FR3053482B1 - Produit fritte et dispositif electroluminescent - Google Patents

Produit fritte et dispositif electroluminescent Download PDF

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Publication number
FR3053482B1
FR3053482B1 FR1755956A FR1755956A FR3053482B1 FR 3053482 B1 FR3053482 B1 FR 3053482B1 FR 1755956 A FR1755956 A FR 1755956A FR 1755956 A FR1755956 A FR 1755956A FR 3053482 B1 FR3053482 B1 FR 3053482B1
Authority
FR
France
Prior art keywords
wavelength conversion
electroluminescent device
fried product
zone
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1755956A
Other languages
English (en)
Other versions
FR3053482A1 (fr
Inventor
Akihiro Nomura
Hidemichi Sone
Yuzo Maeno
Yukihiro Onoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Publication of FR3053482A1 publication Critical patent/FR3053482A1/fr
Application granted granted Critical
Publication of FR3053482B1 publication Critical patent/FR3053482B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02322—Optical elements or arrangements associated with the device comprising luminescent members, e.g. fluorescent sheets upon the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Lasers (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Frying-Pans Or Fryers (AREA)

Abstract

Un produit fritté comprend une zone de conversion de longueur d'onde (14a) contenant une matière à base de phosphore qui réalise une conversion de longueur d'onde de lumière primaire et émet de la lumière secondaire, et une zone de maintien (14b) prévue pour être en contact avec la zone de conversion de longueur d'onde (14a). La zone de conversion de longueur d'onde (14a) et la zone de maintien (14b) sont intégrées.
FR1755956A 2016-07-04 2017-06-28 Produit fritte et dispositif electroluminescent Expired - Fee Related FR3053482B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016132803A JP6862110B2 (ja) 2016-07-04 2016-07-04 焼結体および発光装置
JP2016132803 2016-07-04

Publications (2)

Publication Number Publication Date
FR3053482A1 FR3053482A1 (fr) 2018-01-05
FR3053482B1 true FR3053482B1 (fr) 2021-05-21

Family

ID=60662731

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1755956A Expired - Fee Related FR3053482B1 (fr) 2016-07-04 2017-06-28 Produit fritte et dispositif electroluminescent

Country Status (5)

Country Link
US (2) US10403771B2 (fr)
JP (1) JP6862110B2 (fr)
CN (1) CN107579144B (fr)
DE (1) DE102017211169A1 (fr)
FR (1) FR3053482B1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017163598A1 (fr) * 2016-03-24 2017-09-28 ソニー株式会社 Dispositif électroluminescent, appareil d'affichage et appareil d'éclairage
EP3734778B1 (fr) * 2017-12-26 2024-02-14 Nichia Corporation Élément optique, dispositif optique, et procédé de fabrication d'élément optique
WO2019141374A1 (fr) * 2018-01-19 2019-07-25 Osram Opto Semiconductors Gmbh Procédé de production d'une pluralité d'éléments de conversion, élément de conversion et composant optoélectronique
JPWO2020250757A1 (fr) * 2019-06-14 2020-12-17
JP7356311B2 (ja) * 2019-09-27 2023-10-04 豊田合成株式会社 発光装置、波長変換ユニット、及びヘッドライト又は表示装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6155699A (en) * 1999-03-15 2000-12-05 Agilent Technologies, Inc. Efficient phosphor-conversion led structure
CN101167194B (zh) 2005-04-27 2011-07-06 皇家飞利浦电子股份有限公司 用于发光半导体设备的冷却设备和制造这种冷却设备的方法
JP5311281B2 (ja) * 2008-02-18 2013-10-09 日本電気硝子株式会社 波長変換部材およびその製造方法
JP5697363B2 (ja) * 2010-05-20 2015-04-08 Ｎｇｋエレクトロデバイス株式会社 セラミック焼結体およびその製造方法および光反射体および発光素子収納用パッケージ
JP5854367B2 (ja) * 2011-06-21 2016-02-09 日本電気硝子株式会社 蛍光体複合部材の製造方法
JP2012023288A (ja) * 2010-07-16 2012-02-02 Nitto Denko Corp 発光装置用部品、発光装置およびその製造方法
JP2012221633A (ja) 2011-04-05 2012-11-12 Sharp Corp 照明装置及び前照灯
JP2012226227A (ja) * 2011-04-22 2012-11-15 Sanyo Electric Co Ltd 反射材及びそれを用いた発光装置用パッケージ
JP2013033916A (ja) * 2011-06-28 2013-02-14 Sharp Corp 発光装置及びその製造方法
US8931922B2 (en) * 2012-03-22 2015-01-13 Osram Sylvania Inc. Ceramic wavelength-conversion plates and light sources including the same
JP5970661B2 (ja) 2013-06-21 2016-08-17 パナソニックＩｐマネジメント株式会社 波長変換部材、光源、及び自動車用ヘッドランプ
JP2015120621A (ja) * 2013-12-24 2015-07-02 旭硝子株式会社 ガラスセラミックス組成物、発光素子用基板、および発光装置
CN104091875A (zh) * 2014-07-04 2014-10-08 厦门市三安光电科技有限公司 一种led封装结构

Also Published As

Publication number Publication date
FR3053482A1 (fr) 2018-01-05
JP6862110B2 (ja) 2021-04-21
DE102017211169A1 (de) 2018-01-04
JP2018002912A (ja) 2018-01-11
US10541339B2 (en) 2020-01-21
US10403771B2 (en) 2019-09-03
US20190341507A1 (en) 2019-11-07
CN107579144A (zh) 2018-01-12
CN107579144B (zh) 2021-03-19
US20180006167A1 (en) 2018-01-04

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