FR3036228B1 - Procede de fabrication de circuits electriques pour diodes electro- luminescentes, circuit obtenu par ce procede et ecran d’affichage comportant un tel circuit - Google Patents

Procede de fabrication de circuits electriques pour diodes electro- luminescentes, circuit obtenu par ce procede et ecran d’affichage comportant un tel circuit Download PDF

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Publication number
FR3036228B1
FR3036228B1 FR1554304A FR1554304A FR3036228B1 FR 3036228 B1 FR3036228 B1 FR 3036228B1 FR 1554304 A FR1554304 A FR 1554304A FR 1554304 A FR1554304 A FR 1554304A FR 3036228 B1 FR3036228 B1 FR 3036228B1
Authority
FR
France
Prior art keywords
circuit
electro
display screen
electric circuits
manufacturing electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1554304A
Other languages
English (en)
Other versions
FR3036228A1 (fr
Inventor
Eric Eymard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linxens Holding SAS
Original Assignee
Linxens Holding SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linxens Holding SAS filed Critical Linxens Holding SAS
Priority to FR1554304A priority Critical patent/FR3036228B1/fr
Priority to PCT/FR2016/051142 priority patent/WO2016181089A1/fr
Priority to CN201680027816.0A priority patent/CN107624198B/zh
Priority to EP16731212.3A priority patent/EP3295493A1/fr
Publication of FR3036228A1 publication Critical patent/FR3036228A1/fr
Application granted granted Critical
Publication of FR3036228B1 publication Critical patent/FR3036228B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
FR1554304A 2015-05-13 2015-05-13 Procede de fabrication de circuits electriques pour diodes electro- luminescentes, circuit obtenu par ce procede et ecran d’affichage comportant un tel circuit Expired - Fee Related FR3036228B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR1554304A FR3036228B1 (fr) 2015-05-13 2015-05-13 Procede de fabrication de circuits electriques pour diodes electro- luminescentes, circuit obtenu par ce procede et ecran d’affichage comportant un tel circuit
PCT/FR2016/051142 WO2016181089A1 (fr) 2015-05-13 2016-05-13 Procédé de fabrication de circuits électriques pour diodes électro- luminescentes, circuit obtenu par ce procédé
CN201680027816.0A CN107624198B (zh) 2015-05-13 2016-05-13 制造用于发光二极管的电路的方法和由该方法得到的电路
EP16731212.3A EP3295493A1 (fr) 2015-05-13 2016-05-13 Procédé de fabrication de circuits électriques pour diodes électro- luminescentes, circuit obtenu par ce procédé

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1554304 2015-05-13
FR1554304A FR3036228B1 (fr) 2015-05-13 2015-05-13 Procede de fabrication de circuits electriques pour diodes electro- luminescentes, circuit obtenu par ce procede et ecran d’affichage comportant un tel circuit

Publications (2)

Publication Number Publication Date
FR3036228A1 FR3036228A1 (fr) 2016-11-18
FR3036228B1 true FR3036228B1 (fr) 2018-06-15

Family

ID=54065999

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1554304A Expired - Fee Related FR3036228B1 (fr) 2015-05-13 2015-05-13 Procede de fabrication de circuits electriques pour diodes electro- luminescentes, circuit obtenu par ce procede et ecran d’affichage comportant un tel circuit

Country Status (4)

Country Link
EP (1) EP3295493A1 (fr)
CN (1) CN107624198B (fr)
FR (1) FR3036228B1 (fr)
WO (1) WO2016181089A1 (fr)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5226723A (en) * 1992-05-11 1993-07-13 Chen Der Jong Light emitting diode display
DE10228634A1 (de) * 2002-06-26 2004-01-22 Osram Opto Semiconductors Gmbh Oberflächenmontierbare Miniatur-Lumineszenz-und/oder Photo-Diode und Verfahren zu deren Herstellung
EP1890186B1 (fr) * 2005-05-30 2014-01-15 Kyocera Corporation Dispositif d'affichage à cristaux liquides
JP4870826B2 (ja) * 2009-04-27 2012-02-08 株式会社エンプラス 発光装置、面光源装置、及び表示装置
DE102010010750A1 (de) * 2010-03-09 2011-09-15 Thomas Hofmann Multilayersubstrat mit flächigem Leuchtkörper
KR20150025231A (ko) * 2013-08-28 2015-03-10 서울반도체 주식회사 광원 모듈 및 그 제조 방법, 및 백라이트 유닛

Also Published As

Publication number Publication date
CN107624198B (zh) 2020-01-07
FR3036228A1 (fr) 2016-11-18
CN107624198A (zh) 2018-01-23
WO2016181089A1 (fr) 2016-11-17
EP3295493A1 (fr) 2018-03-21

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