FR3037719B1 - Structure electronique sur support ceramique - Google Patents

Structure electronique sur support ceramique Download PDF

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Publication number
FR3037719B1
FR3037719B1 FR1555520A FR1555520A FR3037719B1 FR 3037719 B1 FR3037719 B1 FR 3037719B1 FR 1555520 A FR1555520 A FR 1555520A FR 1555520 A FR1555520 A FR 1555520A FR 3037719 B1 FR3037719 B1 FR 3037719B1
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France
Prior art keywords
electronic structure
ceramic support
ceramic
support
electronic
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Expired - Fee Related
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FR1555520A
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FR3037719A1 (fr
Inventor
Alain Straboni
Alioune Sow
GuoCai SUN
Jean-Baptiste Brette
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Stile
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Stile
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Priority to FR1555520A priority Critical patent/FR3037719B1/fr
Priority to PCT/FR2016/051484 priority patent/WO2016203175A1/fr
Publication of FR3037719A1 publication Critical patent/FR3037719A1/fr
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Publication of FR3037719B1 publication Critical patent/FR3037719B1/fr
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
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  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • Chemical & Material Sciences (AREA)
  • Photovoltaic Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR1555520A 2015-06-17 2015-06-17 Structure electronique sur support ceramique Expired - Fee Related FR3037719B1 (fr)

Priority Applications (2)

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FR1555520A FR3037719B1 (fr) 2015-06-17 2015-06-17 Structure electronique sur support ceramique
PCT/FR2016/051484 WO2016203175A1 (fr) 2015-06-17 2016-06-17 Structure electronique sur support ceramique

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FR1555520A FR3037719B1 (fr) 2015-06-17 2015-06-17 Structure electronique sur support ceramique
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FR1555520A (fr) 1967-05-03 1969-01-31
FR2953330B1 (fr) * 2009-11-27 2011-12-30 Tile S Module photovoltaique comportant des cellules photovoltaiques integrees
EP1811820B1 (fr) * 2004-11-12 2012-08-15 Tokuyama Corporation Procede de fabrication d'un substrat en nitrure d'aluminium metallise et substrat ainsi obtenu
FR2940520B1 (fr) 2008-12-22 2011-03-18 Tile S Structure semiconductrice
FR2944142B1 (fr) * 2009-04-02 2011-06-03 Tile S Structure electronique a couche epitaxiee sur silicium fritte
WO2013018357A1 (fr) * 2011-08-01 2013-02-07 日本特殊陶業株式会社 Module de puissance semi-conducteur, procédé de fabrication d'un module de puissance semi-conducteur, et carte de circuit imprimé

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WO2016203175A1 (fr) 2016-12-22
WO2016203175A4 (fr) 2017-03-23

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