FR3050023B1 - Procede et systeme d'inspection et de mesure optique d'une face d'un objet - Google Patents

Procede et systeme d'inspection et de mesure optique d'une face d'un objet Download PDF

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Publication number
FR3050023B1
FR3050023B1 FR1653158A FR1653158A FR3050023B1 FR 3050023 B1 FR3050023 B1 FR 3050023B1 FR 1653158 A FR1653158 A FR 1653158A FR 1653158 A FR1653158 A FR 1653158A FR 3050023 B1 FR3050023 B1 FR 3050023B1
Authority
FR
France
Prior art keywords
face
measurement
signal
optical inspection
inspecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1653158A
Other languages
English (en)
Other versions
FR3050023A1 (fr
Inventor
Jean-Francois BOULANGER
Benoit Thouy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unity Semiconductor SAS
Original Assignee
Fogale Nanotech SA
Unity Semiconductor SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fogale Nanotech SA, Unity Semiconductor SAS filed Critical Fogale Nanotech SA
Priority to FR1653158A priority Critical patent/FR3050023B1/fr
Priority to EP17719184.8A priority patent/EP3443295A1/fr
Priority to US16/092,751 priority patent/US20190137265A1/en
Priority to PCT/EP2017/058145 priority patent/WO2017178306A1/fr
Priority to KR1020187029944A priority patent/KR20180127412A/ko
Priority to CN201780022856.0A priority patent/CN109073355A/zh
Publication of FR3050023A1 publication Critical patent/FR3050023A1/fr
Application granted granted Critical
Publication of FR3050023B1 publication Critical patent/FR3050023B1/fr
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02083—Interferometers characterised by particular signal processing and presentation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02083—Interferometers characterised by particular signal processing and presentation
    • G01B9/02084—Processing in the Fourier or frequency domain when not imaged in the frequency domain
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/0209—Low-coherence interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth

Abstract

La présente invention concerne un procédé (100) d'inspection et de mesure d'une face d'un objet comprenant au moins deux surfaces décalées en profondeur l'une par rapport à l'autre, lesdites surfaces formant en particulier une marche ou une tranchée sur/dans ladite face, ledit procédé (100) comprenant les étapes suivantes : - mesure (102) d'un signal interférométrique, dit signal mesuré, en plusieurs points, dits de mesure, de ladite face inspectée ; - pour au moins un point de mesure, extraction (108) du signal mesuré relativement à au moins une, en particulier à chaque, surface, ladite extraction (108) fournissant pour ledit point de mesure un signal interférométrique, dit individuel, pour ladite surface ; - analyse (110) profilométrique des signaux individuels, de manière indépendante pour chaque surface. Elle concerne également un système d'inspection et de mesure d'une face d'un objet mettant en œuvre un tel procédé.
FR1653158A 2016-04-11 2016-04-11 Procede et systeme d'inspection et de mesure optique d'une face d'un objet Active FR3050023B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR1653158A FR3050023B1 (fr) 2016-04-11 2016-04-11 Procede et systeme d'inspection et de mesure optique d'une face d'un objet
EP17719184.8A EP3443295A1 (fr) 2016-04-11 2017-04-05 Procede et systeme d'inspection et de mesure optique d'une face d'un objet
US16/092,751 US20190137265A1 (en) 2016-04-11 2017-04-05 Method and system for the optical inspection and measurement of a face of an object
PCT/EP2017/058145 WO2017178306A1 (fr) 2016-04-11 2017-04-05 Procede et systeme d'inspection et de mesure optique d'une face d'un objet
KR1020187029944A KR20180127412A (ko) 2016-04-11 2017-04-05 물체의 면을 광학적으로 측정하고 검사하기 위한 방법 및 시스템
CN201780022856.0A CN109073355A (zh) 2016-04-11 2017-04-05 用于光学检查和测量物体表面的方法和系统

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1653158A FR3050023B1 (fr) 2016-04-11 2016-04-11 Procede et systeme d'inspection et de mesure optique d'une face d'un objet
FR1653158 2016-04-11

Publications (2)

Publication Number Publication Date
FR3050023A1 FR3050023A1 (fr) 2017-10-13
FR3050023B1 true FR3050023B1 (fr) 2020-02-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
FR1653158A Active FR3050023B1 (fr) 2016-04-11 2016-04-11 Procede et systeme d'inspection et de mesure optique d'une face d'un objet

Country Status (6)

Country Link
US (1) US20190137265A1 (fr)
EP (1) EP3443295A1 (fr)
KR (1) KR20180127412A (fr)
CN (1) CN109073355A (fr)
FR (1) FR3050023B1 (fr)
WO (1) WO2017178306A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3089286B1 (fr) * 2018-11-30 2022-04-01 Unity Semiconductor Procédé et système pour mesurer une surface d’un objet comprenant des structures différentes par interférométrie à faible cohérence
US11921285B2 (en) * 2019-04-19 2024-03-05 Arizona Board Of Regents On Behalf Of The University Of Arizona On-chip signal processing method and pixel-array signal
US11910104B2 (en) 2019-04-19 2024-02-20 ARIZONA BOARD OF REGENTS on behalf of THE UNIVERSITY OF ARIZONA, A BODY CORPORATE All-in-focus imager and associated method
CN110160450B (zh) * 2019-05-13 2020-12-25 天津大学 基于白光干涉光谱的大台阶高度的快速测量方法
WO2021168612A1 (fr) 2020-02-24 2021-09-02 Yangtze Memory Technologies Co., Ltd. Systèmes et procédés de métrologie de topographie de surface de puce semi-conductrice
WO2021168613A1 (fr) 2020-02-24 2021-09-02 Yangtze Memory Technologies Co., Ltd. Systèmes et procédés de métrologie de topographie de surface de puce semi-conductrice
CN111386441B (zh) 2020-02-24 2021-02-19 长江存储科技有限责任公司 用于半导体芯片表面形貌计量的系统
CN111356897B (zh) * 2020-02-24 2021-02-19 长江存储科技有限责任公司 用于半导体芯片表面形貌计量的系统和方法
CN113465534B (zh) * 2021-06-25 2022-04-19 浙江大学 一种基于白光干涉的微纳深沟槽结构快速测量方法
CN114383528A (zh) * 2022-01-10 2022-04-22 湖南伊鸿健康科技有限公司 计数池深度标定方法及系统、智能终端与存储介质

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5471303A (en) * 1994-04-29 1995-11-28 Wyko Corporation Combination of white-light scanning and phase-shifting interferometry for surface profile measurements
JP2000097648A (ja) * 1998-09-25 2000-04-07 Toshiba Corp 段差測定装置および段差測定方法
JP2003065724A (ja) * 2001-08-29 2003-03-05 Shin Etsu Handotai Co Ltd Ｆｔｉｒ法による膜厚測定方法および半導体ウェーハの製造方法
CN100587394C (zh) * 2007-09-20 2010-02-03 华中科技大学 一种微纳深沟槽结构测量方法及装置
US8004688B2 (en) * 2008-11-26 2011-08-23 Zygo Corporation Scan error correction in low coherence scanning interferometry

Also Published As

Publication number Publication date
CN109073355A (zh) 2018-12-21
US20190137265A1 (en) 2019-05-09
FR3050023A1 (fr) 2017-10-13
EP3443295A1 (fr) 2019-02-20
WO2017178306A1 (fr) 2017-10-19
KR20180127412A (ko) 2018-11-28

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