B2 (en) * 2007-09-07 2011-04-12 Micron Technology, Inc. Imager die package and methods of packaging an imager die on a temporary carrier

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