PL3404818T3 - Półprzewodnikowy układ połączeń - Google Patents
Półprzewodnikowy układ połączeńInfo
- Publication number
- PL3404818T3 PL3404818T3 PL17171087T PL17171087T PL3404818T3 PL 3404818 T3 PL3404818 T3 PL 3404818T3 PL 17171087 T PL17171087 T PL 17171087T PL 17171087 T PL17171087 T PL 17171087T PL 3404818 T3 PL3404818 T3 PL 3404818T3
- Authority
- PL
- Poland
- Prior art keywords
- semiconductor circuit
- circuit assembly
- assembly
- semiconductor
- circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/08—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
- H02M1/088—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters for the simultaneous control of series or parallel connected semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Inverter Devices (AREA)
- Rectifiers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP17171087.4A EP3404818B1 (de) | 2017-05-15 | 2017-05-15 | Halbleiterschaltanordnung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3404818T3 true PL3404818T3 (pl) | 2020-06-29 |
Family
ID=58765679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL17171087T PL3404818T3 (pl) | 2017-05-15 | 2017-05-15 | Półprzewodnikowy układ połączeń |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11424690B2 (pl) |
| EP (1) | EP3404818B1 (pl) |
| CN (1) | CN110622407B (pl) |
| ES (1) | ES2780936T3 (pl) |
| PL (1) | PL3404818T3 (pl) |
| WO (1) | WO2018210506A1 (pl) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110503048B (zh) * | 2019-08-26 | 2020-07-17 | 中铁电气化局集团有限公司 | 刚性接触网悬挂装置的识别系统和方法 |
| DE102020118425A1 (de) | 2020-07-13 | 2022-01-13 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit einem ersten und einem zweiten Leistungshalbleitermodul und mit einer Gleichspannungsverschienung |
| DE102021203996A1 (de) | 2021-04-21 | 2022-10-27 | Siemens Mobility GmbH | Schaltungsanordnung für einen Stromrichter |
| DE102021205902A1 (de) | 2021-06-10 | 2022-12-15 | Robert Bosch Gesellschaft mit beschränkter Haftung | Modular gebildetes Leistungsmodul |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3851926B2 (ja) | 1996-07-22 | 2006-11-29 | ティーエム４・インコーポレイテッド | 直流電圧を交流電圧に変換するための漂遊接続インダクタンスの低い電力用変換モジュールおよびその方法 |
| US7042086B2 (en) | 2002-10-16 | 2006-05-09 | Nissan Motor Co., Ltd. | Stacked semiconductor module and assembling method of the same |
| JP4771972B2 (ja) | 2007-02-13 | 2011-09-14 | トヨタ自動車株式会社 | 電力変換装置 |
| WO2011061813A1 (ja) * | 2009-11-17 | 2011-05-26 | 三菱電機株式会社 | ３レベル電力変換装置 |
| CN101826837A (zh) * | 2010-06-12 | 2010-09-08 | 四川吉风电源科技有限公司 | 风力发电机变频控制功率模块 |
| US20140354042A1 (en) * | 2011-12-30 | 2014-12-04 | Gemeral Electric Company | Failure protection for a power delivery system |
| CN202856635U (zh) | 2012-08-24 | 2013-04-03 | 青岛航天半导体研究所有限公司 | 金属全密封三相桥式整流模块 |
| CN103986350B (zh) | 2014-05-23 | 2016-09-14 | 台达电子企业管理（上海）有限公司 | 五电平整流器 |
| CN106486458B (zh) | 2015-08-31 | 2019-03-15 | 台达电子企业管理（上海）有限公司 | 多功率芯片的功率封装模块及功率芯片单元的制造方法 |
| CN105355611A (zh) * | 2015-09-29 | 2016-02-24 | 特变电工新疆新能源股份有限公司 | 一种大容量水冷功率单元 |
| CN105374810A (zh) | 2015-11-23 | 2016-03-02 | 扬州国扬电子有限公司 | 一种功率模块 |
| CN106505876A (zh) * | 2016-12-21 | 2017-03-15 | 武汉东城新能源有限公司 | 一种h桥逆变电路的功率单元 |
-
2017
- 2017-05-15 EP EP17171087.4A patent/EP3404818B1/de active Active
- 2017-05-15 ES ES17171087T patent/ES2780936T3/es active Active
- 2017-05-15 PL PL17171087T patent/PL3404818T3/pl unknown
-
2018
- 2018-04-16 US US16/613,909 patent/US11424690B2/en active Active
- 2018-04-16 CN CN201880031454.1A patent/CN110622407B/zh active Active
- 2018-04-16 WO PCT/EP2018/059651 patent/WO2018210506A1/de active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| ES2780936T3 (es) | 2020-08-27 |
| US20210119551A1 (en) | 2021-04-22 |
| EP3404818B1 (de) | 2020-01-29 |
| US11424690B2 (en) | 2022-08-23 |
| EP3404818A1 (de) | 2018-11-21 |
| CN110622407B (zh) | 2021-08-10 |
| WO2018210506A1 (de) | 2018-11-22 |
| CN110622407A (zh) | 2019-12-27 |
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