FR3045869B1 - Routage ameliore pour structure integree tridimensionnelle - Google Patents
Routage ameliore pour structure integree tridimensionnelle Download PDFInfo
- Publication number
- FR3045869B1 FR3045869B1 FR1562785A FR1562785A FR3045869B1 FR 3045869 B1 FR3045869 B1 FR 3045869B1 FR 1562785 A FR1562785 A FR 1562785A FR 1562785 A FR1562785 A FR 1562785A FR 3045869 B1 FR3045869 B1 FR 3045869B1
- Authority
- FR
- France
- Prior art keywords
- integrated
- dimensional structure
- improved routing
- components
- oriented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/394—Routing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5226—Via connections in a multilevel interconnection structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
- H01L2224/828—Bonding techniques
- H01L2224/82895—Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
- H01L2224/82896—Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces between electrically conductive surfaces, e.g. copper-copper direct bonding, surface activated bonding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- Evolutionary Computation (AREA)
- Computer Networks & Wireless Communication (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Structure intégrée tridimensionnelle comprenant au moins un premier substrat (S1, S3, S5) comportant des premiers composants (1) orientés selon au moins une première direction (D1), un deuxième substrat (S2, S4, S6) comportant des deuxièmes composants (1) orientés selon au moins une deuxième direction (D2) et au moins un niveau d'interconnexion (B1, B2, B3, B3, B) comportant des lignes électriquement conductrices (21, 22) s'étendant selon au moins une troisième direction (D3), la deuxième direction (D2) et/ou la troisième direction (D3) formant un angle non droit et non nul avec la première direction (D1) de sorte que deux points (4, 5, 16, 17, 19, 20) des premiers ou des deuxièmes composants soient reliés par une première liaison électrique (3, 11, 14, 15, 18) comportant au moins l'une des lignes électriquement conductrices.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1562785A FR3045869B1 (fr) | 2015-12-18 | 2015-12-18 | Routage ameliore pour structure integree tridimensionnelle |
US15/137,201 US10446535B2 (en) | 2015-12-18 | 2016-04-25 | Routing for three-dimensional integrated structures |
CN201610355354.7A CN106898598B (zh) | 2015-12-18 | 2016-05-25 | 用于三维集成结构的改善布线 |
CN201620488592.0U CN205845945U (zh) | 2015-12-18 | 2016-05-25 | 三维集成结构 |
DE102016109652.0A DE102016109652A1 (de) | 2015-12-18 | 2016-05-25 | Verbesserte Trassierung für dreidimensionale integrierte Struktur |
US16/562,963 US11251175B2 (en) | 2015-12-18 | 2019-09-06 | Routing for three-dimensional integrated structures |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1562785 | 2015-12-18 | ||
FR1562785A FR3045869B1 (fr) | 2015-12-18 | 2015-12-18 | Routage ameliore pour structure integree tridimensionnelle |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3045869A1 FR3045869A1 (fr) | 2017-06-23 |
FR3045869B1 true FR3045869B1 (fr) | 2020-02-07 |
Family
ID=55236802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1562785A Expired - Fee Related FR3045869B1 (fr) | 2015-12-18 | 2015-12-18 | Routage ameliore pour structure integree tridimensionnelle |
Country Status (4)
Country | Link |
---|---|
US (2) | US10446535B2 (fr) |
CN (2) | CN106898598B (fr) |
DE (1) | DE102016109652A1 (fr) |
FR (1) | FR3045869B1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3045869B1 (fr) * | 2015-12-18 | 2020-02-07 | Stmicroelectronics (Crolles 2) Sas | Routage ameliore pour structure integree tridimensionnelle |
FR3061602B1 (fr) * | 2017-01-02 | 2019-05-31 | Stmicroelectronics (Crolles 2) Sas | Systeme d'identification d'une puce 3d |
KR102672379B1 (ko) * | 2018-10-29 | 2024-06-04 | 도쿄엘렉트론가부시키가이샤 | 반도체 소자의 모놀리식 3d 집적을 위한 아키텍처 |
US11521676B2 (en) | 2020-04-30 | 2022-12-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | SRAM structure with asymmetric interconnection |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6774010B2 (en) * | 2001-01-25 | 2004-08-10 | International Business Machines Corporation | Transferable device-containing layer for silicon-on-insulator applications |
US7003752B2 (en) * | 2002-11-18 | 2006-02-21 | Cadence Design Systems, Inc. | Method and apparatus for routing |
JP3611561B2 (ja) * | 2002-11-18 | 2005-01-19 | 沖電気工業株式会社 | 半導体装置 |
JP2012064709A (ja) | 2010-09-15 | 2012-03-29 | Sony Corp | 固体撮像装置及び電子機器 |
FR2980917B1 (fr) | 2011-09-30 | 2013-09-27 | St Microelectronics Crolles 2 | Procede de realisation d'une liaison traversante electriquement conductrice |
US8674470B1 (en) | 2012-12-22 | 2014-03-18 | Monolithic 3D Inc. | Semiconductor device and structure |
US9941275B2 (en) * | 2012-12-29 | 2018-04-10 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US9379074B2 (en) | 2013-11-22 | 2016-06-28 | Invensas Corporation | Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects |
FR3045869B1 (fr) * | 2015-12-18 | 2020-02-07 | Stmicroelectronics (Crolles 2) Sas | Routage ameliore pour structure integree tridimensionnelle |
-
2015
- 2015-12-18 FR FR1562785A patent/FR3045869B1/fr not_active Expired - Fee Related
-
2016
- 2016-04-25 US US15/137,201 patent/US10446535B2/en active Active
- 2016-05-25 CN CN201610355354.7A patent/CN106898598B/zh active Active
- 2016-05-25 CN CN201620488592.0U patent/CN205845945U/zh active Active
- 2016-05-25 DE DE102016109652.0A patent/DE102016109652A1/de active Pending
-
2019
- 2019-09-06 US US16/562,963 patent/US11251175B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN106898598B (zh) | 2021-01-01 |
CN106898598A (zh) | 2017-06-27 |
US20170179104A1 (en) | 2017-06-22 |
DE102016109652A1 (de) | 2017-06-22 |
FR3045869A1 (fr) | 2017-06-23 |
CN205845945U (zh) | 2016-12-28 |
US20190393207A1 (en) | 2019-12-26 |
US11251175B2 (en) | 2022-02-15 |
US10446535B2 (en) | 2019-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
|
PLSC | Publication of the preliminary search report |
Effective date: 20170623 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
|
PLFP | Fee payment |
Year of fee payment: 4 |
|
PLFP | Fee payment |
Year of fee payment: 5 |
|
ST | Notification of lapse |
Effective date: 20210806 |